
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | M2S150TS-1FCG1152I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified; |
Datasheet | M2S150TS-1FCG1152I Datasheet |
In Stock | 303 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Maximum Time At Peak Reflow Temperature (s): | 40 s |
Maximum Seated Height: | 2.9 mm |
No. of Inputs: | 574 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 574 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1152 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1152 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | BGA |
Width: | 35 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Packing Method: | Tray |
Technology Used: | CMOS |
No. of Logic Cells: | 146124 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA1152,34X34,40 |
Finishing Of Terminal Used: | Tin/Silver/Copper |
Length: | 35 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 250 °C (482 °F) |
Power Supplies (V): | 1.2 V |