2104 Field Programmable Gate Arrays (FPGA) 470

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU190-1FLGC2104C	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280		702	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	85 °C (185 °F)	134280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1		702		47.5 mm
XCVU080-L1FFVB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	672			.9		Grid Array			.873 V	1 mm		672 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s		245 °C (473 °F)	47.5 mm
XCKU115-3FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832	1	1 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1	30 s	832	245 °C (473 °F)	47.5 mm
XQVU095-1RFB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes		67200		702	.95		Grid Array					100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B2104			47.5 mm			e0		702		47.5 mm
XQKU115-2RLB2104E	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes		82920			.95		Grid Array						82920 CLBS		Tin Lead	Bottom	S-PBGA-B2104						e0
XCKU115-1FLVB2104E	Xilinx	FPGA	Commercial Extended	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	82920		832	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	82920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-3FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.927 V	75072		832	0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)	75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU27P-2FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	128700		676	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	128700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm					676		52.5 mm
XCVU160-H1FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	115800		702	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	115800 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm		Also Operates at 1 V nominal supply			702		47.5 mm
XCVU080-1FFVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU125-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU125-H1FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm		Also Operates at 1 V nominal supply	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU13P-2FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm					832		52.5 mm
XCVU095-H1FFVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.04 mm	47.5 mm		Also Operates at 1 V nominal supply	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU125-L1FLVA2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200			.9		Grid Array			.873 V			1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1
XCVU11P-3FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000		624	0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm					624		47.5 mm
XCVU125-1FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm			e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU11P-1FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		624	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm					624		47.5 mm
XCVU095-L1FFVA2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	768			.9		Grid Array			.873 V	1 mm		768 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s		245 °C (473 °F)	47.5 mm
XCVU11P-1FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		624	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm					624		47.5 mm
XCVU27P-1FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	128700		676	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	128700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm					676		52.5 mm
XQVU095-2RFB2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes		67200		702	.95		Grid Array					100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B2104			47.5 mm			e0		702		47.5 mm
XCKU095-1FFVB2104E	Xilinx	FPGA	Commercial Extended	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	702	245 °C (473 °F)	47.5 mm
XCVU190-1HFLGC2104E	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280		702	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	134280 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm		Also Operates at 1 V nominal supply			702		47.5 mm
XCVU095-H1FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm		Also Operates at 1 V nominal supply	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-1FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU11P-2FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	37320		624	.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm					624		47.5 mm
XCVU095-L1FFVB2104I	Xilinx	FPGA			2104			Plastic	940800	Yes			CMOS	702	.9	0.9 V		BGA2104,46X46,40	Field Programmable Gate Arrays						Tin Silver Copper			4			No		e1	30 s	702	245 °C (473 °F)
XCVU095-2FFVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU095-1FFVA2104C	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCKU115-3FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)	82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU13P-1FHGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm					832		52.5 mm
XCVU190-1FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800		702	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1		702		47.5 mm
XCVU7P-2FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCKU095-1FFVB2104C	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm	No		e1	30 s	702	245 °C (473 °F)	47.5 mm
XCVU7P-L2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.742 V	98520		832	0.72		Grid Array	BGA2104,46X46,40		.698 V	1 mm	110 °C (230 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm		Also Operates at 0.85 V nominal supply	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCKU095-3FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702	1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	702	245 °C (473 °F)	47.5 mm
XCVU190-H1FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280		702	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	134280 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm		Also Operates at 1 V nominal supply			702		47.5 mm
XCVU080-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832	.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-1FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU13P-1FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm					832		52.5 mm
XQVU7P-1FLRB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		702	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	98520 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e0	5 s	702	250 °C (482 °F)	47.5 mm
XCVU125-1HFLVB2104E	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884	0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)	89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm		Also Operates at 1 V nominal supply	e1	30 s	884	245 °C (473 °F)	47.5 mm
XCVU7P-3FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.927 V	98520		832	0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU125-L1FLVC2104I	Xilinx	FPGA		Ball	2104	BGA	Square	Plastic/Epoxy		Yes	.927 V	1200			.9		Grid Array			.873 V			1200 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2104						e1
XCVU11P-1FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000		624	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm					624		47.5 mm
XCKU19P-1FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300		540	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)	105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm			e1		540		47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.