100 Field Programmable Gate Arrays (FPGA) 1,239

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3020-50PQ100ISPC0107

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.65 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

-40 °C (-40 °F)

Quad

R-PQFP-G100

3.1496 mm

14 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

50 MHz

20 mm

XC4003E-4PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

80

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 3000 Logic gates

e0

111 MHz

30 s

80

225 °C (437 °F)

20 mm

XC3020-50CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

64

CMOS

1000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

64 CLBS, 1000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

50 MHz

19.05 mm

XC5206-4PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

784

Yes

5.25 V

196

CMOS

81

6000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

3.8 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

81

225 °C (437 °F)

20 mm

XC2S15-6VQG100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

432

Yes

2.625 V

96

86

15000

2.5

1.5/3.3,2.5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

96 CLBS, 15000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Maximum usable gates 15000

e3

263 MHz

30 s

86

260 °C (500 °F)

14 mm

XC4003E-4PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

100

CMOS

2000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 3000 Logic gates

e3

111 MHz

30 s

245 °C (473 °F)

20 mm

5962-8994803MYX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

e0

17.272 mm

XC4003A-4PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

238

Yes

5.25 V

100

CMOS

77

2500

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

4 ns

100 CLBS, 2500 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

360 flip-flops; typical gates = 2500-3000

e0

133.3 MHz

30 s

77

225 °C (437 °F)

20 mm

XC3020-100PQ100I

Xilinx

FPGA

Industrial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

64

1000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.5 V

.65 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

e0

100 MHz

30 s

64

225 °C (437 °F)

20 mm

XC3042-100CB100C

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.25 V

144

CMOS

82

2000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

7 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

100 MHz

82

19.05 mm

XC3042-50CB100M

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

2.921 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

50 MHz

19.05 mm

XC3042-125CQ100CSPC0107

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

144

CMOS

4200

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

5.5 ns

144 CLBS, 4200 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e0

125 MHz

17.272 mm

XC3042A-7PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

82

2000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

5.1 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 3000 Logic gates

e0

113 MHz

30 s

82

225 °C (437 °F)

20 mm

XCS10XL-4VQ100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.1 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

MAXIMUM usable gates 10000

e0

217 MHz

30 s

112

240 °C (464 °F)

14 mm

5962-9471202MYX

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

238

Yes

CMOS

MIL-STD-883

77

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

.65 mm

125 °C (257 °F)

6 ns

-55 °C (-67 °F)

Gold

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

e4

90.9 MHz

77

19.05 mm

5962-8971303QTX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

144

CMOS

MIL-PRF-38535 Class Q

4200

5

Flatpack

4.5 V

125 °C (257 °F)

7 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

100 MHz

XC3020-50CQ100MSPC0110

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

2000

5

Flatpack

4.5 V

.635 mm

125 °C (257 °F)

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C

e0

50 MHz

17.272 mm

5962-8971302MYC

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack

.635 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

e0

17.272 mm

XC4010XL-1PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

3 V

.65 mm

85 °C (185 °F)

1.3 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 10000 Logic gates

e0

200 MHz

30 s

160

225 °C (437 °F)

20 mm

XC3342L-8TQ100I

Xilinx

FPGA

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G100

1.6 mm

14 mm

No

14 mm

XC8106-2PQ100C

Xilinx

FPGA

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

1728

CMOS

6000

5

Flatpack

4.75 V

.65 mm

70 °C (158 °F)

1728 CLBS, 6000 Gates

0 °C (32 °F)

Quad

R-PQFP-G100

3.4 mm

14 mm

No

864 flip-flops; 3.3 V operation; OTP based

20 mm

5962-8994802QUX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.5 V

64

CMOS

MIL-PRF-38535 Class Q

2000

5

Flatpack

4.5 V

125 °C (257 °F)

9 ns

64 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

70 MHz

XC5206L-5PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.6 V

196

CMOS

6000

3.3

Flatpack

3 V

.65 mm

85 °C (185 °F)

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Typical gates = 6000-10000

e0

20 mm

XC5202L-4VQ100C

Xilinx

FPGA

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

3.6 V

64

CMOS

2000

3.3

Flatpack, Thin Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

64 CLBS, 2000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Typical gates = 2000-3000

e0

14 mm

XC3042-50CB100B

Xilinx

FPGA

Military

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

144

CMOS

MIL-STD-883 Class B

2000

5

Flatpack, Guard Ring

.65 mm

125 °C (257 °F)

144 CLBS, 2000 Gates

-55 °C (-67 °F)

Quad

S-CQFP-F100

3.429 mm

19.05 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

50 MHz

19.05 mm

5962-8971302MYX

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

CMOS

MIL-STD-883

5

Flatpack

.635 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

e0

17.272 mm

XC3020-100CB100C

Xilinx

FPGA

Other

Flat

100

GQFF

Square

Ceramic, Metal-Sealed Cofired

64

Yes

5.25 V

64

CMOS

64

1000

5

5 V

Flatpack, Guard Ring

TPAK100,2.6SQ,25

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Quad

S-CQFP-F100

1

2.921 mm

19.05 mm

No

256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA

100 MHz

64

19.05 mm

XC3042-50CQ100B

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

144

Yes

5.5 V

144

CMOS

38535Q/M;38534H;883B

82

4200

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

4.5 V

.635 mm

125 °C (257 °F)

14 ns

144 CLBS, 4200 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F100

1

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops

e0

50 MHz

82

17.272 mm

XC3142-4PQ100C

Xilinx

FPGA

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

82

3000

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

70 °C (158 °F)

3.3 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

230 MHz

30 s

82

225 °C (437 °F)

20 mm

XC3142A-3PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

144

CMOS

2000

5

Flatpack

4.5 V

.65 mm

2.7 ns

144 CLBS, 2000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 3000 Logic gates

e3

270 MHz

30 s

245 °C (473 °F)

20 mm

XC5402-4VQ100C

Xilinx

FPGA

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Thin Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G100

1.2 mm

14 mm

No

14 mm

XCS30XL-5VQ100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

196

10000

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Maximum usable gates 30000

e0

250 MHz

30 s

196

240 °C (464 °F)

14 mm

5962-01-414-9654

Xilinx

FPGA

Military

Flat

100

QFF

Square

Ceramic

144

Yes

CMOS

38535Q/M;38534H;883B

82

5

5 V

Flatpack

QFL100,.7SQ,25

Field Programmable Gate Arrays

.635 mm

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-XQFP-F100

No

50 MHz

82

XC5410L-4PQ100C

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

3.3

Flatpack

.65 mm

Quad

R-PQFP-G100

3.4 mm

14 mm

No

20 mm

XC3330A-6VQ100C

Xilinx

FPGA

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Thin Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G100

1.2 mm

14 mm

No

14 mm

XC4005XL-3VQ100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

196

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Max usable 5000 Logic gates

e0

166 MHz

30 s

112

240 °C (464 °F)

14 mm

XC4003E-4VQG100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

2000

5

Flatpack, Thin Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

2.7 ns

100 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Max usable 3000 Logic gates

e3

111 MHz

30 s

260 °C (500 °F)

14 mm

XCV800-5PQ240I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

2.625 V

4704

888439

2.5

Flatpack

2.375 V

.65 mm

0.7 ns

4704 CLBS, 888439 Gates

Tin Lead

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e0

294 MHz

20 mm

XC5202-3PQG100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

64

CMOS

2000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

3 ns

64 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

MAX available 3000 Logic gates

e3

83 MHz

30 s

245 °C (473 °F)

20 mm

XC3130A-1VQG100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

5.25 V

100

CMOS

1500

5

Flatpack, Thin Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

1.75 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

Max usable 2000 Logic gates

e3

323 MHz

30 s

260 °C (500 °F)

14 mm

XC3042-70CQ100CSPC0107

Xilinx

FPGA

Commercial

Flat

100

QFF

Square

Ceramic, Metal-Sealed Cofired

Yes

5.25 V

144

CMOS

4200

5

Flatpack

4.75 V

.635 mm

70 °C (158 °F)

9 ns

144 CLBS, 4200 Gates

0 °C (32 °F)

Tin Lead

Quad

S-CQFP-F100

3.683 mm

17.272 mm

No

MAX 82 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C

e0

70 MHz

17.272 mm

XC3S100E-4VQG100IS1

Xilinx

FPGA

Industrial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

66

100000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

240 CLBS, 100000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

572 MHz

30 s

59

260 °C (500 °F)

14 mm

XC4002XL-3VQ100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

64

Yes

3.6 V

64

CMOS

64

1000

3.3

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Max usable 1600 Logic gates

e0

166 MHz

30 s

64

240 °C (464 °F)

14 mm

XC4005E-3PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

196

CMOS

3000

5

Flatpack

4.5 V

.65 mm

2 ns

196 CLBS, 3000 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

Max usable 5000 Logic gates

e3

125 MHz

30 s

245 °C (473 °F)

20 mm

XC3020-100PQ100CSPC0107

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.25 V

64

CMOS

1000

5

Flatpack

4.75 V

.65 mm

85 °C (185 °F)

7 ns

64 CLBS, 1000 Gates

0 °C (32 °F)

Quad

R-PQFP-G100

2.87 mm

14 mm

No

256 flip-flops; typical gates = 1000-1500

100 MHz

20 mm

XC3030-125PQ100C

Xilinx

FPGA

Other

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

100

Yes

5.25 V

100

CMOS

80

1500

5

5 V

Flatpack

QFP100,.7X.9

Field Programmable Gate Arrays

4.75 V

.65 mm

85 °C (185 °F)

5.5 ns

100 CLBS, 1500 Gates

0 °C (32 °F)

Tin Lead

Quad

R-PQFP-G100

3

2.87 mm

14 mm

No

360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA

e0

125 MHz

30 s

80

225 °C (437 °F)

20 mm

XC3030A-7PQG100I

Xilinx

FPGA

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

Yes

5.5 V

100

CMOS

1500

5

Flatpack

4.5 V

.65 mm

5.1 ns

100 CLBS, 1500 Gates

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

Max usable 2000 Logic gates

e3

113 MHz

30 s

245 °C (473 °F)

20 mm

XC3S2000-4VQG100C

Xilinx

FPGA

Other

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Flatpack, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.