J Bend Field Programmable Gate Arrays (FPGA) 963

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4008E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		6000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	324 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 8000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2018-33PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	33 MHz	30 s	74	225 °C (437 °F)
XC4003A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS	61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC4003E-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm		1.6 ns	100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3190-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3030-100PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3030-70PC44CSPC0104	Xilinx	FPGA	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	70 °C (158 °F)	9 ns	100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.318 mm	16.5862 mm	No	MAX 34 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				16.5862 mm
XC4010D-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		8000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e3		30 s		245 °C (473 °F)	29.3116 mm
XC5210-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC3142A-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	270 MHz	30 s		245 °C (473 °F)	29.3116 mm
5962-01-394-9044	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes			CMOS	70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J84				No			70 MHz		70
XC4003E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XCS10-3PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	196			3000	5		Chip Carrier			4.5 V	1.27 mm			196 CLBS, 3000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3					29.3116 mm
XC3330-100PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Quad	S-PQCC-J68				No			100 MHz		58
XC3064A-7PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	224	CMOS		3500	5		Chip Carrier			4.5 V	1.27 mm		5.1 ns	224 CLBS, 3500 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 4500 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC2064-50PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	600	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	15 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 58 I/OS; 122 flip-flops; typical gates = 600 - 1000	e0	50 MHz		58	225 °C (437 °F)	24.2316 mm
XC3142A-4PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	144	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm		3.3 ns	144 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	227 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3064-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	100 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC5402L-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes						3.3		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3164A-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		3.3 ns	224 CLBS, 3500 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	227 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4010XL-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3195-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes	5.5 V	484	CMOS	70	6500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000	e0	230 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC5210-6PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4405-3PC84C	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3130A-5PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Typical gates = 1500-2000	e0	188 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC4006-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	608	Yes	5.5 V	256	CMOS	61	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	256 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	768 flip-flops; typical gates = 5000-6000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3030A-6PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	135 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4002XL-09PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes			CMOS	64		3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm					Tin Lead	Quad	S-PQCC-J84	3			No		e0	217 MHz	30 s	64	225 °C (437 °F)
XC2018-70PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	10 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	174 flip-flops; typical gates = 1000-1500	e0	70 MHz		58		24.2316 mm
XC4004A-4PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	61	3200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	4 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3200 - 4000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC3020-70PC68CSPC0107	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500	e0	70 MHz				24.2316 mm
XC4003-7PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes			CMOS	61		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	61	225 °C (437 °F)
XC5202-5PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm		4.6 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4002XL-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-3000	e0	217 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3130-3PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	58		5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0			58
XC3195A-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	484	CMOS		6500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 7500 Logic gates	e3	227 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3090-50PC84ISPC0107	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS		9000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 70 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				29.3116 mm
XC4005-7PC84C	Xilinx	FPGA	Commercial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes			CMOS	112		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	110 MHz	30 s	112	225 °C (437 °F)
XC3142A-4PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	227 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3042-50PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	74	4200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		144 CLBS, 4200 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 480 flip-flops	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4010E-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3130-3PC68C	Xilinx	FPGA	Commercial	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	2000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700		270 MHz		58		24.2316 mm
XC6209-2PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	2304	Yes	5.5 V	2304	CMOS		9000	5		Chip Carrier			4.5 V	1.27 mm	100 °C (212 °F)	3 ns	2304 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	2304 flip-flops; typical gates = 9000-13000	e0	111 MHz				29.3116 mm
XC3120-2PC68I	Xilinx	FPGA		J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		1000	5		Chip Carrier			4.5 V	1.27 mm		2.2 ns	64 CLBS, 1000 Gates			Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		323 MHz				24.2316 mm
XC4010E-2PCG84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	400	CMOS		7000	5		Chip Carrier			4.5 V	1.27 mm		1.6 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 10000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4310-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC4303-4PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes			CMOS			5		Chip Carrier				1.27 mm						Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No							29.3116 mm
XC3164A-3PC84I	Xilinx	FPGA		J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm		2.7 ns	224 CLBS, 3500 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	270 MHz	30 s	70	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.