1761 Field Programmable Gate Arrays (FPGA) 220

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7V2000T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XQ7V585T-L2RF1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG	600	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	45525 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm		e0			600		42.5 mm
XC7V285T-1LFFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7VX485T-2LFFG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950		700	1		Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1			700		42.5 mm
XC7V450T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V450T-3FFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XCE7VX330T-L2FFV1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1761		3.77 mm	42.5 mm					700		42.5 mm
XC7V855T-3FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XCE7VX330T-1FFV1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1761		3.77 mm	42.5 mm					700		42.5 mm
XC7V285T-1FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No	e1		30 s		250 °C (482 °F)
XC7V2000T-G2FHG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	152700			1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm		e1					45 mm
XC7V585T-3FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes		91050					Grid Array				1 mm			91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V450T-1LFFG484I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No	e1		30 s		250 °C (482 °F)
XC7V450T-2FFG784I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XC7V285T-1LFFG784E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XCE7VX690T-1FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.74 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1		30 s		245 °C (473 °F)	42.5 mm
XC7VX485T-1LFFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes		75900					Grid Array				1 mm	100 °C (212 °F)		75900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1					42.5 mm
XCE7V585T-2FFG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG	850	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	45525 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1		30 s	850	245 °C (473 °F)	42.5 mm
XQ7V585T-1RF1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	HKMG	850	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	45525 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm		e0			850		42.5 mm
XC7V285T-1LFFG784C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XC7V450T-3FFG484C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No	e1		30 s		250 °C (482 °F)
XC7V285T-3FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V2000T-2FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	85 °C (185 °F)		305400 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XQ7VX690T-2RF1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	HKMG	850	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm		e0			850		42.5 mm
XC7V585T-1LFFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes		91050					Grid Array				1 mm			91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V450T-1FFG1157C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V450T-3FFG784C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XCE7VX330T-2FFV1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	700	1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1761		3.77 mm	42.5 mm					700		42.5 mm
XC7VX485T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	75900			1		Grid Array			.97 V	1 mm	125 °C (257 °F)		75900 CLBS	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1					42.5 mm
XC7V285T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V285T-1LFFG784I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XCE7VX330T-1FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1		30 s	700	245 °C (473 °F)	42.5 mm
XC7V285T-1LFFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XCE7VX485T-L2FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1		30 s	700	245 °C (473 °F)	42.5 mm
XC7V450T-2FFG484E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)			-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4			No	e1		30 s		250 °C (482 °F)
XC7VX330T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	326400	Yes	1.03 V	25500	CMOS	650	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	25500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	650	245 °C (473 °F)	42.5 mm
XC7V855T-1FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V585T-1LFFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes		91050					Grid Array				1 mm			91050 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V285T-1LFFG1157C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		35 mm	No	e1		30 s		245 °C (473 °F)	35 mm
XC7V855T-2FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array				1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V585T-L2FFG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	582720	Yes	1.03 V	45525	CMOS	750	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	45525 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm	No	e1	1818 MHz	30 s	750	245 °C (473 °F)	42.5 mm
XCE7VX690T-2FFG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150			1		Grid Array			.97 V	1 mm		0.61 ns	54150 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1761	4	3.5 mm	42.5 mm		e1		30 s		245 °C (473 °F)	42.5 mm
XC7V2000T-1FFG1761E	Xilinx	FPGA	Military	Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	125 °C (257 °F)		305400 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm
XC7V450T-3FFG784I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XC7VX485T-3FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	75900		700	1		Grid Array			.97 V	1 mm	85 °C (185 °F)		75900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1			700		42.5 mm
XQ7VX485T-1RF1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	HKMG	700	1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37950 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1761		4.57 mm	42.5 mm		e0			700		42.5 mm
XC7V450T-1FFG784I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin/Silver/Copper	Bottom	S-PBGA-B1761	4			No	e1		30 s		245 °C (473 °F)
XC7V2000T-3FFG1761C	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy		Yes	1.03 V	305400			1		Grid Array			.97 V	1 mm	85 °C (185 °F)		305400 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1761	4		42.5 mm	No	e1		30 s		245 °C (473 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.