256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A12T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3S250E-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XC4013XLA-8BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1 ns	576 CLBS, 10000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	263 MHz				27 mm
XC7A50T-2FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	17 mm
XA3S1200E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
10M04DFF256C8G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes			CMOS		178		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
10M08DCF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256
EP1C12F256I6	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206			185		1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		1206 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	405 MHz		185	220 °C (428 °F)	17 mm
EP1C6F256C7	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598			185		1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	320 MHz	20 s	185	220 °C (428 °F)	17 mm
EP1K50FI256-2P	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS		186			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP1K30FI256-2F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS		171			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			171	220 °C (428 °F)
10M08DFF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B256
EP3C16U256I8N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS		168		1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No		e1			168		14 mm
EP2C8F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	540	CMOS		182		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm			540 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			174		17 mm
EP2C8AF256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V				182		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			174		17 mm
10M04DFF256I6G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom	S-PBGA-B256						e1
EP4CE15F17I8L	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963			165		1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			963 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		165		17 mm
EP4CE22F17	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47					1.2		Grid Array, Low Profile			1.16 V	1 mm			47 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
10M50DCF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B256
10M08DFF256C8G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes			CMOS		178		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
EP1K100FC256-1X	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS		186			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
5CEFA4F17C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP3C5U256C7N	Altera	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2		Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz	30 s	182	260 °C (500 °F)	14 mm
EP3C5U256C7	Altera	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS		182		1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	14 mm
EP2C15AF256C6	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V				152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
EP2C15AF256I7N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V		CMOS		152		1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e1			144		17 mm
EP3C5F256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS		182		1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			182		17 mm
EPF6010AFI256-2	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	880				10000	3.3		Grid Array			3 V	1 mm		2 ns	880 CLBS, 10000 Gates		Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0	153 MHz			220 °C (428 °F)	17 mm
10M08DAF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256
EP1K50FI256-3F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS		186			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
10M08DFF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B256
EP4CE6U14	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.24 V	47					1.2		Grid Array, Low Profile, Fine Pitch			1.16 V	.8 mm			47 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
EP3C25U256A7	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS		156		1.2	1.2/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm			24624 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm	No					156		14 mm
10M25DAF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256
EPF6010AFC256-3	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	880				10000	3.3		Grid Array			3 V	1 mm	85 °C (185 °F)	2.5 ns	880 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0	133 MHz			220 °C (428 °F)	17 mm
5CEFA2F17I7N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Low Profile			1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
10M25DFF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256
10M16DFF256A7G	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array					125 °C (257 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256						e1
EP2C15AF256I8NES	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	903					1.2		Grid Array, Low Profile			1.15 V	1 mm			903 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	402.5 MHz	40 s		260 °C (500 °F)	17 mm
EP1K50FC256-2F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS		186			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP1C6F256I8ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5980					1.5		Grid Array			1.425 V	1 mm			5980 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	275 MHz				17 mm
10M25DFF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes									Grid Array										Bottom	S-PBGA-B256
EP4CE6F17C8L	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392			179		1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
EP3C5U256I6N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS		182		1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No		e1			182		14 mm
EP1K50FC256-3F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS		186			2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP4CE10F17I8L	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645			179		1	1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			645 CLBS		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	362 MHz		179		17 mm
5CEFA4F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V						1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP1C12F256I6ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060					1.5		Grid Array			1.425 V	1 mm			12060 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	405 MHz				17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.