Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7S50-L1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array	BGA484,22X22,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
10CL120YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	119088	Yes	1.25 V	7443		277		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						277		23 mm
10M08DAF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			250		17 mm
XC7S75-1FGGA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	76800	Yes	1.05 V	6000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	6000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
ICE40LP384-SG32TR1K	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square			Yes	1.26 V	48	CMOS			1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)		48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3				260 °C (500 °F)	5 mm
XC7A75T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
10M25DAF256I7G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			360		17 mm
M2GL025-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC7A50T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e8	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
10CL120YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443				1.2			Grid Array			1.15 V	1 mm	100 °C (212 °F)		7443 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
XC7A100T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7S50-1FGGA484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1098 MHz		250		23 mm
10CL080YF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	81264	Yes	1.25 V	5079		289		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm						289		23 mm
ICE40LP384-SG32TR	Lattice Semiconductor	FPGA	Industrial	No Lead	32	HVQCCN	Square		384	Yes	1.26 V	48	CMOS	21		1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-XQCC-N32	3	1 mm	5 mm			e3			21	260 °C (500 °F)	5 mm
XC7A50T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A100T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	210		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm				1098 MHz		210		15 mm
10M50SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500		3			Flatpack	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				500		20 mm
M1A3P1000-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
10CL006YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
XC7A100T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	17 mm
10CL025YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
XC7A12T-2CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
M7A3P1000-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	177	1000000	1.5	Tray		Grid Array			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No			350 MHz		177		17 mm
EP3C120F780I7N	Intel	FPGA	Industrial	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		119088 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	531	260 °C (500 °F)	29 mm
XC7A100T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925		300		0.95			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC7S15-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		100		13 mm
10CL080YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes		5079				1.2			Grid Array, Fine Pitch				.8 mm	100 °C (212 °F)		5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.2 mm	19 mm								19 mm
EP3C25F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		24624 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz	30 s	156	260 °C (500 °F)	17 mm
A3PE1500-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	38400	Yes	1.575 V	38400	CMOS	147	1500000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		38400 CLBS, 1500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
ICE40HX8K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2GL060-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm					30 s		260 °C (500 °F)	17 mm
XC7A50T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7S50-L1CSGA324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		1.5 mm	15 mm			e1	1098 MHz		250		15 mm
XC6SLX25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	190		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
LFD2NX-40-7BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	92		1						.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
10M25DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
ICE40HX4K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
XC7A15T-2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
MPF100T-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
EP3C40F324I7N	Intel	FPGA	Industrial	Ball	324	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	195		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B324	3	2.2 mm	19 mm	No		e1	472.5 MHz		195		19 mm
XCKU035-2FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No		e1		30 s	520	245 °C (473 °F)	31 mm
A40MX04-PLG68I	Microchip Technology	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	547	CMOS		6000	3.3	Tube		Chip Carrier			3 V	1.27 mm	85 °C (185 °F)	2.7 ns	547 CLBS, 6000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	3	4.572 mm	24.2316 mm	No	Also Operates at 5 V supply		80 MHz				24.2316 mm
XC6SLX150T-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	396	250 °C (482 °F)	27 mm
XC7K325T-2FFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25475 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1818 MHz	30 s	400	250 °C (482 °F)	27 mm
EP3C16F256I7N	Intel	FPGA	Industrial	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		15408 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
ICE40UP5K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	660	CMOS			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm					30 s		260 °C (500 °F)	2.537 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.