No Lead Field Programmable Gate Arrays (FPGA) 499

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A3P030-QNG48	Microchip Technology	FPGA	Commercial	No Lead	48	HQCCN	Square			Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug			1.425 V	.4 mm	85 °C (185 °F)		768 CLBS, 30000 Gates	0 °C (32 °F)		Quad	S-XQCC-N48	3		6 mm	No			350 MHz				6 mm
AGLN020V5-QNG68	Microchip Technology	FPGA	Other	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS			20000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	70 °C (158 °F)		520 CLBS, 20000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
LCMXO2-256HC-6SG48C	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		256	Yes	3.6 V	32			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO3D-9400ZC-3SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
RTAX2000S-1LG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	0.95 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
RTAX2000S-LG624E	Microsemi	FPGA	Military	No Lead	624	LGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
RTAX2000SLG624E	Microchip Technology	FPGA	Military	No Lead	624	LGA	Square	Ceramic, Metal-Sealed Cofired	32256	Yes	1.575 V	21504	CMOS	MIL-STD-883 Class S (Modified)	684	2000000	1.5		1.5,1.5/3.3,2.5/3.3 V	Grid Array	LGA624,25X25,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	125 °C (257 °F)	1.11 ns	21504 CLBS, 2000000 Gates	-55 °C (-67 °F)		Bottom	S-CBGA-N624		2.96 mm	32.5 mm	No	250000 ASIC gates also available				684		32.5 mm
LCMXO3D-4300HC-5SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	7 ns	537 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO2-1200ZE-1SG32I	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		1280	Yes	1.26 V	160			21		1.2	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC32,.2SQ,20		1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32	1	1 mm	5 mm						21	260 °C (500 °F)	5 mm
LCMXO2-4000HC-6QN84C	Lattice Semiconductor	FPGA	Other	No Lead	84	HVQCCN	Square	Plastic/Epoxy	4320	Yes	3.6 V				68		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC84,.27SQ,20		2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQCC-N84	3	.95 mm	7 mm		Also Operates at 3.3 V nominal supply	e3			68	260 °C (500 °F)	7 mm
LCMXO3D-4300HC-6SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	537 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO2-640HC-6SG48I	Lattice Semiconductor	FPGA		No Lead	48	HVQCCN	Square		640	Yes	3.6 V	80			40		2.5	Tray		Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC48,.27SQ,20		2.375 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N48	3	1 mm	7 mm		Also Operates at 3.3 V nominal supply				40	260 °C (500 °F)	7 mm
LCMXO3D-4300HC-6SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		4300	Yes	3.465 V	537			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	6.7 ns	537 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3D-9400ZC-2SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3D-9400ZC-2SG72I	Lattice Semiconductor	FPGA	Industrial	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175			58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LIFCL-40-9SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		39000	Yes	1.05 V	9750	FDSOI		22		1			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm						22		10 mm
A3P030-1QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	768	CMOS			30000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	100 °C (212 °F)		768 CLBS, 30000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
M38510/60711BZX	Texas Instruments	FPGA	Military	No Lead	180	QCCN	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5			Chip Carrier			4.5 V		125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQCC-N180				No
M38510/60708BZX	Texas Instruments	FPGA	Military	No Lead	180	QCCN	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			8000	5			Chip Carrier			4.5 V		125 °C (257 °F)		8000 Gates	-55 °C (-67 °F)		Quad	S-CQCC-N180				No
DS28EL25Q+U	Maxim Integrated	FPGA	Industrial	No Lead	6	SON	Rectangular	Plastic		Yes							1.8		1.8 V	Small Outline	SOLCC6,.11,37	Field Programmable Gate Arrays		.95 mm	85 °C (185 °F)			-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-N6	1			No		e3		30 s		260 °C (500 °F)
5AGZME7E3F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC		534		1.15			Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		16980 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						534		35 mm
5ASXBB5E6F40I3	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC		540		1.15			Grid Array	BGA1517,39X39,40		1.12 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB5D6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB3E6F31C5	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207			250		1.1			Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5ASXBB3E6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5ASXBB3D6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207			385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5AGZME5K2F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	400000	Yes	1.18 V	15096	TSMC		534		1.15			Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		15096 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						534		35 mm
5AGZME3E3F29I3L	Altera	FPGA	Industrial	No Lead	780	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC		342		1.15			Grid Array	BGA780,28X28,40		1.12 V	1 mm	100 °C (212 °F)		13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
5ASXBB5D6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434			540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB3D6F40I3	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC		540		1.15			Grid Array	BGA1517,39X39,40		1.12 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB3E6F40I3	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207			540		1.15			Grid Array	BGA1517,39X39,40		1.12 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXBB5E6F40C6	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXBB5H6F35C5	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5ASXMB3H6F40C6	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXBB3G6F40C5	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXFB5E6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		250		1.1			Grid Array	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5ASXBB5G6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
EP4CGX15BN11I7	Altera	FPGA		No Lead	148	VQCCN	Square			Yes	1.25 V						1.2			Chip Carrier, Very Thin Profile			1.15 V	.5 mm						Quad	S-XQCC-N148		.8 mm	11 mm								11 mm
5ASXMB3H6F31C5	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		250		1.1			Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
EP4CGX15CN11C8	Altera	FPGA	Other	No Lead	148	VQCCN	Square			Yes	1.25 V						1.2			Chip Carrier, Very Thin Profile			1.15 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-XQCC-N148		.8 mm	11 mm								11 mm
5ASXMB5D6F40C6	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB5H6F40C6	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
5ASXMB3E6F31I5	Altera	FPGA	Industrial	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207			250		1.1			Grid Array	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5ASXBB5E6F35C6	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5ASXFB3H6F35C5	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207			385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5ASXBB5E6F35I5	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		385		1.1			Grid Array	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
5ASXFB3D6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC		250		1.1			Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5ASXFB5E6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC		540		1.1			Grid Array	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.