No Lead Field Programmable Gate Arrays (FPGA) 499

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5ASXFB3E6F35I5

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5ASXBB5H6F40C5

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXFB3E6F31C4

Altera

FPGA

Other

No Lead

896

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5ASXBB5G6F40C4

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXBB5D6F31C4

Altera

FPGA

Other

No Lead

896

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5ASXBB3G6F35C6

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5AGZME3K2F35I3LN

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

360000

Yes

1.18 V

13584

TSMC

414

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

13584 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

414

35 mm

5ASXBB3G6F31I5

Altera

FPGA

Industrial

No Lead

896

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5ASXFB5D6F31C5

Altera

FPGA

Other

No Lead

896

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5ASXBB5D6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXMB3G6F40C5

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXMB3E6F35C6

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5ASXBB5E6F40C5

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXFB5G6F31I3

Altera

FPGA

Industrial

No Lead

896

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

250

1.15

Grid Array

BGA896,30X30,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5ASXBB3H6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

TSMC

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXFB5H6F35I3

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5ASXMB3H6F40C4

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXMB5G6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXFB5E6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

TSMC

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.