1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AS027H2F35E2SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

10AX090K4F36I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

5AGXMA5G6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AS032H2F34I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

5AGXMA7G4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AS048H2F34E2LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

5AGXBB3G4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AX032H4F35E3LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

5AGXMA7G6F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

EP3SL340H1152I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

337500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

4

3.9 mm

40 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

744

220 °C (428 °F)

40 mm

10AS032H4F35E3LP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

320000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

10AS066K1F35I1SGES

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

10AS048K2F35I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

10AS032H1F34I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5AGXBB1D4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

5AGXBA5G6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXMB1G6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5SGXEA5H3F35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5AGZME7K2F35I3L

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

450000

Yes

1.18 V

16980

TSMC

534

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

16980 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

534

35 mm

10AX115K4F36E3SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

10AX057H1F34E1SP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AS057K4F35E3SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

570000

Yes

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

396

EP3SL340H1152I4L

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

337500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

4

3.9 mm

40 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

744

220 °C (428 °F)

40 mm

EP2AGX190EF35C6N

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e1

500 MHz

35 mm

10AS057K3F35I2LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

21708

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

21708 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

396

35 mm

10AS048H2F34E2LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

5SGXMA3H1F35I2

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

432

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

432

10AX032H2F34E2SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

320000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

5ASXBB5G4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

10AX027H2F35I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXMA3K3F35I3LN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP4SGX230HF35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

91200

CMOS

564

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

91200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.6 mm

35 mm

No

e1

30 s

564

245 °C (473 °F)

35 mm

5SGXMA7K3F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGXFB1G4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

5AGXMB5K6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXMB1D4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

EP3SE80F1152C4L

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

80000

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

3

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

744

220 °C (428 °F)

35 mm

5AGXMA5H6F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5ASXFB5G6F35I5N

Altera

FPGA

Industrial

Ball

1152

HBGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

540

35 mm

5SGSMD3H1F35I2

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

236000

Yes

.93 V

8900

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

8900 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5ASXFB3H4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXBB5H4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

5AGXFB5H4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

670 MHz

544

35 mm

10AX057K1F36I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXMA5H1F35I2N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

552

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

EP2AGZ225FF35I4N

Altera

FPGA

Industrial

Ball

1152

HBGA

Square

Plastic/Epoxy

224000

Yes

.93 V

CMOS

554

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

No

e1

500 MHz

554

35 mm

5AGZME3E2F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXBB7D4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.