Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
2400 |
468252 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.8 ns |
2400 CLBS, 468252 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e0 |
250 MHz |
20 mm |
|||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
CMOS |
MIL-STD-883 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQFP-F100 |
3.429 mm |
19.05 mm |
No |
19.05 mm |
|||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
179 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e0 |
200 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Military |
Flat |
100 |
QFF |
Square |
Yes |
5.5 V |
64 |
CMOS |
MIL-STD-883 |
2000 |
5 |
Flatpack |
4.5 V |
.635 mm |
125 °C (257 °F) |
14 ns |
64 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Gold |
Quad |
S-XQFP-F100 |
3.68 mm |
17.27 mm |
No |
e4 |
16 MHz |
17.27 mm |
|||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
77 |
10000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
576 CLBS, 10000 Gates |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e0 |
217 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.5 V |
.65 mm |
85 °C (185 °F) |
9 ns |
64 CLBS, 2000 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
70 MHz |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.6 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
120 |
Yes |
5.25 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.8 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAX available 6000 Logic gates |
e0 |
83 MHz |
30 s |
124 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Military |
Flat |
100 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
144 |
CMOS |
MIL-PRF-38535 Class Q |
4200 |
5 |
Flatpack |
4.5 V |
125 °C (257 °F) |
9 ns |
144 CLBS, 4200 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F100 |
70 MHz |
|||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.6 mm |
14 mm |
No |
70 MHz |
14 mm |
||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
1500 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
2.7 ns |
100 CLBS, 1500 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
Max usable 2000 Logic gates |
e3 |
270 MHz |
30 s |
245 °C (473 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
144 |
CMOS |
2000 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
9 ns |
144 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F100 |
2.921 mm |
19.05 mm |
No |
480 flip-flops; typical gates = 2000-3000 |
70 MHz |
19.05 mm |
||||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.25 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.65 mm |
70 °C (158 °F) |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Quad |
R-PQFP-G100 |
3.1496 mm |
14 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
50 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.75 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 1500 Logic gates |
e0 |
323 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
3.6 V |
144 |
CMOS |
82 |
2000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
2.2 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Typical gates = 2000-3000 |
e0 |
325 MHz |
30 s |
82 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.5 V |
64 |
CMOS |
64 |
1600 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
6 ns |
64 CLBS, 1600 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
256 flip-flops; typical gates = 1600-2000 |
e0 |
90.9 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
MAXIMUM usable gates 10000 |
e0 |
250 MHz |
30 s |
112 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
144 |
CMOS |
MIL-STD-883 |
2000 |
5 |
Flatpack, Guard Ring |
.65 mm |
125 °C (257 °F) |
4.1 ns |
144 CLBS, 2000 Gates |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F100 |
3.429 mm |
19.05 mm |
No |
Typical gates = 2000-3000 |
e4 |
188 MHz |
19.05 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
4704 |
888439 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
0.7 ns |
4704 CLBS, 888439 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
294 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 20000 |
e0 |
217 MHz |
30 s |
160 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
2400 |
468252 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
85 °C (185 °F) |
0.6 ns |
2400 CLBS, 468252 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
333 MHz |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
64 |
1000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
2.7 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 1000-1500 |
e0 |
270 MHz |
30 s |
64 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
3.6 V |
64 |
CMOS |
64 |
1000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
64 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 1600 Logic gates |
e0 |
200 MHz |
30 s |
64 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Automotive |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
125 °C (257 °F) |
400 CLBS, 7000 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates = 20000 |
e0 |
30 s |
160 |
240 °C (464 °F) |
14 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
74 |
1000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
8 ns |
100 CLBS, 1000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.7 mm |
14 mm |
No |
174 flip-flops; typical gates = 1000-1500 |
e0 |
100 MHz |
30 s |
74 |
225 °C (437 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Typical gates = 6000-10000 |
e3 |
20 mm |
|||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
166 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Commercial |
Flat |
100 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.25 V |
64 |
CMOS |
2000 |
5 |
Flatpack |
4.75 V |
.635 mm |
70 °C (158 °F) |
7 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-CQFP-F100 |
3.683 mm |
17.272 mm |
No |
MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C |
e0 |
100 MHz |
17.272 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e4 |
14 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Thin Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e0 |
14 mm |
|||||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
Yes |
CMOS |
MIL-STD-883 |
82 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK100,2.6SQ,25 |
Field Programmable Gate Arrays |
.65 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQFP-F100 |
3.429 mm |
19.05 mm |
No |
e4 |
190 MHz |
82 |
19.05 mm |
||||||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
64 |
Yes |
64 |
CMOS |
38535Q/M;38534H;883B |
64 |
1300 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK100,2.6SQ,25 |
Field Programmable Gate Arrays |
.65 mm |
125 °C (257 °F) |
4.1 ns |
64 CLBS, 1300 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F100 |
1 |
2.921 mm |
19.05 mm |
No |
MAX 64 I/OS; 256 flip-flops; typical gates = 1300 - 1800 |
190 MHz |
64 |
19.05 mm |
||||||||||
Xilinx |
FPGA |
Military |
Flat |
100 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
5.5 V |
144 |
CMOS |
4200 |
5 |
Flatpack |
4.5 V |
.635 mm |
125 °C (257 °F) |
144 CLBS, 4200 Gates |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-F100 |
3.683 mm |
17.272 mm |
No |
MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C |
e0 |
50 MHz |
17.272 mm |
|||||||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
5.5 V |
2688 |
CMOS |
8700 |
5 |
Flatpack |
4.5 V |
.65 mm |
85 °C (185 °F) |
5.5 ns |
2688 CLBS, 8700 Gates |
-40 °C (-40 °F) |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
MAX 78 I/OS; MAX 1344 flip-flops; OTP based |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
2.87 mm |
14 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
950 |
Yes |
3.6 V |
400 |
CMOS |
77 |
7000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.1 ns |
400 CLBS, 7000 Gates |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 20000 |
e0 |
217 MHz |
30 s |
77 |
240 °C (464 °F) |
14 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
100 |
CMOS |
2000 |
5 |
Flatpack, Thin Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e3 |
125 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Thin Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G100 |
1.2 mm |
14 mm |
No |
14 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
196 |
10000 |
3.3 |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Maximum usable gates 30000 |
e0 |
217 MHz |
30 s |
196 |
240 °C (464 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Military |
Flat |
100 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
144 |
Yes |
144 |
CMOS |
38535Q/M;38534H;883B |
82 |
3000 |
5 |
5 V |
Flatpack, Guard Ring |
TPAK100,2.6SQ,25 |
Field Programmable Gate Arrays |
.65 mm |
125 °C (257 °F) |
4.1 ns |
144 CLBS, 3000 Gates |
-55 °C (-67 °F) |
Quad |
S-CQFP-F100 |
1 |
2.921 mm |
19.05 mm |
No |
MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700 |
190 MHz |
82 |
19.05 mm |
||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
AEC-Q100 |
124 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
192 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
e3 |
125 MHz |
30 s |
124 |
260 °C (500 °F) |
14 mm |
||||||
|
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
2.625 V |
4704 |
888439 |
2.5 |
Flatpack |
2.375 V |
.65 mm |
0.6 ns |
4704 CLBS, 888439 Gates |
Matte Tin |
Quad |
R-PQFP-G100 |
3 |
3.4 mm |
14 mm |
No |
e3 |
333 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
100 |
FQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
82 |
3000 |
5 |
5 V |
Flatpack, Fine Pitch |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
70 °C (158 °F) |
3.3 ns |
144 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.75 mm |
14 mm |
No |
MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700 |
e0 |
230 MHz |
30 s |
82 |
225 °C (437 °F) |
14 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
100 |
Yes |
5.25 V |
100 |
CMOS |
80 |
2000 |
5 |
5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
100 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 3000 Logic gates |
e0 |
125 MHz |
30 s |
80 |
240 °C (464 °F) |
14 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
100 |
TFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
3000 |
3.3 |
Flatpack, Thin Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
No |
Max usable 5000 Logic gates |
e3 |
166 MHz |
30 s |
260 °C (500 °F) |
14 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack |
.65 mm |
Quad |
R-PQFP-G100 |
3.4 mm |
14 mm |
No |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.