132 Field Programmable Gate Arrays (FPGA) 345

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3042-100PP132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	144	CMOS			4200	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C		100 MHz				37.084 mm
XC3042-70PG132M	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No		144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)	9 ns	144 CLBS, 2000 Gates	-55 °C (-67 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e3	70 MHz		96		37.084 mm
XC3S2000-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3164A-5PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 3500-4500		188 MHz		110		37.084 mm
XC3164A-3PG132I	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.5 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	224 CLBS, 3500 Gates			Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 3500-4500		270 MHz		110		37.084 mm
XC3064-50PP132CSPC0108	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	224	CMOS			6400	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		224 CLBS, 6400 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC3142A-09PP132C	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm		1.5 ns	144 CLBS, 2000 Gates			Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		370 MHz		96		37.084 mm
XC3142A1PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.25 V	2.54 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No			323 MHz		96		37.084 mm
XC3164-4PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		230 MHz		110		37.084 mm
XC3064A-7PP132C	Xilinx	FPGA	Other	Pin/Peg	132	HPGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array, Heat Sink/Slug	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Max usable 4500 Logic gates	e0	113 MHz		110		37.084 mm
XA3S250E-4CPG132Q	Xilinx	FPGA	Automotive	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3064-125PG132CSPC0107	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	224	CMOS			3500	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	5.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		125 MHz				37.084 mm
XC3064-50PP132ISPC0108	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC3042A-7PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	HPGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		96	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Max usable 3000 Logic gates		113 MHz		96		37.084 mm
XC3064-100PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA		100 MHz		110		37.084 mm
XC3042-70PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		70 MHz		96		37.084 mm
XC3064-50PP132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC3S500E-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XC3142-4PG132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		96		37.084 mm
XC3S50-5CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS		89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	725 MHz	30 s	89	225 °C (437 °F)	8 mm
XC3142-4PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS		96	3000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	3.3 ns	144 CLBS, 3000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		96		37.084 mm
XC3064-70PG132MSPC0108	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	125 °C (257 °F)	9 ns	224 CLBS, 6400 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		70 MHz				37.084 mm
XC3S1500-5CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3042-50PG132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS		96	4200	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops		50 MHz		96		37.084 mm
XC3S200-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3042-100PG132ISPC0107	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	144	CMOS			2000	5		Grid Array			4.5 V	2.54 mm		7 ns	144 CLBS, 2000 Gates		Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz				37.084 mm
XC3S4000-5CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3064-50PG132B	Xilinx	FPGA	Military	Pin/Peg	132	PGA	Square	Ceramic	224	No			CMOS	38535Q/M;38534H;883B	110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Perpendicular	S-XPGA-P132				No			50 MHz		110
XC3S2000-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3164A-09PP132C	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm		1.5 ns	224 CLBS, 3500 Gates			Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 3500-4500		370 MHz		110		37.084 mm
XC3042-100PG132CSPC0107	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	144	CMOS			2000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000	e3	100 MHz				37.084 mm
XC3142A-3PP132I	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.5 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	144 CLBS, 2000 Gates			Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		270 MHz		96		37.084 mm
XC3S250E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3S50-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS		89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	725 MHz	30 s	89	260 °C (500 °F)	8 mm
XC3164-5PP132C	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	4000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	70 °C (158 °F)	4.1 ns	224 CLBS, 4000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500		190 MHz		110		37.084 mm
XC3042-50PG132CSPC0107	Xilinx	FPGA	Commercial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	144	CMOS			4200	5		Grid Array			4.75 V	2.54 mm	70 °C (158 °F)		144 CLBS, 4200 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C	e3	50 MHz				37.084 mm
XC3S1000-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3064-125PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	125 MHz		110		37.084 mm
XC3142A-4PP132I	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.5 V	144	CMOS		96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm		3.3 ns	144 CLBS, 2000 Gates			Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		227 MHz		96		37.084 mm
XC3S250E-4CP132CS1	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XC3064-100PP132ISPC0107	Xilinx	FPGA		Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			3500	5		Grid Array			4.5 V	2.54 mm		7 ns	224 CLBS, 3500 Gates			Perpendicular	S-PPGA-P132		3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500		100 MHz				37.084 mm
XC3S1000-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3064-100PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	100 MHz		110		37.084 mm
XC3164A-4PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	224	No	5.25 V	224	CMOS		110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	Typical gates = 3500-4500		227 MHz		110		37.084 mm
XC3S250E-5CP132CS1	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	657 MHz	30 s	85	225 °C (437 °F)	8 mm
XC3S4000-4CP132I	Xilinx	FPGA		Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm			192 CLBS, 50000 Gates			Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3S500E-4CPG132CS1	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS		92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3142-4PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No			CMOS		96		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-PPGA-P132				No					96

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.