1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VFX100-10FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			10544 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1028 MHz	30 s	576	245 °C (473 °F)	35 mm
XC4VFX40-11FFG1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes			CMOS	448			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4			No		e1	1181 MHz	30 s	448	245 °C (473 °F)
XC2VP20-7FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1350 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2V3000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	720	225 °C (437 °F)	35 mm
XC4VFX40-10FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	448		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1028 MHz	30 s	448	225 °C (437 °F)	35 mm
XC2V6000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC4VFX100-10FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4			No		e0	1028 MHz	30 s	576	225 °C (437 °F)
XC2V6000-4FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	650 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2VP30-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1200 MHz	30 s	644	225 °C (437 °F)	35 mm
XC2VP20-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1050 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2V6000-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	8448	CMOS		6000000	1.5		Grid Array			1.425 V	1 mm		0.35 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	820 MHz	30 s		245 °C (473 °F)	35 mm
XC2V10000-6FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XC2V3000-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	750 MHz	30 s	720	225 °C (437 °F)	35 mm
5SGXEA7H3F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
10AX057K2F36I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	432		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					432		35 mm
5AGXFA7K4F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGZME5H2F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
10AS027H2F35E2LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	270000	Yes			CMOS	384		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					384
EP3SL200F1152C4LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	200000	Yes	.94 V		CMOS	744		.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.9 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz	30 s	744	245 °C (473 °F)	35 mm
10AX057H2F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGXFB5K4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
10AS032H2F34E1SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	384		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					384		35 mm
10AX057H4F34E3LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	570000	Yes			CMOS	492		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					492
5SGSMD5H1F35C2L	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	457000	Yes	.88 V	17260	CMOS	552		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		17260 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
10AX066H4F34I3SGES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
EP4SE820H35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	32522		744		0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)		32522 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.5 mm	42 mm						744		42 mm
EP2AGZ350EF35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		554		0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			554		35 mm
EP2AGX95EF35I5ES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	93675				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		93675 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			500 MHz				35 mm
EP3SE260F1152I2N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	744			1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152				No		e1	100 MHz		744
EP2AGX125FF35C5N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
EP2AGX125HF35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		452		0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			452		35 mm
10AS032H1F34E1SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
EP4SGX110HF35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	42240	CMOS	488		.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		42240 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	3	3.6 mm	35 mm	No		e0	800 MHz	20 s	488	220 °C (428 °F)	35 mm
5AGZME1E2F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
EP3SL110F1152C2L	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes			CMOS	744			1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	1			No		e0	100 MHz		744
10AX057H2F34E2SP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	570000	Yes			CMOS	492		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					492
EP4SGX110FF35I4N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	105600	Yes	.93 V	4224	CMOS	372		.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm			4224 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz	30 s	372	245 °C (473 °F)	35 mm
5AGXMB7D4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
10AX066K2F35I2LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
EP3SE110F1152C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V		CMOS	744		.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	3	3.9 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	800 MHz	20 s	744	220 °C (428 °F)	35 mm
5AGXFB7H4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm			e1	670 MHz				35 mm
5AGXFA7D4F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
EP2AGZ300CF35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
10AX115H4F34E3SP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V		CMOS	504		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					504		35 mm
10AX090K1F36I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5SGXEA5K1F35C1	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	432		.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXMA5D6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
5AGTMD3K3F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.