1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
MPF300TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500TS-FC1152M	Microchip Technology	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.39 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
5AGXFB7H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	504000	Yes	1.18 V	19024	TSMC	704	1.15			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						704		35 mm
5SGXMA7H3F35C3	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGXMA7G4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544	1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		9168 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			544		35 mm
EP4SGX180FF35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030		564	.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		7030 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz		564		35 mm
MPF500T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TFCG1152E	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF300T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF300TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
10AX048H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
EP2AGX190FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	0.9			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
MPF300TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
10AX066H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	492	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
5AGXFB5H4F35I5N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849		704	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		15849 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	622 MHz		704		35 mm
M2GL150T-1FC1152I	Microchip Technology	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V			574	1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.9 mm	35 mm	No				20 s	574	240 °C (464 °F)	35 mm
10AX027H4F34I3SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
5CGXFC9E6F35C7N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
EP2AGX190FF35C4N	Intel	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		7612 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.6 mm	35 mm	No		e1	500 MHz		612		35 mm
10AX115H3F34E2LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	504	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No	Also Operates at 0.95 V nominal supply				504		35 mm
EP3SL150F1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		744	0.9		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		5700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP2SGX60EF1152C5N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		534		35 mm
EP4SGX230FF35I3N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e1	717 MHz		564		35 mm
5SGXMA3H2F35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5SGXMA3H2F35I3N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e1		30 s	432	245 °C (473 °F)	35 mm
EP2SGX60EF1152C4N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9			Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		9120 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						564		35 mm
MPF500TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
EP4SGX230FF35I3	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564	.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm			9120 CLBS		Tin Lead	Bottom	S-PBGA-B1152		3.6 mm	35 mm	No		e0	717 MHz		564		35 mm
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	378000	Yes	.88 V	47250		430	0.85			Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)		47250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.706 mm	35 mm						430		35 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF300T-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
10AX032H3F35E2LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
5AGXFA5H4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						544		35 mm
10AX032H3F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384	0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
5AGXMA7G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168	TSMC	544	1.1			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		9168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						544		35 mm
10AX032H2F35E1HG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes		11990	TSMC	384				Grid Array	BGA1152,34X34,40			1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm						384		35 mm
5CGXFC9E6F35I7N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11356 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
EP1AGX90EF1152C6N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	90220		538	1.2		1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		90220 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		538		35 mm
EP2AGX260FF35I3N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		612	.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm	No		e1	500 MHz		612		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.