Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
324 |
CMOS |
10000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
4.6 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 16000 Logic gates |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
3136 |
CMOS |
55000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1 ns |
3136 CLBS, 55000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
6 ns |
196 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
90.9 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1936 |
CMOS |
33000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
85 °C (185 °F) |
0.9 ns |
1936 CLBS, 33000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
294 MHz |
28 mm |
||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
484 |
CMOS |
15000 |
5 |
Flatpack |
4.5 V |
.65 mm |
4.6 ns |
484 CLBS, 15000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 15000-23000 |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
CMOS |
7000 |
5 |
Flatpack |
4.5 V |
.65 mm |
2.7 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 10000 Logic gates |
e3 |
111 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1024 |
CMOS |
18000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1.5 ns |
1024 CLBS, 18000 Gates |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
Max usable 28000 Logic gates |
179 MHz |
28 mm |
||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack |
3 V |
.65 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 6000-10000 |
e0 |
28 mm |
||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
4598 |
Yes |
3.6 V |
1936 |
CMOS |
129 |
33000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug |
HQFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
1 ns |
1936 CLBS, 33000 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Can also use 100000 gates |
e0 |
263 MHz |
129 |
28 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.25 V |
324 |
CMOS |
144 |
6000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
2 ns |
324 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 8000 Logic gates |
e0 |
125 MHz |
30 s |
144 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
576 |
Yes |
CMOS |
192 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
.635 mm |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
No |
e0 |
294 MHz |
30 s |
192 |
225 °C (437 °F) |
||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.5 V |
576 |
CMOS |
192 |
10000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
1.6 ns |
576 CLBS, 10000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e0 |
125 MHz |
30 s |
192 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
CMOS |
7000 |
5 |
Flatpack |
4.5 V |
.65 mm |
2 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 10000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
196 |
CMOS |
3000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.3 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e3 |
166 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.5 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
3.8 ns |
324 CLBS, 10000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Typical gates = 10000-16000 |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
770 |
Yes |
5.25 V |
324 |
CMOS |
129 |
6500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
4 ns |
324 CLBS, 6500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
936 flip-flops; typical gates = 6500-8000 |
e0 |
133.3 MHz |
30 s |
129 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
CMOS |
7000 |
5 |
Flatpack |
4.5 V |
.65 mm |
1.6 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 10000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
484 |
Yes |
5.25 V |
484 |
CMOS |
138 |
6500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
4.1 ns |
484 CLBS, 6500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.94 mm |
28 mm |
No |
MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000 |
e0 |
190 MHz |
30 s |
138 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1600 |
CMOS |
27000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1 ns |
1600 CLBS, 27000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
2432 |
Yes |
3.6 V |
1024 |
CMOS |
129 |
18000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug |
HQFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.2 ns |
1024 CLBS, 18000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 28000 Logic gates |
e0 |
217 MHz |
129 |
28 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
2304 |
CMOS |
40000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
85 °C (185 °F) |
0.9 ns |
2304 CLBS, 40000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
294 MHz |
28 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
1.6 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e0 |
125 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.5 V |
196 |
CMOS |
133 |
6000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
5.6 ns |
196 CLBS, 6000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
133 |
225 °C (437 °F) |
28 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
324 |
CMOS |
10000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
3 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 16000 Logic gates |
e3 |
83 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
CMOS |
7000 |
5 |
Flatpack |
4.5 V |
.65 mm |
400 CLBS, 7000 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
166 MHz |
28 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
CMOS |
3000 |
5 |
Flatpack |
4.5 V |
.65 mm |
2 ns |
196 CLBS, 3000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
28 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
5.25 V |
196 |
CMOS |
133 |
6000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
5.6 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
MAX available 10000 Logic gates |
e0 |
83 MHz |
30 s |
133 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
256 |
CMOS |
4000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
1.6 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 6000 Logic gates |
e3 |
125 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
85 °C (185 °F) |
6 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
90.9 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
160 |
HLFQFP |
Square |
Plastic/Epoxy |
1600 |
Yes |
CMOS |
320 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP160,1.2SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G160 |
No |
e0 |
217 MHz |
320 |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1600 |
CMOS |
27000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
85 °C (185 °F) |
1 ns |
1600 CLBS, 27000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 20000 Logic gates |
e0 |
179 MHz |
30 s |
224 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack |
3 V |
.65 mm |
1.1 ns |
784 CLBS, 13000 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
227 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack |
.65 mm |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
28 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
4000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
70 °C (158 °F) |
4.1 ns |
224 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.94 mm |
28 mm |
No |
MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500 |
e0 |
190 MHz |
30 s |
120 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
320 |
CMOS |
9000 |
5 |
Flatpack |
4.5 V |
.65 mm |
85 °C (185 °F) |
9 ns |
320 CLBS, 9000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
MAX 137 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C |
e0 |
50 MHz |
28 mm |
||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
4598 |
Yes |
3.6 V |
1936 |
CMOS |
129 |
33000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug |
HQFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.1 ns |
1936 CLBS, 33000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Can also use 100000 gates |
e0 |
227 MHz |
129 |
28 mm |
|||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Flatpack, Heat Sink/Slug |
3 V |
.65 mm |
1 ns |
1296 CLBS, 22000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
e3 |
263 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
608 |
Yes |
5.25 V |
256 |
CMOS |
128 |
5000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
6 ns |
256 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
3.92 mm |
28 mm |
No |
768 flip-flops; typical gates = 5000-6000 |
e0 |
90.9 MHz |
30 s |
128 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack |
3 V |
.65 mm |
1 ns |
576 CLBS, 10000 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
263 MHz |
28 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
400 |
CMOS |
7000 |
5 |
Flatpack |
4.5 V |
.65 mm |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e3 |
166 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.75 V |
.65 mm |
85 °C (185 °F) |
5.1 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 4500 Logic gates |
e0 |
113 MHz |
30 s |
120 |
225 °C (437 °F) |
28 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
3 V |
.65 mm |
85 °C (185 °F) |
1.5 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 13000 Logic gates |
e0 |
179 MHz |
30 s |
192 |
225 °C (437 °F) |
28 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
320 |
CMOS |
5000 |
5 |
Flatpack |
4.5 V |
.65 mm |
5.1 ns |
320 CLBS, 5000 Gates |
Matte Tin |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
Max usable 6000 Logic gates |
e3 |
113 MHz |
30 s |
245 °C (473 °F) |
28 mm |
||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack |
4.75 V |
.65 mm |
85 °C (185 °F) |
5.5 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G160 |
3.92 mm |
28 mm |
No |
928 flip-flops; typical gates = 5000-6000 |
125 MHz |
28 mm |
||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
224 |
CMOS |
3500 |
5 |
Flatpack |
4.5 V |
.65 mm |
9 ns |
224 CLBS, 3500 Gates |
Tin Lead |
Quad |
S-PQFP-G160 |
3.92 mm |
28 mm |
No |
688 flip-flops; typical gates = 3500-4500 |
e0 |
70 MHz |
28 mm |
|||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Field Programmable Gate Arrays |
4.5 V |
.65 mm |
2 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
Max usable 5000 Logic gates |
e0 |
125 MHz |
30 s |
112 |
225 °C (437 °F) |
28 mm |
||||||||
Xilinx |
FPGA |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack |
.65 mm |
Quad |
S-PQFP-G160 |
4.1 mm |
28 mm |
No |
28 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.