175 Field Programmable Gate Arrays (FPGA) 174

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC3190-5PG175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

190 MHz

144

42.164 mm

XC3090-125PP175CSPC0107

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

5000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

125 MHz

42.164 mm

XC3190-3PG175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic

320

No

CMOS

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P175

No

144

XC3190A-4PP175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

3.3 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

227 MHz

144

42.164 mm

XC3190A-2PG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.2 ns

320 CLBS, 5000 Gates

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

323 MHz

144

42.164 mm

XC3090-70PG175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

9 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

70 MHz

42.164 mm

XC3090A-7PG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

5.1 ns

320 CLBS, 5000 Gates

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 6000 Logic gates

113 MHz

144

42.164 mm

XC3090-125PG175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

5.5 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

125 MHz

42.164 mm

XC3190A-3PPG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.75 V

2.54 mm

85 °C (185 °F)

2.7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

270 MHz

42.164 mm

XC3090-100PG175C

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

7 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

100 MHz

144

42.164 mm

XC3190A-5PP175I

Xilinx

FPGA

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

4.1 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Typical gates = 5000-6000

188 MHz

144

42.164 mm

XC3090-50PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

9000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops

e0

50 MHz

144

42.164 mm

XC3390A-3PG175I

Xilinx

FPGA

Pin/Peg

175

PGA

Rectangular

Plastic/Epoxy

No

CMOS

5

Grid Array

Perpendicular

R-PPGA-P175

No

5962-9561201MXC

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

MIL-STD-883

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Typical gates = 6500-7500

e4

188 MHz

144

42.164 mm

XC3190-5PG175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

4.1 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500

190 MHz

144

42.164 mm

XC3190A-3PGG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

No

5.5 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

2.7 ns

320 CLBS, 5000 Gates

Perpendicular

S-CPGA-P175

42.164 mm

Max usable 6000 Logic gates

270 MHz

42.164 mm

XC3195A-09PG175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Ceramic, Metal-Sealed Cofired

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.5 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Max usable 7500 Logic gates

370 MHz

144

42.164 mm

XC3090-70PP175ISPC0107

Xilinx

FPGA

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

5000

5

Grid Array

4.5 V

2.54 mm

9 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC3090-100PG175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

7 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.5052 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

100 MHz

42.164 mm

XC3195-5PG175M

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

484

No

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

484 CLBS, 6500 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

190 MHz

144

42.164 mm

5962-8982301MXC

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

320

CMOS

MIL-STD-883

144

9000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

320 CLBS, 9000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

e4

50 MHz

144

42.164 mm

XC3090-70PG175CSPC0107

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

5000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC3090-70PG175MSPC0107

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC3195-3PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

CMOS

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

No

144

XC3195A-4PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 7500 Logic gates

e0

227 MHz

144

42.164 mm

XC3090-125PP175CSPC0109

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.25 V

320

CMOS

9000

5

Grid Array

4.75 V

2.54 mm

70 °C (158 °F)

5.5 ns

320 CLBS, 9000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

125 MHz

42.164 mm

XC3190A-3PP175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

2.7 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

270 MHz

144

42.164 mm

XC3090A-7PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

e0

113 MHz

144

42.164 mm

XC3090-50PP175ISPC0107

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

9000

5

Grid Array

4.5 V

2.54 mm

85 °C (185 °F)

320 CLBS, 9000 Gates

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

3.937 mm

42.164 mm

No

MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C

50 MHz

42.164 mm

XC3195A-5PP175C

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

4.1 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Typical gates = 6500-7500

188 MHz

144

42.164 mm

5962-9561102MXC

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

CMOS

MIL-STD-883

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

e4

230 MHz

144

42.164 mm

5962-9561101MXC

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

320

CMOS

MIL-STD-883

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

4.1 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Typical gates = 5000-6000

e4

188 MHz

144

42.164 mm

XC3195-3PG175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic

484

No

CMOS

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-XPGA-P175

No

144

XC3090-70PG175BSPC0107

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

9 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

70 MHz

42.164 mm

XC3090-70PG175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.5 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

9 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

70 MHz

144

42.164 mm

XC3195A-09PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.5 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 7500 Logic gates

370 MHz

144

42.164 mm

XC3195-3PP175C

Xilinx

FPGA

Commercial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

270 MHz

144

42.164 mm

XC3190A-2PPG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

2.2 ns

320 CLBS, 5000 Gates

Matte Tin

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

e3

323 MHz

42.164 mm

XC3090-100PG175M

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

320

CMOS

144

5000

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

7 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

e0

100 MHz

144

42.164 mm

XC3195-4PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

484

No

5.5 V

484

CMOS

144

6500

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

4.5 V

2.54 mm

85 °C (185 °F)

3.3 ns

484 CLBS, 6500 Gates

-40 °C (-40 °F)

Tin Lead

Perpendicular

S-PPGA-P175

1

3.937 mm

42.164 mm

No

MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000

e0

230 MHz

144

42.164 mm

XC3190A-3PPG175I

Xilinx

FPGA

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

No

5.5 V

320

CMOS

5000

5

Grid Array, Heat Sink/Slug

4.5 V

2.54 mm

2.7 ns

320 CLBS, 5000 Gates

Perpendicular

S-PPGA-P175

4.191 mm

42.164 mm

No

Max usable 6000 Logic gates

270 MHz

42.164 mm

5962-9561101MXX

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

4.1 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

Typical gates = 5000-6000

188 MHz

42.164 mm

5962-9561102MXX

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

CMOS

MIL-STD-883

5

Grid Array

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

e4

42.164 mm

5962-8982302MXX

Xilinx

FPGA

Military

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

320

CMOS

MIL-STD-883

5000

5

Grid Array

2.54 mm

125 °C (257 °F)

2 ns

320 CLBS, 5000 Gates

-55 °C (-67 °F)

Gold

Perpendicular

S-CPGA-P175

4.318 mm

42.164 mm

No

e4

70 MHz

42.164 mm

XC3090-125PG175CSPC0107

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

No

5.25 V

320

CMOS

5000

5

Grid Array

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000

125 MHz

42.164 mm

XC3195A-1PP175C

Xilinx

FPGA

Other

Pin/Peg

175

HPGA

Square

Plastic/Epoxy

484

No

5.25 V

484

CMOS

144

6500

5

5 V

Grid Array, Heat Sink/Slug

PGA175,16X16

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

1.75 ns

484 CLBS, 6500 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P175

1

4.191 mm

42.164 mm

No

Max usable 7500 Logic gates

323 MHz

144

42.164 mm

XC3190-3PP175I

Xilinx

FPGA

Industrial

Pin/Peg

175

PGA

Square

Plastic/Epoxy

320

No

CMOS

144

5

5 V

Grid Array

PGA175,16X16

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Perpendicular

S-PPGA-P175

No

144

XC3090-125PG175C

Xilinx

FPGA

Other

Pin/Peg

175

PGA

Square

Ceramic, Metal-Sealed Cofired

320

No

5.25 V

320

CMOS

144

5000

5

5 V

Grid Array

PGA176,16X16MOD

Field Programmable Gate Arrays

4.75 V

2.54 mm

85 °C (185 °F)

5.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Perpendicular

S-CPGA-P175

3.81 mm

42.164 mm

No

928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA

125 MHz

144

42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.