1508 Field Programmable Gate Arrays (FPGA) 151

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP1S10F1508C7ES

Altera

FPGA

Other

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

No

e0

EP1S10F1508I6ES

Altera

FPGA

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B1508

No

e0

EP2SGX90FF1508C5ES

Altera

FPGA

Commercial Extended

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.25 V

4828

CMOS

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

4828 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3.5 mm

40 mm

No

e0

40 mm

EP1S60F1508C7ES

Altera

FPGA

Other

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

No

e0

EP1S80F1508C7

Altera

FPGA

Commercial Extended

Ball

1508

BGA

Square

Plastic/Epoxy

79040

Yes

1.575 V

9191

CMOS

1238

1.5

1.5,1.5/3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

9191 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

4

3.5 mm

40 mm

No

e0

20 s

1238

220 °C (428 °F)

40 mm

EP1S60F1508C5ES

Altera

FPGA

Other

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

No

e0

EP2SGX90FF1508C3

Altera

FPGA

Other

Ball

1508

BGA

Square

Plastic/Epoxy

90960

Yes

1.25 V

90960

CMOS

650

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4.45 ns

90960 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3

3.5 mm

40 mm

No

e0

717 MHz

650

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.