Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
FPGA |
Other |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8256 |
Yes |
1.25 V |
516 |
CMOS |
138 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
516 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
130 |
28 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
3.465 V |
107 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
133 MHz |
30 s |
107 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
2000 |
Yes |
3.15 V |
125 |
246 |
3 |
3/3.3 V |
Flatpack |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
125 °C (257 °F) |
125 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
246 |
20 mm |
||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.26 V |
176 |
CMOS |
68 |
50000 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.71 ns |
176 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
667 MHz |
30 s |
62 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
3.465 V |
CMOS |
80 |
2.5 |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
No |
e3 |
133 MHz |
80 |
|||||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
176 |
50000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
4.97 ns |
176 CLBS, 50000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
280 MHz |
20 mm |
|||||||||||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
25000 |
Yes |
3.15 V |
1563 |
360 |
3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
100 °C (212 °F) |
1563 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Also Operates at 3.3 V nominal supply |
360 |
20 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
1.26 V |
1000 |
CMOS |
100 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.494 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
435 MHz |
40 s |
100 |
260 °C (500 °F) |
20 mm |
|||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
4000 |
Yes |
3.15 V |
250 |
246 |
3 |
3/3.3 V |
Flatpack |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 °C (185 °F) |
250 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
246 |
20 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.6 V |
80 |
78 |
2.5 |
Tape and Reel |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
2.375 V |
.5 mm |
85 °C (185 °F) |
80 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
78 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
82 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
100 °C (212 °F) |
24624 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
472.5 MHz |
82 |
20 mm |
||||||||||
|
Intel |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
645 |
91 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
645 CLBS |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
91 |
20 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
1.5,1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
24576 CLBS, 1000000 Gates |
-55 °C (-67 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
|||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6864 |
Yes |
3.465 V |
114 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
114 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4032 |
Yes |
1.26 V |
448 |
CMOS |
68 |
200000 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.71 ns |
448 CLBS, 200000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
667 MHz |
30 s |
62 |
260 °C (500 °F) |
14 mm |
|||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
81 |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.26 V |
176 |
CMOS |
108 |
50000 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.71 ns |
176 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
101 |
260 °C (500 °F) |
20 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
154 |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
350 MHz |
30 s |
154 |
245 °C (473 °F) |
28 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
55 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
1.26 V |
79 |
1.2 |
Tray |
1.2 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
133 MHz |
79 |
14 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
78 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
80 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
78 |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
74 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
80 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
40 s |
74 |
260 °C (500 °F) |
14 mm |
|||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
97 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
0.61 ns |
896 CLBS, 400000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
630 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
1.26 V |
55 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
55 |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.26 V |
176 |
CMOS |
108 |
50000 |
1.2 |
1.2,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.71 ns |
176 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
101 |
260 °C (500 °F) |
20 mm |
|||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
39600 |
Yes |
1.25 V |
39600 |
CMOS |
128 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
39600 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
128 |
32 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
1.26 V |
55 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
55 |
14 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
3.465 V |
107 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
133 MHz |
30 s |
107 |
260 °C (500 °F) |
20 mm |
||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
148 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e3 |
472.5 MHz |
148 |
32 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
1.26 V |
79 |
1.2 |
Tray |
1.2 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
133 MHz |
30 s |
79 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
18752 |
Yes |
1.25 V |
1172 |
CMOS |
142 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
1172 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
Also requires 3.3 V supply |
e3 |
402.5 MHz |
126 |
32 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
3520 |
Yes |
1.26 V |
440 |
CMOS |
107 |
1.2 |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
7.3 ns |
440 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
133 MHz |
107 |
20 mm |
|||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Rectangular |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
82 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
472.5 MHz |
82 |
20 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
645 |
91 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
645 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
91 |
20 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
22320 |
Yes |
1.25 V |
1395 |
79 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
1395 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
79 |
20 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5000 |
Yes |
1.26 V |
625 |
CMOS |
100 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.494 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
435 MHz |
30 s |
100 |
260 °C (500 °F) |
20 mm |
||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
84 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
472.5 MHz |
84 |
20 mm |
||||||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
3.15 V |
500 |
250 |
3 |
3/3.3 V |
Flatpack |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
125 °C (257 °F) |
500 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
250 |
20 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
32 |
78 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
32 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
30 s |
78 |
260 °C (500 °F) |
14 mm |
|||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1.2 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2910 |
Yes |
1.575 V |
291 |
104 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
100 °C (212 °F) |
291 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
320 MHz |
104 |
20 mm |
||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.