121 Field Programmable Gate Arrays (FPGA) 53

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

ICE40LP4K-CM121TR

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

3520

Yes

1.26 V

440

CMOS

93

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

9.36 ns

440 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

5 mm

e1

93

260 °C (500 °F)

5 mm

ICE40LP4K-CM121TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

440

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

440 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B121

1 mm

5 mm

5 mm

ICE40LP1K-CM121TR1K

Lattice Semiconductor

FPGA

Industrial

Ball

121

VFBGA

Square

Plastic/Epoxy

Yes

1.26 V

160

CMOS

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.4 mm

100 °C (212 °F)

160 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B121

1 mm

5 mm

5 mm

LCMXO3LF-2100E-6MG121I

Lattice Semiconductor

FPGA

Ball

121

VFBGA

Square

Plastic/Epoxy

2100

Yes

1.26 V

264

100

1.2

Grid Array, Very Thin Profile, Fine Pitch

1.14 V

.5 mm

100 °C (212 °F)

264 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B121

3

1 mm

6 mm

e1

100

260 °C (500 °F)

6 mm

LIFCL-40-7MG121A

Lattice Semiconductor

FPGA

Automotive

Ball

121

VFBGA

Square

Plastic/Epoxy

39000

Yes

1.05 V

9750

FDSOI

48

1

Grid Array, Very Thin Profile, Fine Pitch

BGA121,11X11,20

.95 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B121

3

1 mm

6 mm

30 s

48

260 °C (500 °F)

6 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.