100 Field Programmable Gate Arrays (FPGA) 1,239

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4010XL-3PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	20 mm
XC4002XL-09CPGQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			1000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100		3.4 mm	14 mm	No	Max usable 1600 Logic gates	e3	217 MHz				20 mm
XC3020-70CQ100M	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes	5.5 V	64	CMOS		64	2000	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops	e0	70 MHz		64		17.272 mm
5962-8971303MNC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz		82		17.27 mm
XC4002XL-1PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS		64	1000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	225 °C (437 °F)	20 mm
XC4010XL-2PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	20 mm
5962-9471201MYX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	238	Yes			CMOS	MIL-STD-883	77		5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4	50 MHz		77		19.05 mm
XC3042-70PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	82	225 °C (437 °F)	20 mm
XC3142A-2PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	144	CMOS			2000	5		Flatpack			4.5 V	.65 mm		2.2 ns	144 CLBS, 2000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	20 mm
5962-9561002MYX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3020-70CB100B	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired	64	Yes		64	CMOS	MIL-STD-883 Class B	64	1000	5	5 V	Flatpack, Guard Ring	TPAK100,2.6SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	9 ns	64 CLBS, 1000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100	1	3.429 mm	19.05 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz		64		19.05 mm
XS2S30-5-VQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	972	Yes			CMOS		132			1.5/3.3,2.5 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3		14 mm	No		e0		30 s	132	240 °C (464 °F)	14 mm
XC5202-6PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.65 mm		5.6 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC3142A-1VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	14 mm
XCV600-4PQ240C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	3456				661111	2.5		Flatpack			2.375 V	.65 mm	85 °C (185 °F)	0.8 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	250 MHz				20 mm
5962-8971301M9X	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC4003-6PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS		77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	77	225 °C (437 °F)	20 mm
XC4005XL-09CPQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	196				3000	3.3		Flatpack			3 V	.65 mm		1.2 ns	196 CLBS, 3000 Gates			Quad	R-PQFP-G100		3.4 mm	14 mm	No	Can also use 9000 gates		217 MHz				20 mm
XC5206-5PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	784	Yes	5.25 V	196	CMOS		81	6000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	81	225 °C (437 °F)	20 mm
XC5206-5PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC4005E-1PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	196	CMOS			3000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	20 mm
XC5402L-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes							3.3		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC3120A-5PQ100M	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes		64	CMOS		64	1300	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	64 CLBS, 1300 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800	e0	190 MHz	30 s	64	225 °C (437 °F)	20 mm
XC3020-70CQ100BSPC0107	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC3030-125TQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.7 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000		125 MHz				14 mm
XCV800-6PQ240I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	4704				888439	2.5		Flatpack			2.375 V	.65 mm		0.6 ns	4704 CLBS, 888439 Gates		Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	333 MHz				20 mm
XCS20XL-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS		77	7000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 20000	e3	217 MHz	30 s	77	260 °C (500 °F)	14 mm
XCS30-3VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	576				10000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm			576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
XC3130A-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	1500	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 2000 Logic gates	e0	270 MHz	30 s	80	240 °C (464 °F)	14 mm
XC3042-70TQ100CSPC0107	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS			2000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100		1.7 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				14 mm
XC3042L-8VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS		82	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e0	80 MHz	30 s	82	240 °C (464 °F)	14 mm
XC3020-50PQ100ISPC0110	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				20 mm
XC3142A-5VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		4.1 ns	144 CLBS, 2000 Gates		Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 2000-3000	e0	188 MHz	30 s	82	240 °C (464 °F)	14 mm
XC5206L-3VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 6000-10000	e0					14 mm
XC4005XL-09CPGQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100		3.4 mm	14 mm	No	Max usable 5000 Logic gates	e3	217 MHz				20 mm
XC3S50A-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		68	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	770 MHz		62		14 mm
XC2318-70VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No			70 MHz				14 mm
XC3342A-3TQ100C	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No							14 mm
XC5202-4PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.65 mm		3.8 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
5962-9561002MZX	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XCV600-4PQG240C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	3456				661111	2.5		Flatpack			2.375 V	.65 mm	85 °C (185 °F)	0.8 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	250 MHz				20 mm
5962-9471201MZC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XCV800-5PQG240C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	4704				888439	2.5		Flatpack			2.375 V	.65 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	294 MHz				20 mm
5962-8994802QUA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS	MIL-PRF-38535 Class Q		2000	5		Flatpack			4.5 V		125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							70 MHz
XC3S1000-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XCV800-5PQ240C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	4704				888439	2.5		Flatpack			2.375 V	.65 mm	85 °C (185 °F)	0.7 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	294 MHz				20 mm
XC3130A-1PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			1500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 2000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	20 mm
5962-8971303MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired	144	Yes	5.5 V		CMOS	MIL-STD-883	82	4200	5	5 V	Flatpack	QFL100,.7SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)		4200 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.683 mm	17.27 mm	No		e4	100 MHz		82		17.27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.