Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
66 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
78 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
80 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
78 |
14 mm |
|||||||||
|
Microchip Technology |
FPGA |
Military |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
125 °C (257 °F) |
6144 CLBS, 250000 Gates |
-55 °C (-67 °F) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
14 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
1.26 V |
79 |
1.2 |
Tray |
1.2 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
133 MHz |
30 s |
79 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
684 |
CMOS |
14000 |
3.3 |
Flatpack |
3 V |
.65 mm |
70 °C (158 °F) |
3.5 ns |
684 CLBS, 14000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Also Operates at 5 V supply |
e3 |
70 MHz |
30 s |
245 °C (473 °F) |
20 mm |
||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
768 |
CMOS |
30000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
768 CLBS, 30000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
14 mm |
|||||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
3072 CLBS, 125000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
78 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
80 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
78 |
14 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
384 |
Yes |
3.465 V |
384 |
CMOS |
62 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.44 ns |
384 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
375 MHz |
40 s |
62 |
260 °C (500 °F) |
14 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
64 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e4 |
263 MHz |
60 |
14 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
92 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e3 |
263 MHz |
30 s |
92 |
260 °C (500 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
63 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
630 MHz |
30 s |
63 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
14 mm |
|||||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
14 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
74 |
1.8 |
1.8/3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,14X14,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 °C (212 °F) |
80 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.35 mm |
8 mm |
No |
e1 |
30 s |
74 |
260 °C (500 °F) |
8 mm |
|||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
1.575 V |
CMOS |
68 |
250000 |
1.5 |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
1.425 V |
.5 mm |
100 °C (212 °F) |
250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
68 |
14 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
1.575 V |
6144 |
CMOS |
AEC-Q100 |
68 |
250000 |
1.5 |
1.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
30 s |
68 |
260 °C (500 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
66 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
240 CLBS, 100000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
55 |
260 °C (500 °F) |
14 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
30 s |
260 °C (500 °F) |
14 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
2112 |
Yes |
3.465 V |
79 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
79 |
14 mm |
||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
66 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1536 |
Yes |
1.575 V |
1536 |
CMOS |
AEC-Q100 |
71 |
60000 |
1.5 |
Tray |
1.5/3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
125 °C (257 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
30 s |
71 |
260 °C (500 °F) |
14 mm |
||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
92 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.7 ns |
216 CLBS, 30000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
263 MHz |
30 s |
92 |
260 °C (500 °F) |
14 mm |
||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
3.465 V |
150 |
73 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 °C (212 °F) |
150 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
40 s |
73 |
260 °C (500 °F) |
14 mm |
|||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
66 |
500000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
572 MHz |
30 s |
59 |
260 °C (500 °F) |
14 mm |
|||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
3072 CLBS, 125000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
14 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1232 |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Also Operates at 5 V supply |
e3 |
94 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6144 |
Yes |
2.7 V |
CMOS |
66 |
150000 |
2.5 |
Tray |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
85 °C (185 °F) |
150000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
180 MHz |
30 s |
66 |
260 °C (500 °F) |
14 mm |
||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
2112 |
Yes |
1.26 V |
79 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
30 s |
79 |
260 °C (500 °F) |
14 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
CMOS |
63 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.61 ns |
480 CLBS, 200000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
630 MHz |
30 s |
63 |
260 °C (500 °F) |
14 mm |
|||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
55 |
14 mm |
|||||||||||
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
6144 CLBS, 250000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
14 mm |
||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
55 |
260 °C (500 °F) |
14 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
256 |
Yes |
3.465 V |
55 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
55 |
14 mm |
||||||||||||
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
14 mm |
||||||||||||||
Microsemi |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1232 |
Yes |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.8 ns |
1232 CLBS, 24000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Also Operates at 5 V supply |
e0 |
94 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
1280 |
Yes |
3.465 V |
CMOS |
80 |
2.5 |
2.5/3.3 V |
Flatpack |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
No |
e3 |
133 MHz |
80 |
|||||||||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
768 |
CMOS |
30000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
768 CLBS, 30000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
14 mm |
||||||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
640 |
Yes |
3.465 V |
80 |
78 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
80 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
78 |
14 mm |
||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
384 |
Yes |
3.465 V |
384 |
CMOS |
62 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.63 ns |
384 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e3 |
375 MHz |
40 s |
62 |
260 °C (500 °F) |
14 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
350 MHz |
14 mm |
|||||||||||||
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Thin Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
350 MHz |
14 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.