100 Field Programmable Gate Arrays (FPGA) 1,239

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5202L-4PQ100C	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			2000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 2000-3000	e0					20 mm
XC3030-50PQ100CSPC0107	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS			3000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		100 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				20 mm
5962-8971301QTX	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	144	CMOS	MIL-PRF-38535 Class Q		4200	5		Flatpack			4.5 V		125 °C (257 °F)	14 ns	144 CLBS, 4200 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F100							50 MHz
XC5202-3VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		3 ns	64 CLBS, 2000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 2000-3000	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC3142A-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		82	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e0	270 MHz	30 s	82	240 °C (464 °F)	14 mm
XCS10XL-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)		196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0		30 s	112	240 °C (464 °F)	14 mm
5962-8994801MTA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC3S5000-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4					14 mm
XC3130A-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		80	1500	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		3.3 ns	100 CLBS, 1500 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 2000 Logic gates	e0	227 MHz	30 s	80	240 °C (464 °F)	14 mm
XC2S15-5VQ100Q	Xilinx	FPGA		Gull Wing	100	QFP	Square	Plastic/Epoxy	432	Yes			CMOS		64			1.5/3.3,2.5 V	Flatpack	TQFP100,.63SQ	Field Programmable Gate Arrays		.5 mm					Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3			No		e0		30 s	60	240 °C (464 °F)
XC5206L-6VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 6000-10000	e0					14 mm
XC5202-4PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	3.8 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	20 mm
XC3142-5PQ100B	Xilinx	FPGA	Military	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes		144	CMOS	38535Q/M;38534H;883B	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)	4.1 ns	144 CLBS, 3000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm
XC3020-70CQ100ISPC0107	Xilinx	FPGA	Industrial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				17.272 mm
XC8106-ESPQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	1728	CMOS			5616	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	1728 CLBS, 5616 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 864 flip-flops; OTP based						20 mm
XCS20XL-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS		77	7000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 20000	e3	250 MHz	30 s	77	260 °C (500 °F)	14 mm
XC3042-100PQ100ISPC0107	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	144	CMOS			2000	5		Flatpack			4.5 V	.65 mm		7 ns	144 CLBS, 2000 Gates			Quad	R-PQFP-G100		2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000		100 MHz				20 mm
XC4010XL-3PQG100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Flatpack			3 V	.65 mm		1.6 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	20 mm
XCS05-3VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		77	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm		1.6 ns	100 CLBS, 2000 Gates		Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e0	125 MHz	30 s	77	240 °C (464 °F)	14 mm
XC3142-4PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	230 MHz	30 s	82	225 °C (437 °F)	20 mm
XCV600-4PQG240I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	3456				661111	2.5		Flatpack			2.375 V	.65 mm		0.8 ns	3456 CLBS, 661111 Gates		Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	250 MHz				20 mm
XC3030A-6VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	1500	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 2000 Logic gates	e0	135 MHz	30 s	80	240 °C (464 °F)	14 mm
XCV800-6PQ240C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	2.625 V	4704				888439	2.5		Flatpack			2.375 V	.65 mm	85 °C (185 °F)	0.6 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	333 MHz				20 mm
XA3S50-4VQG100Q	Xilinx	FPGA	Automotive	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192		AEC-Q100	124	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		192 CLBS, 50000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	125 MHz	30 s	124	260 °C (500 °F)	14 mm
XC3020-70PQ100CSPC0110	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS			2000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	9 ns	64 CLBS, 2000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		70 MHz				20 mm
XC4002XL-09CPQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	3.6 V	64	CMOS			1000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 1600 Logic gates	e3	217 MHz	30 s		245 °C (473 °F)	20 mm
5962-8994802MMC	Xilinx	FPGA	Military	Flat	100	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F100		3.429 mm	19.05 mm	No		e4					19.05 mm
XC3130-3PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes			CMOS		80		5	5 V	Flatpack	QFP100,.7X.9,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3			No		e0		30 s	80	225 °C (437 °F)
XC3S400-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC3142A-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		82	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 2000-3000	e0	188 MHz	30 s	82	240 °C (464 °F)	14 mm
XC3130-3TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	2000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	2.7 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	270 MHz	30 s	80	225 °C (437 °F)	14 mm
XC3130-4TQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	FQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		80	2000	5	5 V	Flatpack, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	3.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.75 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	80	225 °C (437 °F)	14 mm
5962-8994803MYA	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC5206L-4VQG100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Typical gates = 6000-10000	e3					14 mm
XC8101-3PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	384	CMOS			1000	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)		384 CLBS, 1000 Gates	0 °C (32 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	192 flip-flops; 3.3 V operation; OTP based						20 mm
XC3342A-3VQ100C	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Thin Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.2 mm	14 mm	No							14 mm
5962-8994802YA	Xilinx	FPGA	Military	Flat	100	QFF	Square			Yes	5.5 V	64	CMOS	MIL-STD-883		2000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)	9 ns	64 CLBS, 2000 Gates	-55 °C (-67 °F)	Gold	Quad	S-XQFP-F100		3.68 mm	17.27 mm	No		e4	25 MHz				17.27 mm
5962-8994802MTC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC4003E-2VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			2000	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		1.6 ns	100 CLBS, 2000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e3	125 MHz	30 s		260 °C (500 °F)	14 mm
XC4005XL-2VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			3000	3.3		Flatpack, Thin Profile, Fine Pitch			3 V	.5 mm		1.5 ns	196 CLBS, 3000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 5000 Logic gates	e3	179 MHz	30 s		260 °C (500 °F)	14 mm
5962-8994802MYC	Xilinx	FPGA	Military	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack				.635 mm	125 °C (257 °F)	9 ns		-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No		e0					17.272 mm
XC5402-4PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS				5		Flatpack				.65 mm						Quad	R-PQFP-G100		3.4 mm	14 mm	No							20 mm
XC3342A-3TQ100I	Xilinx	FPGA		Gull Wing	100	LFQFP	Square	Plastic/Epoxy		Yes			CMOS				5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G100		1.6 mm	14 mm	No							14 mm
XC8106-1PQ100C	Xilinx	FPGA	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	1728	Yes	5.25 V	1728	CMOS		168	6000	5	3.3/5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	5.4 ns	1728 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	864 flip-flops; 3.3 V operation; OTP based	e0	144 MHz	30 s	168	225 °C (437 °F)	20 mm
XC3130-4PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3120-2PQ100I	Xilinx	FPGA		Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			1000	5		Flatpack			4.5 V	.65 mm		2.2 ns	64 CLBS, 1000 Gates			Quad	R-PQFP-G100		3.4 mm	14 mm	No	Typical gates = 1000-1500		323 MHz				20 mm
XC3130A-4VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			1500	5		Flatpack, Thin Profile, Fine Pitch			4.5 V	.5 mm		3.3 ns	100 CLBS, 1500 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 2000 Logic gates	e3	227 MHz	30 s		260 °C (500 °F)	14 mm
XC3S5000-4VQG100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates		Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.