1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX066H2F34I2SGES	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9			Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGXFB3H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688	TSMC	704		1.15			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						704		35 mm
5AGXFB3H4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		13688 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			704		35 mm
5AGZME1H2F35I3LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		414		0.85			Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)		8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						414		35 mm
5CGXBC9E7F35C8N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
EP1AGX50DF1152C6N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	50160		350		1.2		1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		50160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		350		35 mm
EP2AGX125EF35C5	Intel	FPGA		Ball	1152	BGA	Square	Plastic	118143	Yes			CMOS	452				0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					452
EP2AGX95EF35C4G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		612		0.9			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.55 mm	35 mm						612		35 mm
EP2SGX60EF1152C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	717 MHz		534		35 mm
EP3SE80F1152C3G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744		0.9			Grid Array	BGA1152,34X34,40		.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm		It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP3SL200F1152I4N	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	200000	Yes	.94 V	8000		744		0.9		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		8000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP4SGX360FF35C4	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		14144 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm	No		e0	717 MHz		564		35 mm
EP4SGX360FF35C4G	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144		564		0.9			Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		14144 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.3 mm	35 mm						564		35 mm
EP4SGX530HH35C4NES	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248				.9			Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
XC2V3000-4FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	650 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2VP40-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	4848 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	644	225 °C (437 °F)	35 mm
XC2VP50-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	5904 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	644	225 °C (437 °F)	35 mm
XC2VP50-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	5904 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	644	225 °C (437 °F)	35 mm
XC4VFX100-10FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2			Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	35 mm
XC4VFX60-10FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2			Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	35 mm
M2S150T-1FC1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1152		2.9 mm	35 mm	No		e0		30 s	574	240 °C (464 °F)	35 mm
M2S150T-1FCG1152	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
M2S150TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
M2S150TS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	146124	Yes	1.26 V		CMOS	574		1.2	Tray	1.2 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	2.9 mm	35 mm	No		e1		40 s	574	250 °C (482 °F)	35 mm
XC2V3000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	650 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2V10000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP20-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC4VFX60-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2			Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC2V10000-5FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP20-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2V4000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V10000-4FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	765 MHz	30 s		225 °C (437 °F)	35 mm
XC4VFX60-11FF1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1181 MHz	30 s	576	225 °C (437 °F)
XC4VFX40-11FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	448				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1181 MHz	30 s	448	225 °C (437 °F)
XC2VP40-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2V10000-5FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	880 MHz	30 s		225 °C (437 °F)	35 mm
XC4VFX40-10FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	448				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1028 MHz	30 s	448	225 °C (437 °F)
XC2VP20-8FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5			Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0		30 s		225 °C (437 °F)	35 mm
XC4VFX40-10FF1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	448				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1028 MHz	30 s	448	225 °C (437 °F)
XC2V4000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V6000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2VP30-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5		1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1050 MHz	30 s	644	225 °C (437 °F)	35 mm
XC4VFX60-11FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1181 MHz	30 s	576	225 °C (437 °F)
XC2V8000-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5			Grid Array			1.425 V	1 mm		0.35 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	820 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5			Grid Array			1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s		245 °C (473 °F)	35 mm
XC2V8000-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	824	8000000	1.5		1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC4VFX100-11FFG1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	576				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4			No		e1	1181 MHz	30 s	576	245 °C (473 °F)
XC4VFX100-11XFF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	576				1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No		e0	1205 MHz	30 s	576	225 °C (437 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.