121 Field Programmable Gate Arrays (FPGA) 53

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40LP4K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No	e1	133 MHz		93	260 °C (500 °F)	5 mm
ICE40LP1K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	95	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No	e1	133 MHz		95	260 °C (500 °F)	5 mm
ICE40HX8K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2			93	260 °C (500 °F)	9 mm
ICE40HX4K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93	1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2			93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2			93	260 °C (500 °F)	9 mm
LIFCL-17-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LCMXO3LF-4300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LFD2NX-40-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3LF-1300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LIFCL-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
ICE40LP1K-CB121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	92	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	No	e1	133 MHz		92	260 °C (500 °F)	6 mm
LIFCL-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LFD2NX-17-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-2100E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LIFCL-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LFD2NX-40-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LIFCL-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
ICE40LP8K-CM121	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2		1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm	No	e1	133 MHz		93	260 °C (500 °F)	5 mm
LIFCL-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LFD2NX-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
ICE40LP8K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm		e1	133 MHz		93	260 °C (500 °F)	5 mm
ICE40LP8K-CM121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93	1.2	Tape and Reel		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,16		1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm		e1	133 MHz		93	260 °C (500 °F)	5 mm
LCMXO3L-2100E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LFD2NX-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-4300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3L-640E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LIFCL-40-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LCMXO3L-4300E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3L-4300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LCMXO3L-4300E-6MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm				30 s	48	260 °C (500 °F)	6 mm
LFD2NX-17-8MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
ICE40HX4K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS		1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm		e2				260 °C (500 °F)	9 mm
LFD2NX-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-1300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	1300	Yes	1.26 V	160		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-640E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LFD2NX-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1		30 s	23	260 °C (500 °F)	6 mm
LCMXO3L-1300E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3L-1300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3L-640E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LCMXO3L-2100E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	2100	Yes	1.26 V	264		100	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1			100	260 °C (500 °F)	6 mm
LCMXO3LF-1300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3LF-2100E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm
LCMXO3LF-4300E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm		e1				260 °C (500 °F)	6 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.