169 Field Programmable Gate Arrays (FPGA) 198

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M02SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
10M08SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				250		11 mm
10M08SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
10M02SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M04SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M08SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
10M16SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
EP4CGX15BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
10M08SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply	e1		30 s	250	260 °C (500 °F)	11 mm
10M08SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				250		11 mm
EP4CGX15BF14I7N	Intel	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm		900 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
10M04SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
10M08SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				250		11 mm
10M16SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M16SCU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	320	260 °C (500 °F)	11 mm
10M04SAU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
10M04SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M04SAU169I7G	Intel	FPGA	Industrial	Ball	169	BGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	250 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				246		11 mm
10M02SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)	125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				246		11 mm
10M16SCU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3	3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays	2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm	No	Also Operates at 3.3 V nominal supply				320		11 mm
10M16SCU169C8G	Intel	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B169	3	1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M16SAU169A7G	Intel	FPGA	Automotive	Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M08SAU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250	3		Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.135 V min 3.3 V nominal and 3.465 max VCC				250		11 mm
EP4CGX30BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
10M16SCU169A7P	Intel	FPGA	Automotive	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	125 °C (257 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
10M16SCU169I7P	Intel	FPGA	Industrial	Ball	169	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA169,13X13,32		2.85 V	.8 mm	100 °C (212 °F)	1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B169		1.55 mm	11 mm		Also Operates at 3.3 V nominal supply				320		11 mm
EP4CGX22BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
EP4CGX15BF14C6N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
EP4CGX30BF14C6N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
EP4CGX30BF14C7N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1840 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
EP4CGX22BF14C7N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
EP4CGX30BF14I7N	Intel	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm		1840 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
EP4CGX22BF14C8	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	1330 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e0	472.5 MHz		72		14 mm
EP4CGX22BF14I7N	Intel	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm		1330 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz	30 s	72	260 °C (500 °F)	14 mm
EP4CGX30DF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
10M16SFU169I7	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B169
EP4CGX22CF14C8N	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm
10M08SFU169C8	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169
10M02SFU169C7G	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169
10M08SAU169C8	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169
10M16SCU169C7	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169
10M04SFU169C8	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169
10M08SFU169I7G	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes			CMOS	130		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B169				No					130
EP4CGX15BF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)	900 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e0	472.5 MHz	20 s	72	235 °C (455 °F)	14 mm
EP4CGX30BF14I7	Altera	FPGA		Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm		1840 CLBS		Tin Lead	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e0	472.5 MHz	20 s	72	235 °C (455 °F)	14 mm
10M04SAU169I6G	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B169
10M16SAU169I7	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes			CMOS	130		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B169				No					130
EP4CGX30CF14C8	Altera	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B169		1.55 mm	14 mm								14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.