100 Field Programmable Gate Arrays (FPGA) 1,239

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5962-8994801MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3020-125PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	125 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3020-70CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500		70 MHz				19.05 mm
XC3042-50CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	144	CMOS			4200	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC4303-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC4002XL-2PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1600 Logic gates	e0	179 MHz	30 s	64	225 °C (437 °F)	20 mm
XC2018LVQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	100	CMOS			1500	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		100 CLBS, 1500 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G100		1.32 mm	14 mm	No	MAX 74 I/OS; 1200 to 1500 available gates						14 mm
XC4003-6PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS		77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	225 °C (437 °F)	20 mm
XC3120-5PQ100M	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800	e0	190 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3042-100TQ100C	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		82	2000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.7 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz	30 s	82	225 °C (437 °F)	14 mm
XCS20XL-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	400				7000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm			400 CLBS, 7000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC3030-70PQ100ISPC0107	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5		Flatpack			4.5 V	.65 mm		9 ns	100 CLBS, 1500 Gates		Tin Lead	Quad	R-PQFP-G100		2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				20 mm
XCS20-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	400				7000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm			400 CLBS, 7000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC4002XL-1PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm		1.3 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	225 °C (437 °F)	20 mm
XC4010XL-2PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm		1.5 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e0	179 MHz	30 s	160	225 °C (437 °F)	20 mm
XC4003A-6PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	225 °C (437 °F)	20 mm
5962-8971301MYX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	14 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XA3S500E-4VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS			500000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz				14 mm
XC3020-50CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		64	CMOS			1000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		64 CLBS, 1000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500		50 MHz				19.05 mm
XC3330A-6PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
5962-8971302MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC5406-4PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC4403-3VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
5962-8994802MNC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3330A-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
XC5406-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
XC3120A-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		3.3 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1500 Logic gates	e0	227 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3120-3PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9,32	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	270 MHz	30 s	64	225 °C (437 °F)	20 mm
XC4005XL-09VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 3000-9000	e3	217 MHz	30 s		260 °C (500 °F)	14 mm
XC5206L-5VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 6000-10000	e0					14 mm
XC4003E-1PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	20 mm
XC3042-100PQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000		100 MHz				20 mm
XC5202L-3VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 2000-3000	e0					14 mm
XC3030-70PQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000	e0	70 MHz				20 mm
XC3120-4PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	3.3 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-1500	e0	227 MHz	30 s	64	225 °C (437 °F)	20 mm
5962-8971303MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz		82		19.05 mm
XC3030-70PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		80	1500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	80	225 °C (437 °F)	20 mm
XC4002XL-09CVQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	152	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 1600 Logic gates	e0	217 MHz	30 s	64	240 °C (464 °F)	14 mm
XC3042-125PQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.5 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000		125 MHz				20 mm
XC4003-5PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	77	225 °C (437 °F)	20 mm
XC3042-125TQ100C	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		82	2000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.5 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.7 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	125 MHz	30 s	82	225 °C (437 °F)	14 mm
XC5206-6PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC3S2000-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4					14 mm
XC3020-70CQ100BSPC0110	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XCS05XL-3VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	100				2000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
XC4303-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
5962-9471202MZC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC5206-6VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		5.6 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.