256 Field Programmable Gate Arrays (FPGA) 1,886

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC7A15-L2FTG256E

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

15360

Yes

1.05 V

CMOS

170

1

1 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

1.05 ns

0 °C (32 °F)

Bottom

S-PBGA-B256

17 mm

No

1286 MHz

170

17 mm

XC7A200T-L2FTG256I

Xilinx

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

215360

Yes

.93 V

16825

500

0.9

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,40

.87 V

1 mm

100 °C (212 °F)

1.51 ns

16825 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

Also Operates at 1 V nominal supply

e1

1098 MHz

30 s

500

260 °C (500 °F)

17 mm

XC4036XLA-09BG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

1296

CMOS

22000

3.3

Grid Array

3 V

1.27 mm

1296 CLBS, 22000 Gates

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

Can also use 65000 gates

e0

27 mm

XC2V80-4FGG256I

Xilinx

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

1152

Yes

1.575 V

128

CMOS

120

80000

1.5

1.5,1.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

0.44 ns

128 CLBS, 80000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

650 MHz

30 s

120

260 °C (500 °F)

17 mm

XCS200E-7FT256C

Xilinx

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

5292

Yes

1.89 V

CMOS

289

1.8

1.8,2.5,3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0.42 ns

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

17 mm

No

e0

400 MHz

289

17 mm

EP1K50FC256-1X

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

2880

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP3C25F256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

CMOS

156

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.55 mm

17 mm

No

e0

156

17 mm

EP4CE15F17C9LN

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.03 V

963

165

1

1,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

265 MHz

165

17 mm

10M25DAF256I6

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B256

EP2C15AF256C7

Altera

FPGA

Commercial Extended

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

144

17 mm

EP4CE6F17

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Low Profile

1.16 V

1 mm

47 CLBS

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP1K50FC256-2X

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

2880

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

10M08DAF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP1K100FI256-1X

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4992

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP2C15AF256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

144

17 mm

10M04DCF256C7G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

4000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

10M50DFF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

EP2C5F256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

4608

Yes

1.25 V

312

CMOS

158

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

312 CLBS

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

150

17 mm

10M50DAF256I6

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B256

EP1C6F256I8

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

185

1.5

1.5,1.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

100 °C (212 °F)

598 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

275 MHz

185

220 °C (428 °F)

17 mm

10M04DFF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C16U256C6

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e0

472.5 MHz

20 s

168

235 °C (455 °F)

14 mm

10M25DCF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP4CE10F17C8L

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.03 V

645

179

1

1,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

645 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

362 MHz

179

17 mm

EP4CE6F17I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

6272

Yes

1.25 V

392

179

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

392 CLBS

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

179

17 mm

EP1K30FC256-2X

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

1728

Yes

CMOS

171

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

171

220 °C (428 °F)

5CEBA2F17I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP3C25F256A7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

1.2/3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

24624 CLBS

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

156

17 mm

10M25DCF256C8

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C16U256I7N

Altera

FPGA

Industrial

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

100 °C (212 °F)

15408 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

168

14 mm

10M04DFF256C7G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

4000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

EP2C20F256C8

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

18752

Yes

1.25 V

1172

CMOS

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

1172 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

402.5 MHz

136

17 mm

10M40DCF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

10M04DFF256A7G

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

e1

10M25DAF256C8

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C16U256C7N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

168

260 °C (500 °F)

14 mm

5CEFA4F17I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP3C25U256C7

Altera

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.5 mm

14 mm

No

e0

472.5 MHz

20 s

156

235 °C (455 °F)

14 mm

EP4CE15F17C7

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

963

165

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

165

17 mm

EP2C15AF256A7N

Altera

FPGA

Automotive

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

903

1.2

Grid Array, Low Profile

1.15 V

1 mm

125 °C (257 °F)

903 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

450 MHz

40 s

260 °C (500 °F)

17 mm

EP2C8AF256I8NES

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

516

1.2

Grid Array, Low Profile

1.15 V

1 mm

516 CLBS

Tin/Silver/Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

402.5 MHz

40 s

260 °C (500 °F)

17 mm

10M25DFF256I7G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

25000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

10M50DFF256C8G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

50000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

10M40DCF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

10M50DFF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C25F256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

24624 CLBS

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

156

17 mm

10M16DFF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C10U256C7N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

10320 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

182

260 °C (500 °F)

14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.