256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4CE10F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Low Profile			1.15 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm		e0					17 mm
EP1K30FI256-1DX	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			171	220 °C (428 °F)
EP1K50FI256-1F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			186	220 °C (428 °F)
EP3C25U256I6	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	156	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.5 mm	14 mm	No	e0			156		14 mm
EP3C25U256C8	Altera	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No	e0	472.5 MHz	20 s	156	235 °C (455 °F)	14 mm
5CEBA2F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm							17 mm
10M08DCF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP4CE15M9I7N	Altera	FPGA		Ball	256	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm					Bottom	S-PBGA-B256		1.2 mm	9 mm							9 mm
EP1K10FC256-2F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			136	220 °C (428 °F)
EP1K30FI256-1X	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			171	220 °C (428 °F)
EP3C25F256C7ES	Altera	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624			1.2		Grid Array, Low Profile			1.15 V	1 mm	85 °C (185 °F)	24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B256		1.55 mm	17 mm	No	e0	472.5 MHz				17 mm
10M08DCF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256
EP3C5F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.55 mm	17 mm	No	e0			182		17 mm
10M25DFF256I6G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array								Tin Silver Copper	Bottom	S-PBGA-B256					e1

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.