Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
64 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e4 |
263 MHz |
60 |
14 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
92 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e3 |
263 MHz |
30 s |
92 |
260 °C (500 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
63 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
630 MHz |
30 s |
63 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
14 mm |
|||||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5136 |
Yes |
1.25 V |
5136 |
CMOS |
94 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 °C (185 °F) |
5136 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
94 |
20 mm |
|||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
|||||||||||||||
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2910 |
Yes |
1.575 V |
291 |
104 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
100 °C (212 °F) |
291 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
320 MHz |
104 |
20 mm |
|||||||||||
|
Intel |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
22320 |
Yes |
1.03 V |
1395 |
79 |
1 |
1,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
1395 CLBS |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
362 MHz |
79 |
20 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
9216 |
CMOS |
400000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
9216 CLBS, 400000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
1.575 V |
CMOS |
68 |
250000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
1.425 V |
.5 mm |
100 °C (212 °F) |
250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
68 |
14 mm |
||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
97 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
0.61 ns |
896 CLBS, 400000 Gates |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
630 MHz |
97 |
20 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
392 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
85 °C (185 °F) |
392 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
1539 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
85 °C (185 °F) |
1539 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6864 |
Yes |
1.26 V |
114 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
114 |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
17000 |
Yes |
1.26 V |
2125 |
CMOS |
146 |
1.2 |
1.2,1.2/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.494 ns |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
435 MHz |
40 s |
146 |
245 °C (473 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
630 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
|||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
392 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
125 °C (257 °F) |
392 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||||||||
|
Microchip Technology |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
1.575 V |
6144 |
CMOS |
AEC-Q100 |
68 |
250000 |
1.5 |
1.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
30 s |
68 |
260 °C (500 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
97 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
630 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2880 |
Yes |
2.75 V |
2880 |
CMOS |
174 |
48000 |
2.5 |
2.5,3.3/5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
2880 CLBS, 48000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
32000 typical gates available |
e3 |
238 MHz |
30 s |
174 |
245 °C (473 °F) |
28 mm |
||||
|
Microsemi |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
2880 |
Yes |
2.75 V |
2880 |
CMOS |
174 |
48000 |
2.5 |
2.5,3.3/5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
2880 CLBS, 48000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
32000 typical gates available |
e3 |
238 MHz |
30 s |
174 |
245 °C (473 °F) |
28 mm |
||||
Intel |
FPGA |
Other |
Gull Wing |
240 |
FQFP |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
160 |
1.2 |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
472.5 MHz |
160 |
32 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6060 |
Yes |
1.26 V |
84 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
1.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
MATTE TIN |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
40 s |
84 |
250 °C (482 °F) |
20 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
66 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
240 CLBS, 100000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
55 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
963 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
100 °C (212 °F) |
963 CLBS |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
3.15 V |
500 |
250 |
3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
125 °C (257 °F) |
500 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
Also Operates at 3.3 V nominal supply |
250 |
20 mm |
||||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
56320 |
Yes |
2.7 V |
CMOS |
158 |
1000000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.25 V |
392 |
91 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
125 °C (257 °F) |
392 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
91 |
20 mm |
||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.03 V |
392 |
91 |
1 |
1,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
85 °C (185 °F) |
392 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
362 MHz |
91 |
20 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
720 |
Yes |
3.465 V |
720 |
CMOS |
100 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.44 ns |
720 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
375 MHz |
40 s |
100 |
260 °C (500 °F) |
20 mm |
||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
75264 |
Yes |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
70 °C (158 °F) |
75264 CLBS, 3000000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
147 |
245 °C (473 °F) |
28 mm |
|||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
963 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
125 °C (257 °F) |
963 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
24624 |
Yes |
1.03 V |
1539 |
150 |
1 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
.97 V |
.5 mm |
100 °C (212 °F) |
1539 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
-40 to 125 °C range is available as extended industrial |
150 |
20 mm |
||||||||||||||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
25000 |
Yes |
3.15 V |
1563 |
360 |
3 |
3/3.3 V |
Flatpack |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
125 °C (257 °F) |
1563 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
360 |
20 mm |
|||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
40000 |
Yes |
3.15 V |
2500 |
500 |
3 |
Flatpack |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
85 °C (185 °F) |
2500 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Also Operates at 3.3 V nominal supply |
500 |
20 mm |
|||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
24576 |
CMOS |
1000000 |
1.5 |
Tray |
Flatpack, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
350 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
2.7 V |
CMOS |
158 |
150000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
150000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e3 |
180 MHz |
30 s |
158 |
245 °C (473 °F) |
28 mm |
||||||
Intel |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5136 |
Yes |
1.25 V |
5136 |
CMOS |
94 |
1.2 |
1.2/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
5136 CLBS |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
94 |
20 mm |
|||||||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
22320 |
Yes |
1.25 V |
1395 |
79 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
1395 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
79 |
20 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
2112 |
Yes |
3.465 V |
79 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
79 |
14 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6000 |
Yes |
1.26 V |
750 |
90 |
1.2 |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.331 ns |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
357 MHz |
40 s |
90 |
260 °C (500 °F) |
20 mm |
||||||||
Efinix |
FPGA |
Gull Wing |
144 |
Square |
Plastic/Epoxy |
7384 |
Yes |
1.25 V |
97 |
1.2 |
1.15 V |
85 °C (185 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
97 |
||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Intel |
FPGA |
Automotive |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
1539 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
125 °C (257 °F) |
1539 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.