196 Field Programmable Gate Arrays (FPGA) 114

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX16-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS		100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
XC6SLX4-3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		106		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.21 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	106	260 °C (500 °F)	8 mm
AGL125V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		133	125000	1.2		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	133	260 °C (500 °F)	8 mm
AGL125V5-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS		133	125000	1.5		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	133	260 °C (500 °F)	8 mm
AGL250V2-CSG196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		145	250000	1.2		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.14 V	.5 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No		e1		30 s	145	260 °C (500 °F)	8 mm
AGL400V5-CS196I	Microchip Technology	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS		143	400000	1.5		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	100 °C (212 °F)		400000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B196		1.2 mm	8 mm	No					143		8 mm
M38510/60811BZX	Texas Instruments	FPGA	Military	Flat	196	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V		CMOS			11000	5		Flatpack			4.5 V	.635 mm	125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No							34.29 mm
XC6SLX16-3NCPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz				8 mm
5962-9230503MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes			CMOS	MIL-STD-883	160		5	5 V	Flatpack, Guard Ring	QFL196,1.4SQ,25	Field Programmable Gate Arrays		.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4	77 MHz		160		28.702 mm
XC7S15-L1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000			100		0.95		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
5962-9752301QZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		34.29 mm
5962-9230501MYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC6SLX9-3NCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz				8 mm
XC6SLX4-1LCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	500 MHz				8 mm
XC4010E-4CBG196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS			7000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Matte Tin	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e3	111 MHz				34.29 mm
5962-9230501MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9230501MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC6SLX4-3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	100	260 °C (500 °F)	8 mm
5962-9230502MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		400	CMOS			8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
5962-9752301QZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-PRF-38535 Class Q		7000	5		Flatpack, Guard Ring			4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000						34.29 mm
5962-9230502MZA	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes		400	CMOS	MIL-STD-883		8000	5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XA6SLX16-2CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	14579	Yes			CMOS	AEC-Q100	106			1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	667 MHz		106
XC6SLX16-3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		106		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.21 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	106	260 °C (500 °F)	8 mm
XA6SLX9-3CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XC7S6-L1FTGB196I	Xilinx	FPGA	Industrial	Ball	196	LFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469			100		0.95		Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		100		15 mm
XC6SLX4-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.05 V	300	CMOS		100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
XC4010-10CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400	CMOS	MIL-STD-883 Class B		8000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 8000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No	1120 flip-flops; typical gates = 8000-10000						28.702 mm
5962-9230501MZC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
5962-9230502MYX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)	6 ns		-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	28.702 mm	No		e4					28.702 mm
XC6SLX16-L1CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.05 V	1139	CMOS		106		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	0.46 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	106	260 °C (500 °F)	8 mm
XC6SLX9-N3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		106		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz		106		8 mm
XC6SLX4-N3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	300					1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm			e1		30 s		260 °C (500 °F)	8 mm
XC4010E-4CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-STD-883 Class B	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	3.302 mm	28.702 mm	No	Typical gates = 7000-20000	e0	111 MHz		160		28.702 mm
XC6SLX16-1LCPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	500 MHz				8 mm
XA6SLX4-3CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XC6SLX9-1LCPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	500 MHz	30 s		260 °C (500 °F)	8 mm
XC4010-5CB196B	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	400		MIL-STD-883 Class B		7000	5		Flatpack, Guard Ring			4.5 V	.65 mm	125 °C (257 °F)		400 CLBS, 7000 Gates	-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
XC4010-6CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.65 mm	125 °C (257 °F)	6 ns	400 CLBS, 8000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196	1	2.921 mm	34.29 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz		160		34.29 mm
XC6SLX16-3NCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz				8 mm
XC6SLX9-L1CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS		106		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	85 °C (185 °F)	0.46 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	106	260 °C (500 °F)	8 mm
XQ4010E-4CB196M	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	2.7 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Maximum usable gates = 20000	e0	111 MHz		160		34.29 mm
5962-9230503MZX	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes			CMOS	MIL-STD-883			5		Flatpack, Guard Ring				.65 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-CQFP-F196		3.302 mm	28.702 mm	No							28.702 mm
XC6SLX16-N3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		106		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz		106		8 mm
XC6SLX9-1LCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	500 MHz				8 mm
5962-9752301QYC	Xilinx	FPGA	Military	Flat	196	GQFF	Square	Ceramic, Metal-Sealed Cofired	950	Yes	5.5 V	400	CMOS	MIL-PRF-38535 Class Q	160	7000	5	5 V	Flatpack, Guard Ring	TPAK196,2.5SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	125 °C (257 °F)	3.9 ns	400 CLBS, 7000 Gates	-55 °C (-67 °F)	Gold	Quad	S-CQFP-F196		3.302 mm	34.29 mm	No	Typical gates = 7000-20000	e4	111 MHz		160		34.29 mm
XC6SLX4-2CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		100		1.2	1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
XA6SLX4-2CPG196I	Xilinx	FPGA		Ball	196	FBGA	Square	Plastic/Epoxy	3840	Yes				AEC-Q100	106			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays		.5 mm					Tin Silver Copper	Bottom	S-PBGA-B196	3			No		e1	62.5 MHz		106
XC6SLX16-N3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS		106		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz	30 s	106	260 °C (500 °F)	8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.