No Lead Field Programmable Gate Arrays (FPGA) 499

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	No. of Outputs	Length
5ASXFB3H6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXMB3G6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXMB5G6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB3G6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXFB3D6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXMB3G6F35C6	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXBB5E6F35I3	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	385	1.15	Grid Array	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5AGZME7E3F40I3LN	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	674	1.15	Grid Array	BGA1517,39X39,40	1.12 V	1 mm	100 °C (212 °F)	16980 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	674	40 mm
5AGZME3E3F29I3LN	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC	342	1.15	Grid Array	BGA780,28X28,40	1.12 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3.6 mm	33 mm	342	33 mm
5ASXFB5E6F40C4	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5ASXMB3D6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5H6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
EP4CGX15CN11C7	Altera	FPGA	Other	No Lead	148	VQCCN	Square			Yes	1.25 V				1.2	Chip Carrier, Very Thin Profile		1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Quad	S-XQCC-N148	.8 mm	11 mm		11 mm
5AGZME7H3F40I3LN	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	674	1.15	Grid Array	BGA1517,39X39,40	1.12 V	1 mm	100 °C (212 °F)	16980 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	674	40 mm
5AGZME1H3F29I3L	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	220000	Yes	1.18 V	8302	TSMC	342	1.15	Grid Array	BGA780,28X28,40	1.12 V	1 mm	100 °C (212 °F)	8302 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3.6 mm	33 mm	342	33 mm
5ASXBB3D6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207		250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5D6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5H6F35C5	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXBB5H6F35I3	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	385	1.15	Grid Array	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXBB5E6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5AGZME7H3F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	534	1.15	Grid Array	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	16980 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	534	35 mm
5ASXBB5G6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5E6F31C6	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXMB5H6F35C6	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5AGZME3E2F29I3L	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC	342	1.15	Grid Array	BGA780,28X28,40	1.12 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3.6 mm	33 mm	342	33 mm
5ASXMB3E6F35C5	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXBB3D6F40C5	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5AGZME1K3F35I3L	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	220000	Yes	1.18 V	8302	TSMC	414	1.15	Grid Array	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	8302 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	414	35 mm
EP4CGX15DN11C8N	Altera	FPGA	Other	No Lead	148	VQCCN	Square			Yes	1.25 V				1.2	Chip Carrier, Very Thin Profile		1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Quad	S-XQCC-N148	.8 mm	11 mm		11 mm
5ASXFB3E6F31C6	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5G6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXFB5D6F40C4	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5ASXFB5E6F40C5	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5ASXMB5H6F40C4	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5ASXFB5H6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434		250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXMB5H6F40C5	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
EP4CGX15BN11C7	Altera	FPGA	Other	No Lead	148	VQCCN	Square			Yes	1.25 V				1.2	Chip Carrier, Very Thin Profile		1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)	Quad	S-XQCC-N148	.8 mm	11 mm		11 mm
5ASXMB3D6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1	Grid Array	BGA1517,39X39,40	1.07 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1517	2.7 mm	40 mm	540	40 mm
5ASXMB5H6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXBB3D6F35I5	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXFB5D6F31C6	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXBB5H6F35C6	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXBB5E6F31C6	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1	Grid Array	BGA896,30X30,40	1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5AGZME3E2F29I3LN	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC	342	1.15	Grid Array	BGA780,28X28,40	1.12 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3.6 mm	33 mm	342	33 mm
5ASXFB5E6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXBB3G6F31I3	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	250	1.15	Grid Array	BGA896,30X30,40	1.12 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B896	2.7 mm	31 mm	250	31 mm
5ASXMB3D6F35I5	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm
5ASXMB5E6F35I5	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		385	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	385	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.