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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | AGL250V2-CSG196I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | AGL250V2-CSG196I Datasheet |
In Stock | 136 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 250000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 1.2 mm |
No. of Inputs: | 145 |
Surface Mount: | Yes |
No. of Outputs: | 145 |
Position Of Terminal: | Bottom |
No. of Terminals: | 196 |
No. of Equivalent Gates: | 250000 |
Package Style (Meter): | Grid Array, Thin Profile, Fine Pitch |
JESD-30 Code: | S-PBGA-B196 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | TFBGA |
Width: | 8 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Industrial |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 6144 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | BGA196,14X14,20 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 8 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |