1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2VP40-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1050 MHz	30 s	644	225 °C (437 °F)	35 mm
XC2VP20-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm
XC4VFX60-12FF1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4			No	e0	1181 MHz	30 s	576	225 °C (437 °F)
XC2VP30-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	644	245 °C (473 °F)	35 mm
XC4VFX60-11FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1181 MHz	30 s	576	245 °C (473 °F)	35 mm
XC4VFX60-10FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1028 MHz	30 s	576	245 °C (473 °F)	35 mm
XC2V4000-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	820 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V6000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2V10000-5FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	880 MHz	30 s		225 °C (437 °F)	35 mm
XC2V3000-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	820 MHz	30 s	720	225 °C (437 °F)	35 mm
XC4VFX60-11FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm			6320 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC2V8000-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	824	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	820 MHz	30 s	824	225 °C (437 °F)	35 mm
XC4VFX60-12FFG1152CS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4			No	e1	1181 MHz	30 s	576	245 °C (473 °F)
XC2VP40-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2V4000-4FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	824	225 °C (437 °F)	35 mm
XC4VFX100-12FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1181 MHz	30 s	576	245 °C (473 °F)	35 mm
XQ2VP40-5FF1152N	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes			CMOS	692			1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No	e0	1050 MHz	30 s	692	225 °C (437 °F)
XC2VP30-7FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.28 ns	3424 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1350 MHz	30 s	644	225 °C (437 °F)	35 mm
XC2V3000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	820 MHz	30 s		245 °C (473 °F)	35 mm
XC4VFX100-12FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes	1.26 V	10544	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		10544 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC2VP20-8FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC4VFX60-12FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1181 MHz	30 s	576	245 °C (473 °F)	35 mm
XC2V3000-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	820 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2VP50-6FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	53136	Yes	1.575 V	5904	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1200 MHz	30 s	692	245 °C (473 °F)	35 mm
XC4VFX60-11FFG1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4			No	e1	1181 MHz	30 s	576	245 °C (473 °F)
XC4VFX60-10FF1152CS1	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V		CMOS	576		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1028 MHz	30 s	576	225 °C (437 °F)	35 mm
XC2VP50-8FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC4VFX40-12FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	41904	Yes	1.26 V	4656	CMOS	448		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4656 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1181 MHz	30 s	448	245 °C (473 °F)	35 mm
XC2VP50-7FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5904	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	5904 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	35 mm
XQ4VFX100-11FFG1152I	Xilinx	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.26 V							Grid Array			1.14 V	1 mm	100 °C (212 °F)	0.66 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm							35 mm
XC2VP50-8FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm			5648 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0		30 s		225 °C (437 °F)	35 mm
XC2V3000-4FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	650 MHz	30 s	720	245 °C (473 °F)	35 mm
XC2V3000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2V10000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP20-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1050 MHz	30 s	564	245 °C (473 °F)	35 mm
XC4VFX60-11FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	576		1.2		Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1181 MHz	30 s	576	225 °C (437 °F)	35 mm
XC2V10000-5FFG1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.39 ns	15360 CLBS, 10000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP20-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2V4000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V10000-4FF1152I	Xilinx	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm		0.45 ns	15360 CLBS, 10000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	765 MHz	30 s		225 °C (437 °F)	35 mm
XC4VFX60-11FF1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	56880	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	4			No	e0	1181 MHz	30 s	576	225 °C (437 °F)
XC4VFX100-10FFG1152IS1	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	94896	Yes			CMOS	576			1.2,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4			No	e1	1028 MHz	30 s	576	245 °C (473 °F)
XC2VP30-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	3424 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	644	245 °C (473 °F)	35 mm
XC2V4000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s	824	245 °C (473 °F)	35 mm
XC2VP40-7FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	4848 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP40-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s	692	245 °C (473 °F)	35 mm
XC2V3000-5FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array			1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	750 MHz	30 s		245 °C (473 °F)	35 mm
XC2VP20-7FFG1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array			1.425 V	1 mm		0.28 ns	2320 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e1	1350 MHz	30 s		245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.