Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
3.6 V |
100 |
CMOS |
77 |
2000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 5000 |
e3 |
217 MHz |
30 s |
77 |
260 °C (500 °F) |
14 mm |
||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
238 |
Yes |
3.6 V |
100 |
CMOS |
77 |
2000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
100 CLBS, 2000 Gates |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 5000 |
e3 |
217 MHz |
30 s |
77 |
260 °C (500 °F) |
14 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAXIMUM usable gates 10000 |
e0 |
166 MHz |
30 s |
112 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
466 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAXIMUM usable gates 10000 |
e3 |
217 MHz |
30 s |
112 |
260 °C (500 °F) |
20 mm |
||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
5.25 V |
400 |
CMOS |
160 |
7000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 20000 |
e0 |
125 MHz |
30 s |
160 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
950 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 20000 |
e3 |
250 MHz |
30 s |
160 |
245 °C (473 °F) |
28 mm |
||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.25 V |
576 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
125 MHz |
30 s |
196 |
240 °C (464 °F) |
14 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
196 |
10000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 30000 |
e0 |
217 MHz |
30 s |
196 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
196 |
10000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
576 CLBS, 10000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 30000 |
e0 |
217 MHz |
30 s |
196 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
113 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e3 |
217 MHz |
30 s |
113 |
260 °C (500 °F) |
20 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
113 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e3 |
250 MHz |
30 s |
113 |
260 °C (500 °F) |
20 mm |
||||
Xilinx |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
205 |
13000 |
3.3 |
3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Maximum usable gates 40000 |
e0 |
217 MHz |
30 s |
205 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
CMOS |
166 |
108904 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.8 ns |
600 CLBS, 108904 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
250 MHz |
30 s |
166 |
225 °C (437 °F) |
32 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
15552 |
Yes |
2.625 V |
3456 |
CMOS |
166 |
661111 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
3456 CLBS, 661111 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
333 MHz |
30 s |
166 |
225 °C (437 °F) |
32 mm |
||||||
|
Microchip Technology |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
1.575 V |
CMOS |
68 |
250000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
1.425 V |
.5 mm |
85 °C (185 °F) |
250000 Gates |
-20 °C (-4 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
68 |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
684 |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Tray |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Also Operates at 5 V supply |
e3 |
117 MHz |
30 s |
245 °C (473 °F) |
20 mm |
||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.2 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
13824 |
CMOS |
600000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
13824 CLBS, 600000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
38400 |
Yes |
1.575 V |
38400 |
CMOS |
147 |
1500000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
70 °C (158 °F) |
38400 CLBS, 1500000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
75264 |
Yes |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.5 |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
75264 CLBS, 3000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1536 |
Yes |
1.575 V |
CMOS |
71 |
60000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
1.425 V |
.5 mm |
85 °C (185 °F) |
60000 Gates |
-20 °C (-4 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
71 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1536 |
Yes |
1.575 V |
CMOS |
71 |
60000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
1.425 V |
.5 mm |
100 °C (212 °F) |
60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
71 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
684 |
Yes |
3.6 V |
684 |
CMOS |
104 |
14000 |
3.3 |
Tray |
3.3,3.3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
2.5 ns |
684 CLBS, 14000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Also Operates at 5 V supply |
e3 |
117 MHz |
104 |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tray |
Flatpack |
3 V |
.65 mm |
70 °C (158 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Also Operates at 5 V supply |
e3 |
94 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1232 |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
70 °C (158 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Also Operates at 5 V supply |
94 MHz |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
Tray |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
2.5 ns |
1890 CLBS, 36000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Also Operates at 5 V supply |
e3 |
91.8 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
Tray |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.5 ns |
1890 CLBS, 36000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also Operates at 5 V supply |
e3 |
91.8 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
2438 |
CMOS |
54000 |
3.3 |
Tray |
Flatpack, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.1 ns |
2438 CLBS, 54000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also Operates at 5 V supply |
e3 |
91 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
768 |
Yes |
2.75 V |
768 |
CMOS |
113 |
12000 |
2.5 |
Tray |
2.5,3.3/5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
70 °C (158 °F) |
1.7 ns |
768 CLBS, 12000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
8000 typical gates available |
e3 |
172 MHz |
113 |
20 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6036 |
Yes |
2.75 V |
6036 |
CMOS |
171 |
108000 |
2.5 |
Tray |
2.5,3.3/5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
6036 CLBS, 108000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
72000 typical gates available |
e3 |
250 MHz |
30 s |
171 |
245 °C (473 °F) |
28 mm |
|||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
20 s |
235 °C (455 °F) |
14 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
70 °C (158 °F) |
1536 CLBS, 60000 Gates |
-20 °C (-4 °F) |
Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
|||||||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.2 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
3072 CLBS, 125000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||
Microchip Technology |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.2 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
70 °C (158 °F) |
6144 CLBS, 250000 Gates |
-20 °C (-4 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
176 |
TFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.575 V |
1584 |
CMOS |
137 |
60000 |
1.5 |
1.2/1.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP176,.87SQ,16 |
Field Programmable Gate Arrays |
1.425 V |
.4 mm |
85 °C (185 °F) |
1584 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G176 |
3 |
1.2 mm |
20 mm |
No |
160 MHz |
137 |
20 mm |
||||||||||
|
Actel |
FPGA |
Industrial |
Gull Wing |
176 |
TFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.575 V |
1584 |
CMOS |
137 |
60000 |
1.5 |
1.2/1.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP176,.87SQ,16 |
Field Programmable Gate Arrays |
1.425 V |
.4 mm |
85 °C (185 °F) |
1584 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G176 |
1.2 mm |
20 mm |
No |
160 MHz |
137 |
20 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
3072 |
Yes |
2.7 V |
CMOS |
158 |
75000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
75000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
3072 |
Yes |
2.7 V |
CMOS |
107 |
75000 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
75000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
180 MHz |
30 s |
107 |
260 °C (500 °F) |
20 mm |
|||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8192 |
Yes |
2.7 V |
CMOS |
158 |
300000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 °C (257 °F) |
300000 Gates |
-55 °C (-67 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
21504 |
Yes |
2.7 V |
CMOS |
158 |
600000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
70 °C (158 °F) |
600000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.7 V |
128 |
CMOS |
41 |
3000 |
2.5 |
Flatpack, Low Profile, Fine Pitch |
QFP64,.47SQ,20 |
2.3 V |
.5 mm |
85 °C (185 °F) |
128 CLBS, 3000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
2000 typical gates available |
e3 |
30 s |
41 |
260 °C (500 °F) |
10 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1.2 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
547 |
Yes |
CMOS |
69 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
No |
69 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
1232 |
CMOS |
8000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
1232 CLBS, 8000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
65 MHz |
28 mm |
||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
295 |
Yes |
CMOS |
57 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
No |
57 |
|||||||||||||||||||||
Texas Instruments |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
451 |
Yes |
5.5 V |
451 |
CMOS |
83 |
2500 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
451 CLBS, 2500 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
66 MHz |
83 |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.