1508 Field Programmable Gate Arrays (FPGA) 151

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2SGX90FF1508C5N	Intel	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	90960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e1	640 MHz		650		40 mm
EP2SGX130GF1508C4N	Intel	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	132540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e1	717 MHz		734		40 mm
EP1S60F1508C7N	Intel	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		6570 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e1			1022		40 mm
EP2SGX130GF1508I4N	Intel	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	132540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e1	717 MHz		734		40 mm
EP1S80F1508I5	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1508	3			No	e0			1238	220 °C (428 °F)
EP2SGX90FF1508I3N	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	2.99 ns	90960 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e1	622.08 MHz	40 s	650	245 °C (473 °F)	40 mm
EP2S180F1508C4	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	179400	Yes	1.25 V	71760	CMOS	1170	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	71760 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	4	3.5 mm	40 mm	No	e0	717 MHz	20 s	1162	220 °C (428 °F)	40 mm
EP2S130F1508I4	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	53016	CMOS	1126	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	53016 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0	717 MHz	20 s	1118	220 °C (428 °F)	40 mm
EP2SGX90FF1508C4ES	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		4828 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e0					40 mm
EP1S40F1508C7ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S30F1508C6	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S40F1508I5ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S60F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2SGX130GF1508I3	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	3.139 ns	132540 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e0	622.08 MHz		734		40 mm
EP1S30F1508I7ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S60F1508C7	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V	6570	CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		6570 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0		20 s	1022	220 °C (428 °F)	40 mm
EP1S20F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2SGX90FF1508I5	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	90960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e0	622.08 MHz		650		40 mm
EP1S80F1508I7N	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V		CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1508	3			No	e1			1238	245 °C (473 °F)
EP2S130F1508I5	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes			CMOS	1126		1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1508	3			No	e0			1118	220 °C (428 °F)
EP1S30F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S80F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S20F1508C6ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S25F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S40F1508C5ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S10F1508C7ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S10F1508I6ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S80F1508I7ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S40F1508CN	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	41250	Yes			CMOS	822		1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1508	3			No				822	245 °C (473 °F)
EP1S25F1508C6ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S80F1508C7ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S60F1508I5	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S25F1508C7ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S20F1508C5ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S80F1508C6ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2S180F1508C3N	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	179400	Yes	1.25 V	8970	CMOS	1170	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.672 ns	8970 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1508	4	3.5 mm	40 mm	No	e1	717 MHz	30 s	1162	245 °C (473 °F)	40 mm
EP1S20F1508C5	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2S180F1508I4N	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	179400	Yes	1.25 V	8970	CMOS	1170	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	8970 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1508	4	3.5 mm	40 mm	No	e1	717 MHz	30 s	1162	245 °C (473 °F)	40 mm
EP2SGX90FF1508C5ES	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		4828 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e0					40 mm
EP1S60F1508C7ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP1S80F1508C7	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy	79040	Yes	1.575 V	9191	CMOS	1238	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		9191 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	4	3.5 mm	40 mm	No	e0		20 s	1238	220 °C (428 °F)	40 mm
EP1S60F1508C5ES	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2SGX90FF1508C3	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	90960 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0	717 MHz		650		40 mm
EP2SGX90FF1508I5N	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	90960 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e1	622.08 MHz	40 s	650	245 °C (473 °F)	40 mm
EP1S30F1508I5	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP2S180F1508C5	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	179400	Yes	1.25 V	71760	CMOS	1170	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	71760 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	4	3.5 mm	40 mm	No	e0	640 MHz	20 s	1162	220 °C (428 °F)	40 mm
EP1S60F1508I7	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	57120	Yes	1.575 V		CMOS	1022	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1508	3			No	e0			1022	220 °C (428 °F)
EP1S40F1508I7ES	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V						Tin Lead	Bottom	S-PBGA-B1508				No	e0

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.