Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7S6-2CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
EP3C5E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	94		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)		5136 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3			94		20 mm
XC7S25-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		150		15 mm
XC7S50-L1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		100		0.95			Grid Array	BGA196,14X14,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3			100		15 mm
XC7S25-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150		0.95			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		150		13 mm
10M16SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
XC7A35T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
M1A3P250-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s		245 °C (473 °F)	28 mm
A3P250-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
10M04SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		250 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
A3P1000-FGG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	17 mm
XC6SLX45-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7A50T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
10M08SAM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
A3P250-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	350 MHz	30 s		260 °C (500 °F)	14 mm
M1A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
10M08SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	250	260 °C (500 °F)	11 mm
XC7S6-1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
10M25SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563		360		3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				360		20 mm
EP3C40U484I7	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	331		1.2			Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.05 mm	19 mm	No		e0	472.5 MHz		331		19 mm
M1A3P250-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
XC7A15T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7S50-2CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1286 MHz		250		15 mm
ICE40HX1K-CB132	Lattice Semiconductor	FPGA	Industrial	Ball	132	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	95		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1 mm	8 mm	No		e1	133 MHz	30 s	95	260 °C (500 °F)	8 mm
ICE40LP384-SG32	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		384	Yes	1.26 V	48	CMOS	21		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)		Quad	S-XQCC-N32		1 mm	5 mm						21		5 mm
EP3C25E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	82		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		82		20 mm
ICE40HX4K-CB132	Lattice Semiconductor	FPGA	Industrial	Ball	132	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	95	3520	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1 mm	8 mm	No		e1	133 MHz	30 s	95	260 °C (500 °F)	8 mm
10M02SCM153I7G	Intel	FPGA	Industrial	Ball	153	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246		3		3/3.3 V	Grid Array	BGA153,15X15,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm	No	Also Operates at 3.3 V nominal supply				246		8 mm
XC7A50T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
ICE40LP4K-CM81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm	No		e1	133 MHz	30 s	63	260 °C (500 °F)	4 mm
M2GL050-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V		CMOS	207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
XC3S200A-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	68	200000	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	667 MHz	30 s	62	260 °C (500 °F)	14 mm
XC7S6-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1286 MHz		100		13 mm
ICE40LP1K-CM36	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA36,6X6,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm	No		e1	133 MHz		25	260 °C (500 °F)	2.5 mm
XC7A12T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7S75-1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		400		23 mm
EP3C55F484I7N	Intel	FPGA	Industrial	Ball	484	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	327		1.2			Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.6 mm	23 mm	No		e1	472.5 MHz		327		23 mm
XC6SLX45-3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	316		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	316	250 °C (482 °F)	23 mm
XC7S25-2FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1286 MHz		150		15 mm
XC6SLX45-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	218		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.21 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	218	260 °C (500 °F)	15 mm
XC3S50AN-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	667 MHz	30 s	101	260 °C (500 °F)	20 mm
XC7S15-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1286 MHz		100		13 mm
A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s		245 °C (473 °F)	28 mm
ICE40LP4K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93		1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No		e1	133 MHz		93	260 °C (500 °F)	5 mm
EP3C10F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	182	260 °C (500 °F)	17 mm
A3P1000-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	350 MHz	30 s		250 °C (482 °F)	23 mm
M7A3P1000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	154	1000000	1.5	Tray		Flatpack, Fine Pitch			1.425 V	.5 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G208	3	4.1 mm	28 mm	No			350 MHz	30 s	154	245 °C (473 °F)	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.