1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5ASXBB3G4F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
10AX066K1F36I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5AGXFA7G6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
EP3SL340F1152I2N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes			CMOS	744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm				Tin/Silver/Copper	Bottom	S-PBGA-B1152				No		e1	100 MHz		736
5SGXEA5H3F35I3L	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGTMC7K3F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGXMB7H4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
10AX032H1F35I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5ASXMB5G6F35I3	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434		385	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
10AX027H1F35E1MG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
10AS066H5F34E3SG	Altera	FPGA		Ball	1152	BGA	Square	Plastic	660000	Yes			CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					492
10AX090H1F34I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGZME5H3F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5SGXEA4K2F35C3	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXFA7K4F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5SGXMA3H1F35C2LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5SGXMA7K2F35C2LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXFB3K6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
EP2AGZ350EF35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)	13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			554		35 mm
EP3SE260F1152C2N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	255000	Yes	.94 V		CMOS	744	.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.9 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	800 MHz	30 s	744	245 °C (473 °F)	35 mm
10AX032H2F35I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5SGXMA5H2F35C2	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	552		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					552
5AGXMA7G6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5SGSMD3H3F35I3N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXFB5D4F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
EP4SGX530HH35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	531200	Yes		212480	CMOS	564		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)	212480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.7 mm	42.5 mm	No		e1		30 s	564	245 °C (473 °F)	42.5 mm
5SGXEA5K3F35C3N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXBB3G6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXBB5H6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXMB7D6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXBB7D6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGXBA7D6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
EP2AGX95CF35I5N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
10AX066K3F35I2SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
5AGXFB1D6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGTFD3K3F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
10AX027H3F35I2LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5AGXMA7D6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGXMB5G4F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	622 MHz		544		35 mm
5SGXEA5H3F35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	552	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGXBB1K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5SGXEA3K1F35C2N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.93 V	12830	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
EP2AGZ350EF35C3	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)	13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			554		35 mm
5AGXFA5H4F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Bottom	S-PBGA-B1152		2.7 mm	35 mm				670 MHz				35 mm
EP4SGX110FF35I2XN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224		372	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)	4224 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						372		35 mm
10AS048K4F35I3SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
5AGXMA7K4F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXFB1G6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.