No Lead Field Programmable Gate Arrays (FPGA) 499

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO2-256HC-4SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	3	.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO2-640HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			640	Yes	3.6 V	80			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
ICE40UP5K-SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			5280	Yes	1.26 V	660	CMOS		39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
ICE40UP5K-SG48ITR50	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			5280	Yes	1.26 V	660	CMOS		39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
LCMXO2-256HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	3	.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO2-256HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO2-256HC-5SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
ICE40LP384-SG32	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			384	Yes	1.26 V	48	CMOS		21		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm						21		5 mm
LCMXO2-1200HC-6SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
ICE40UP5K-SG48ITR	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			5280	Yes	1.26 V	660	CMOS		39		1.2	Tape and Reel		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,20		1.14 V	.5 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm					30 s	39	260 °C (500 °F)	7 mm
LCMXO2-256ZE-2SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32			21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LCMXO2-1200HC-4SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-640HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			640	Yes	3.6 V	80			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256ZE-1SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32			21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LCMXO2-256ZE-1SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32			21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
ICE40LP384-SG32TR1K	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square				Yes	1.26 V	48	CMOS				1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3				260 °C (500 °F)	5 mm
ICE40LP384-SG32TR	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			384	Yes	1.26 V	48	CMOS		21		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3			21	260 °C (500 °F)	5 mm
LCMXO2-256HC-4SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			256	Yes	3.6 V	32			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256ZE-2SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32			21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
LCMXO2-256HC-4SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			256	Yes	3.6 V	32			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO2-256HC-6SG32I	Lattice Semiconductor	FPGA		No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)		32 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO2-256ZE-3SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	1.26 V	32			21		1.2	Tray	1.2 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No					21		5 mm
A3P030-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HQCCN	Square				Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N48	3		6 mm	No		e3		30 s		260 °C (500 °F)	6 mm
LIFCL-17-7SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square			17000	Yes	1.05 V				22		1			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm					30 s	22	260 °C (500 °F)	10 mm
AGLN010V2-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HVQCCN	Square				Yes	1.575 V	260	CMOS			10000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No							6 mm
LCMXO2-4000HC-6QN84I	Lattice Semiconductor	FPGA	Industrial	No Lead	84	HVQCCN	Square		Plastic/Epoxy	4320	Yes	3.6 V				68		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC84,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-N84	3	.95 mm	7 mm		Also Operates at 3.3 V nominal supply	e3			68	260 °C (500 °F)	7 mm
LCMXO2-1200HC-4SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm		Also Operates at 3.3 V nominal supply				21		5 mm
AGLN020V5-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square				Yes	1.575 V	520	CMOS			20000	1.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
LCMXO2-1200HC-5SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
LCMXO2-1200HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
A3PN010-QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HVQCCN	Square			260	Yes	1.575 V		CMOS		34	10000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,16		1.425 V	.4 mm	100 °C (212 °F)		10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No					34		6 mm
A3PN010-QNG48	Microchip Technology	FPGA	Other	No Lead	48	HVQCCN	Square			260	Yes	1.575 V		CMOS		34	10000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.24SQ,16		1.425 V	.4 mm	85 °C (185 °F)		10000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N48	3	1 mm	6 mm	No					34		6 mm
LCMXO2-1200HC-5SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			1280	Yes	3.6 V	160			21		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		2.375 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm		Also Operates at 3.3 V nominal supply				21	260 °C (500 °F)	5 mm
A3PN010-1QNG48I	Microchip Technology	FPGA	Industrial	No Lead	48	HQCCN	Square				Yes	1.575 V	260	CMOS			10000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N48	3		6 mm	No							6 mm
LCMXO2-256HC-6SG32C	Lattice Semiconductor	FPGA	Other	No Lead	32	HVQCCN	Square			256	Yes	3.465 V	32			21		2.5	Tray	2.5/3.3 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N32		.6 mm	5 mm	No	Also Operates at 3.3 V nominal supply				21		5 mm
LCMXO3D-9400HC-6SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square			9400	Yes	3.465 V	1175			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LIFCL-17-8SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square			17000	Yes	1.05 V				22		1			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm					30 s	22	260 °C (500 °F)	10 mm
AGLN010V2-QNG48	Microchip Technology	FPGA	Other	No Lead	48	HVQCCN	Square				Yes	1.575 V	260	CMOS			10000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	6 mm	No		e3		30 s		260 °C (500 °F)	6 mm
A3P030-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square				Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
RT3PE3000L-1LG484E	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	38535V;38534K;883S	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
RT3PE3000L-LG484B	Microchip Technology	FPGA	Military	No Lead	484	LGA	Square			75264	Yes	1.575 V	75264	CMOS	MIL-STD-883 Class B	341	3000000	1.2		1.2/1.5,1.2/3.3 V	Grid Array	LGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)		Bottom	S-XBGA-N484		3.83 mm	23 mm	No			250 MHz		341		23 mm
LIFCL-40-7SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square			39000	Yes	1.05 V	9750	FDSOI		22		1			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm						22		10 mm
LCMXO3D-9400HC-5SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square			9400	Yes	3.465 V	1175			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LIFCL-17-9SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square			17000	Yes	1.05 V				22		1			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72	3	.9 mm	10 mm					30 s	22	260 °C (500 °F)	10 mm
RT4G150-LG1657B	Microchip Technology	FPGA		No Lead	1657	LGA	Square	100k Rad(Si)	Ceramic, Metal-Sealed Cofired	151824	Yes	1.26 V			MIL-STD-883 Class B	720		1.2			Grid Array	LGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-CBGA-N1657		3.51 mm	42.5 mm						720		42.5 mm
A3P030-1QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square				Yes	1.575 V	768	CMOS			30000	1.5	Tray		Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
AGLN020V2-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square				Yes	1.575 V	520	CMOS			20000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
LCMXO2-640HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square			640	Yes	3.6 V	80			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.