160 Field Programmable Gate Arrays (FPGA) 703

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4052XLA-09HQG160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm		1.1 ns	1936 CLBS, 33000 Gates		Matte Tin	Quad	S-PQFP-G160		4.1 mm	28 mm	No	Can also use 100000 gates	e3	227 MHz				28 mm
XC4005E-1PQG160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS		3000	5		Flatpack			4.5 V	.65 mm			196 CLBS, 3000 Gates		Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC8103-ESPQ160C	Xilinx	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		3328	5		Flatpack			4.75 V	.65 mm	70 °C (158 °F)	5.5 ns	1024 CLBS, 3328 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 128 I/OS; MAX 512 flip-flops; OTP based						28 mm
XC4044XLA-7HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.1 mm	28 mm	No		e3	294 MHz				28 mm
XC3064-125PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	3500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	125 MHz	30 s	120	225 °C (437 °F)	28 mm
XC4028XL-1HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Max usable 28000 Logic gates		200 MHz				28 mm
XC4013XL-3PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm		1.6 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	166 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4010XL-09PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Typical gates = 7000-20000	e3	217 MHz	30 s		245 °C (473 °F)	28 mm
XC4028XLA-08HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Can also use 50000 gates		263 MHz				28 mm
XC3090-50PQ160ISPC0109	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS		9000	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 137 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				28 mm
XC4005XL-3PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 5000 Logic gates	e0	166 MHz	30 s	112	225 °C (437 °F)	28 mm
XC4010D-4PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	8000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4062XLA-8HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	263 MHz				28 mm
XC4052XLA-9HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	227 MHz				28 mm
XC4013XL-08PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Typical gates = 10000-30000	e0	238 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4010XL-3PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC3164-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	120	4000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.94 mm	28 mm	No	MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500	e0	190 MHz	30 s	120	225 °C (437 °F)	28 mm
XC4020XLA-8PQ160I	Xilinx	FPGA		Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Flatpack			3 V	.65 mm		1 ns	784 CLBS, 13000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	263 MHz				28 mm
CP20420PQFP160A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G160				No		e0			130
CP20420CQFP160A-0I	Renesas Electronics	FPGA	Industrial	Gull Wing	160	QFP	Square	Ceramic	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-XQFP-G160				No		e0			130
CP20420PQFP160A-0I	Renesas Electronics	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G160				No		e0			130
CP20420CQFP160A-0C	Renesas Electronics	FPGA	Commercial	Gull Wing	160	QFP	Square	Ceramic	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Quad	S-XQFP-G160				No		e0			130
UPD65672GDF41	Renesas Electronics	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS	368		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G160				No					368
CP20420CQFP160A-0M	Renesas Electronics	FPGA	Military	Gull Wing	160	QFP	Square	Ceramic	3584	Yes			CMOS	130		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Quad	S-XQFP-G160				No		e0			130
UPD65676GDH54	Renesas Electronics	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes			CMOS	448		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G160				No					448
EPF8452GC-2	Altera	FPGA	Commercial	Pin/Peg	160	PGA	Square	Ceramic	336	No			CMOS	120			3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Perpendicular	S-XPGA-P160	1			No		e0			120	220 °C (428 °F)
EPF8452GC-3	Altera	FPGA	Commercial	Pin/Peg	160	PGA	Square	Ceramic	336	No			CMOS	120			3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays		2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Perpendicular	S-XPGA-P160	1			No		e0			120	220 °C (428 °F)
EPF8820QC-2	Altera	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	672	Yes			CMOS	152		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3			No		e0			148	220 °C (428 °F)
EPF8452QC-2	Altera	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	336	Yes			CMOS	120			3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3			No		e0			120	220 °C (428 °F)
EPF8452QC-3	Altera	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	336	Yes			CMOS	120			3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3			No		e0			120	220 °C (428 °F)
EPF8820QC-3	Altera	FPGA	Commercial	Gull Wing	160	QFP	Square	Plastic/Epoxy	672	Yes			CMOS	152		5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		.635 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3			No		e0			148	220 °C (428 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.