100 Field Programmable Gate Arrays (FPGA) 1,239

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5402L-4VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes							3.3		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
XC4005E-4PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS		112	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e0	111 MHz	30 s	112	225 °C (437 °F)	20 mm
5962-8994803MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V		CMOS	MIL-STD-883	64	2000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.2258 mm	19.05 mm	No		e4	100 MHz		64		19.05 mm
5962-8994802YX	Xilinx	FPGA	Military	Flat	100	QFF	Square			Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	25 MHz				17.27 mm
XC5202L-6PQG100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e3					20 mm
XC3330L-8TQ100I	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No							14 mm
XCS20-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS			7000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 20000	e3	166 MHz	30 s		260 °C (500 °F)	14 mm
XC3042A-6PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 3000 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	20 mm
XC5206-4VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS			6000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		3.8 ns	196 CLBS, 6000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 6000-10000	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC3330L-8TQ100C	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No							14 mm
XC3042A-7VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 3000 Logic gates	e3	113 MHz	30 s		260 °C (500 °F)	14 mm
5962-8971301QTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
5962-8971302M9C	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes			CMOS	MIL-STD-883	82		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	70 MHz		82		19.05 mm
XC3342A-6PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC4005E-4PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	196	CMOS			3000	5		Flatpack			4.5 V	.65 mm		2.7 ns	196 CLBS, 3000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	20 mm
XC3020-100PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3142-5TQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	144	Yes			CMOS		82		5	5 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3			No		e0		30 s	82	225 °C (437 °F)
XC4002XL-1VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm		1.3 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	240 °C (464 °F)	14 mm
XC4002XL-09CVQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			1000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 1600 Logic gates	e3	217 MHz	30 s		260 °C (500 °F)	14 mm
XC5204-3PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	120	CMOS			4000	5		Flatpack			4.5 V	.65 mm		3 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 4000-6000	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC8103-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	1024	CMOS			3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		1024 CLBS, 3000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	512 flip-flops; 3.3 V operation; OTP based						20 mm
XC8103-ESPQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	1024	CMOS			3328	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	1024 CLBS, 3328 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 64 I/OS; MAX 512 flip-flops; OTP based						20 mm
XC3S100E-4VQ100IS1	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		66	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	572 MHz		59		14 mm
XC4003E-3PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	100	CMOS			2000	5		Flatpack			4.5 V	.65 mm		2 ns	100 CLBS, 2000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	20 mm
XC4003E-1VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e3	166 MHz	30 s		260 °C (500 °F)	14 mm
XC5204-5PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	120	CMOS			4000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.6 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XCS30XL-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 30000	e3	217 MHz	30 s	196	260 °C (500 °F)	14 mm
XC3030-100TQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.7 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000		100 MHz				14 mm
XC3020A-7PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1500 Logic gates	e0	113 MHz	30 s	64	225 °C (437 °F)	20 mm
XC4005XL-09CPGQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	196				3000	3.3		Flatpack			3 V	.65 mm		1.2 ns	196 CLBS, 3000 Gates		Matte Tin	Quad	R-PQFP-G100		3.4 mm	14 mm	No	Can also use 9000 gates	e3	217 MHz				20 mm
XC3020-70CQ100ISPC0110	Xilinx	FPGA	Industrial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC5202-5PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC3020-100CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)	7 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	100 MHz				17.272 mm
XC3042-100PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	100 MHz	30 s	82	225 °C (437 °F)	20 mm
XC3030-70PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	1500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	9 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	70 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3020-70CQ100B	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V	64	CMOS	38535Q/M;38534H;883B	64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	70 MHz		64		17.272 mm
XC3042-70CB100MSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				19.05 mm
XC3S1500-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
XC2318L-70TQ100I	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No			70 MHz				14 mm
XC4005XL-09CPQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e3	217 MHz				20 mm
XC5202-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		84	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		3.8 ns	64 CLBS, 2000 Gates		Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e0	83 MHz	30 s	84	225 °C (437 °F)	20 mm
XC3042-100CB100BSPC0107	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		144	CMOS			2000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	7 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		2.921 mm	19.05 mm	No	480 flip-flops; typical gates = 2000-3000	e0	100 MHz				19.05 mm
XC3120A-3PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm		2.7 ns	64 CLBS, 1000 Gates		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1500 Logic gates	e0	270 MHz	30 s	64	225 °C (437 °F)	20 mm
XC5206-6VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC5202L-5PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e0					20 mm
XC3S1500-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC3020-50CQ100CSPC0107	Xilinx	FPGA	Commercial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.635 mm	70 °C (158 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC3330A-3PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.