1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXFA7D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5AGXMA7G6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5AGTFC7D3F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5SGXMA7K2F35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
5AGXMB3G4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
10AX066K1F35E1MP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
5AGXMB7G6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	500 MHz		544		35 mm
5AGXMB5D4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz				35 mm
5AGXFB7G4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz				35 mm
EP2AGX125CF35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e1	500 MHz				35 mm
10AX090H2F34I1MG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
5SGXEA4K2F35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.93 V	15850	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
5AGXMB3G4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	500 MHz				35 mm
5AGXFB3G6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5AGXFA5K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
EP4SGX230FF35I4	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		9120 CLBS		Tin Lead	Bottom	S-PBGA-B1152	3	3.6 mm	35 mm	No	e0	717 MHz	20 s	564	220 °C (428 °F)	35 mm
5AGXMB3K6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
5AGXFA5G6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz				35 mm
5SGXMA7K2F35I2N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	432	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
5SGXEA5H3F35I4	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				552		35 mm
10AS066H2F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
10AX057K2F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No				396		35 mm
10AX032H2F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	384	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No				384		35 mm
5ASXBB5H4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5AGXMA7D6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz				35 mm
5ASXBB3E6F35C6N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					385		35 mm
5AGXMB7G4F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	622 MHz		544		35 mm
5AGXFA5G6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
EP4SGX230HF35C2ES	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120			.9		Grid Array			.87 V	1 mm	85 °C (185 °F)	9120 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B	4	3.7 mm	35 mm	No	e0	800 MHz				35 mm
10AX027H4F35I3SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
5SGXEA4K2F35I2LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
10AX066K4F35E3LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	660000	Yes			CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No				396
10AS048K3F35E2LP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No				396		35 mm
10AS027H1F35E1MG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
5AGXFB7G6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
5AGXFB7G6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5AGXMA5K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
EP3SE260F1152I2L	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B1152	1			No	e0	100 MHz		744
10AS057H4F34E3LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	570000	Yes			CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No				492
5AGZME3E3F35I3L	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	360000	Yes	1.18 V	13584	TSMC	414	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					414		35 mm
5AGXMB3G6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	362000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	500 MHz		544		35 mm
EP2AGX95HF35I3N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e1	500 MHz				35 mm
EP2AGX95DF35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e1	500 MHz				35 mm
5AGZME7K2F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	534	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	16980 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					534		35 mm
10AX066H1F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
10AX057H1F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
5AGXFB7K4F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
5SGXMA5K1F35C2N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.