132 Field Programmable Gate Arrays (FPGA) 345

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3S50-4CP132I

Xilinx

FPGA

Ball

132

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

89

50000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

192 CLBS, 50000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e0

630 MHz

30 s

89

225 °C (437 °F)

8 mm

XC3S500E-4CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

1164 CLBS, 500000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

LCMXO2-2000HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

2112

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000HE-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-3MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LFXP2-8E-6MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

XC3064-100PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

7 ns

224 CLBS, 3500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

100 MHz

110

37.084 mm

LCMXO2-1200ZE-2MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

XC3S100E-4CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

83

100000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

240 CLBS, 100000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

72

260 °C (500 °F)

8 mm

XC3S500E-4CPG132I

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

1164 CLBS, 500000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

TPC1240GB-132I

Texas Instruments

FPGA

Industrial

Pin/Peg

132

PGA

Square

Ceramic

684

No

CMOS

104

5

5 V

Grid Array

PGA132,13X13

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P132

No

55 MHz

104

5962-9322101MXX

Texas Instruments

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

684

No

5.5 V

684

CMOS

38535Q/M;38534H;883B

104

8000

5

5 V

Grid Array

PGA133M,13X13

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

6.1 ns

684 CLBS, 8000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

34.544 mm

No

54 MHz

104

34.544 mm

TPC1240GB-132C

Texas Instruments

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic

684

No

CMOS

104

5

5 V

Grid Array

PGA132,13X13

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P132

No

66 MHz

104

TPC1240GB-132M

Texas Instruments

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic

684

No

CMOS

104

5

5 V

Grid Array

PGA132,13X13

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Perpendicular

S-XPGA-P132

No

50 MHz

104

5962-9322102MXA

Texas Instruments

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

684

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

5.2 ns

684 CLBS, 8000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P132

4.318 mm

34.544 mm

No

e0

63 MHz

30 s

225 °C (437 °F)

34.544 mm

5962-9322102MXX

Texas Instruments

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

684

No

5.5 V

684

CMOS

38535Q/M;38534H;883B

104

8000

5

5 V

Grid Array

PGA133M,13X13

Field Programmable Gate Arrays

4.5 V

2.54 mm

125 °C (257 °F)

5.2 ns

684 CLBS, 8000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

4.318 mm

34.544 mm

No

63 MHz

104

34.544 mm

5962-9322101MXA

Texas Instruments

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

684

No

5.5 V

684

CMOS

8000

5

Grid Array

4.5 V

2.54 mm

125 °C (257 °F)

6.1 ns

684 CLBS, 8000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P132

4.318 mm

34.544 mm

No

e0

54 MHz

30 s

225 °C (437 °F)

34.544 mm

XC3142-5PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

No

96

XC3164A-5PG132I

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

224 CLBS, 3500 Gates

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 3500-4500

188 MHz

110

37.084 mm

XC3064-100PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

7 ns

224 CLBS, 3500 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

100 MHz

110

37.084 mm

XC3042-125PG132CSPC0107

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

144

CMOS

2000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Matte Tin

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000

e3

125 MHz

37.084 mm

5962-9561002MUC

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

230 MHz

96

37.084 mm

5962-8971302MZC

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

CMOS

MIL-STD-883

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

9 ns

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

e4

70 MHz

96

37.084 mm

XC3142-1PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-XPGA-P132

No

325 MHz

96

XC3142-5PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

144

CMOS

96

3000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

144 CLBS, 3000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

190 MHz

96

37.084 mm

XC3S100E-4CPG132IS1

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

83

100000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

240 CLBS, 100000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

72

260 °C (500 °F)

8 mm

XC3142-2PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

CMOS

96

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Perpendicular

S-PPGA-P132

No

325 MHz

96

XC3064-50PG132M

Xilinx

FPGA

Military

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

224 CLBS, 3500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

50 MHz

110

37.084 mm

XC3S2000-4CP132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3042-70PG132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

144 CLBS, 2000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA

70 MHz

96

37.084 mm

XC3S250E-4CPG132CS1

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

612 CLBS, 250000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

XC3142A-09PG132C

Xilinx

FPGA

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

96

2000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

1.5 ns

144 CLBS, 2000 Gates

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

Typical gates = 2000-3000

370 MHz

96

37.084 mm

XC3S400-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3S200-5CP132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3S400-4CP132I

Xilinx

FPGA

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

192 CLBS, 50000 Gates

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3S250E-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.66 ns

612 CLBS, 250000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

657 MHz

30 s

85

260 °C (500 °F)

8 mm

XC3142-5PG132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

144

No

5.25 V

144

CMOS

96

3000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

190 MHz

96

37.084 mm

XC3S400-5CP132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3064-70PG132CSPC0108

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

224

CMOS

6400

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

9 ns

224 CLBS, 6400 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P132

4.318 mm

37.084 mm

No

MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C

70 MHz

37.084 mm

XC3064-70PP132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

224 CLBS, 3500 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P132

3.7338 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

70 MHz

110

37.084 mm

XC3S500E-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.66 ns

1164 CLBS, 500000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

657 MHz

30 s

85

260 °C (500 °F)

8 mm

XC3042-50PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

144

No

5.25 V

144

CMOS

96

4200

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

144 CLBS, 4200 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

MAX 96 I/OS; 480 flip-flops

e0

50 MHz

96

37.084 mm

XC3064-70PG132I

Xilinx

FPGA

Industrial

Pin/Peg

132

PGA

Square

Ceramic, Metal-Sealed Cofired

224

No

5.5 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

224 CLBS, 3500 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P132

3.9116 mm

37.084 mm

No

688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA

70 MHz

110

37.084 mm

XC3S5000-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

XC3164A-2PP132C

Xilinx

FPGA

Other

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

3500

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

2.2 ns

224 CLBS, 3500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

1

4.191 mm

37.084 mm

No

Typical gates = 3500-4500

323 MHz

110

37.084 mm

XC3S250E-5CP132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.66 ns

612 CLBS, 250000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e0

657 MHz

30 s

85

225 °C (437 °F)

8 mm

XC3S500E-4CP132IS1

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

1164 CLBS, 500000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e0

572 MHz

30 s

85

225 °C (437 °F)

8 mm

XC3S1500-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array, Thin Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B132

1.1 mm

8 mm

No

8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.