169 Field Programmable Gate Arrays (FPGA) 198

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP4CGX15BF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

14400

Yes

1.24 V

900

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

900 CLBS

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

EP4CGX15CF14C8

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M08SAU169C7G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M04SCU169I6G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M04SFU169I6G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M08SAU169I6

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M02SFU169I6

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

EP4CGX22BF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e1

472.5 MHz

30 s

72

260 °C (500 °F)

14 mm

10M02SFU169A7

Altera

FPGA

Automotive

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

10M08SAU169C7

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M08SFU169I6G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

EP4CGX30CF14C8N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX30CF14I7N

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX22CF14C8

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M02SAU169I7G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

EP4CGX30DF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M02SAU169I6

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M02SFU169I7G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M16SCU169C7G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M04SAU169A7G

Altera

FPGA

Automotive

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

EP4CGX15DF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX30BF14C8

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

29440

Yes

1.24 V

1840

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1840 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

EP4CGX22BF14C6

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

10M16SCU169I6

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M04SAU169C8

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M04SCU169A7

Altera

FPGA

Automotive

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

10M02SFU169C8G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M02SCU169A7

Altera

FPGA

Automotive

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

10M02SAU169C8

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

EP4CGX30CF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M04SAU169C7

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M08SFU169C7

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M02SCU169I6G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

EP4CGX15CF14C7

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX15BF14C7

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

14400

Yes

1.24 V

900

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

900 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

EP4CGX30CF14C6N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M04SAU169A7

Altera

FPGA

Automotive

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

EP4CGX22BF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

1330 CLBS

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

10M16SFU169I7G

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

16000

Yes

CMOS

130

3/3.3 V

Grid Array

BGA169,13X13,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B169

No

130

EP4CGX15DF14C7

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

EP4CGX22BF14C7

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

21280

Yes

1.24 V

1330

72

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA169,13X13,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

1330 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B169

3

1.55 mm

14 mm

No

e0

472.5 MHz

20 s

72

235 °C (455 °F)

14 mm

10M04SAU169I6

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

EP4CGX15CF14I7

Altera

FPGA

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

10M16SAU169C7G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M04SFU169C8G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

10M04SAU169I7

Altera

FPGA

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B169

10M02SAU169C7

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

EP4CGX22DF14C6

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.