256 Field Programmable Gate Arrays (FPGA) 1,886

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1K100FI256-1P	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP1K100FC256-1P	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP3C10U256A7	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	1.2/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm		10320 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm	No					182		14 mm
EP1K10FI256-2P	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			136	220 °C (428 °F)
10M04DCF256I6G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array								Tin Silver Copper	Bottom	S-PBGA-B256						e1
5CEFA4F17C8N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP3C16U256I6	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.5 mm	14 mm	No		e0			168		14 mm
5CEBA4F17I7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm					Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
5CEFA4F17C6N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CE15M9C7N	Altera	FPGA	Other	Ball	256	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.2 mm	9 mm								9 mm
EP2C8F256C6N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	174	260 °C (500 °F)	17 mm
EP1K100FC256-2P	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
10M25DCF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP1K30FI256-1P	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			171	220 °C (428 °F)
EP1K100FI256-2DX	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP4CE22F17C8LN	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		153	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		153		17 mm
EP4CE10F17	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CE10F17C8LN	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		179	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	645 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		179		17 mm
10M04DCF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP2C20F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1196	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		1196 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			136		17 mm
10M16DFF256I6G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array								Tin Silver Copper	Bottom	S-PBGA-B256						e1
EP1C6F256I7ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5980			1.5		Grid Array			1.425 V	1 mm		5980 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	320 MHz				17 mm
10M08DAF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
10M50DFF256I7G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
5CEBA4F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP1K30FC256-1DX	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			171	220 °C (428 °F)
10M40DAF256A7G	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256						e1
EP4CE22F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1395 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		153		17 mm
EP1C12F256I8ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	275 MHz				17 mm
EP1C6F256I6ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5980			1.5		Grid Array			1.425 V	1 mm		5980 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	405 MHz				17 mm
EP3C16U256C7	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168	1.2		Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	15408 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e0	472.5 MHz	20 s	168	235 °C (455 °F)	14 mm
5CGXFC3B6F17I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	31000	Yes			CMOS	97		1.1,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B256				No					97
EP4CE15F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		165		17 mm
EP1K30FC256-2F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			171	220 °C (428 °F)
EP1K100FC256-1F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
10M04DFF256I7G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
EP1K50FI256-1DX	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP1K100FC256-2DX	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
5CEFA2F17C6N	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP4CE22F17I8LN	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		153	1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm		1395 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		153		17 mm
EP2C8F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	540	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		540 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			174		17 mm
EP1C12F256I7ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	320 MHz				17 mm
EP3C16F256A7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	15408	Yes			CMOS	168		1.2/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B256	1			No		e0			168
10M50DCF256C7G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1			178
10M16DFF256C7G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
EP1C6F256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	598 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	275 MHz	20 s	185	220 °C (428 °F)	17 mm
5CGXFC3B6F17C8N	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	31000	Yes			CMOS	97		1.1,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B256				No					97
EP2C8F256I7N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	540	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		540 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			174		17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.