Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic |
15360 |
Yes |
1.05 V |
CMOS |
170 |
1 |
1 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 °C (212 °F) |
1.05 ns |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
17 mm |
No |
1286 MHz |
170 |
17 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
215360 |
Yes |
.93 V |
16825 |
500 |
0.9 |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,40 |
.87 V |
1 mm |
100 °C (212 °F) |
1.51 ns |
16825 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Also Operates at 1 V nominal supply |
e1 |
1098 MHz |
30 s |
500 |
260 °C (500 °F) |
17 mm |
|||||||||
Xilinx |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
1296 |
CMOS |
22000 |
3.3 |
Grid Array |
3 V |
1.27 mm |
1296 CLBS, 22000 Gates |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.55 mm |
27 mm |
No |
Can also use 65000 gates |
e0 |
27 mm |
||||||||||||||||||
|
Xilinx |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
1152 |
Yes |
1.575 V |
128 |
CMOS |
120 |
80000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
0.44 ns |
128 CLBS, 80000 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
No |
e1 |
650 MHz |
30 s |
120 |
260 °C (500 °F) |
17 mm |
||||||||
Xilinx |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5292 |
Yes |
1.89 V |
CMOS |
289 |
1.8 |
1.8,2.5,3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.71 V |
1 mm |
85 °C (185 °F) |
0.42 ns |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B256 |
3 |
17 mm |
No |
e0 |
400 MHz |
289 |
17 mm |
||||||||||||
Altera |
FPGA |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2880 |
Yes |
CMOS |
186 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
186 |
220 °C (428 °F) |
||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
CMOS |
156 |
1.2 |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
1 |
1.55 mm |
17 mm |
No |
e0 |
156 |
17 mm |
|||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.03 V |
963 |
165 |
1 |
1,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
265 MHz |
165 |
17 mm |
||||||||||
Altera |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
Bottom |
S-PBGA-B256 |
||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Commercial Extended |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
14448 |
Yes |
1.25 V |
152 |
1.2 |
1.2,1.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
Also requires 3.3 V supply |
e0 |
144 |
17 mm |
||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.24 V |
47 |
1.2 |
Grid Array, Low Profile |
1.16 V |
1 mm |
47 CLBS |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
17 mm |
|||||||||||||||||||||||||
Altera |
FPGA |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2880 |
Yes |
CMOS |
186 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
186 |
220 °C (428 °F) |
||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
4992 |
Yes |
CMOS |
186 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
186 |
220 °C (428 °F) |
||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
14448 |
Yes |
1.25 V |
152 |
1.2 |
1.2,1.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
Tin Lead |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
Also requires 3.3 V supply |
e0 |
144 |
17 mm |
|||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
4000 |
Yes |
CMOS |
178 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
No |
e1 |
178 |
||||||||||||||||||
Altera |
FPGA |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
125 °C (257 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
4608 |
Yes |
1.25 V |
312 |
CMOS |
158 |
1.2 |
1.2,1.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
312 CLBS |
Tin Lead |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
Also requires 3.3 V supply |
e0 |
150 |
17 mm |
||||||||||||||
Altera |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
Bottom |
S-PBGA-B256 |
||||||||||||||||||||||||||||||||||
Altera |
FPGA |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5980 |
Yes |
1.575 V |
598 |
185 |
1.5 |
1.5,1.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
100 °C (212 °F) |
598 CLBS |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
No |
e0 |
275 MHz |
185 |
220 °C (428 °F) |
17 mm |
||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
FBGA |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
168 |
1.2 |
Grid Array, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
R-PBGA-B256 |
3 |
2.2 mm |
14 mm |
No |
e0 |
472.5 MHz |
20 s |
168 |
235 °C (455 °F) |
14 mm |
|||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.03 V |
645 |
179 |
1 |
1,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 °C (185 °F) |
645 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
362 MHz |
179 |
17 mm |
|||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.25 V |
392 |
179 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
392 CLBS |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
472.5 MHz |
179 |
17 mm |
||||||||||||||
Altera |
FPGA |
Commercial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
CMOS |
171 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
No |
e0 |
171 |
220 °C (428 °F) |
||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array, Low Profile |
1.07 V |
1 mm |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
17 mm |
|||||||||||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
156 |
1.2 |
1.2/3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
24624 CLBS |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
156 |
17 mm |
|||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Industrial |
Ball |
256 |
FBGA |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
168 |
1.2 |
Grid Array, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
100 °C (212 °F) |
15408 CLBS |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
2.2 mm |
14 mm |
No |
e1 |
472.5 MHz |
168 |
14 mm |
||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
4000 |
Yes |
CMOS |
178 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
No |
e1 |
178 |
||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
18752 |
Yes |
1.25 V |
1172 |
CMOS |
152 |
1.2 |
1.2,1.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
1172 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
Also requires 3.3 V supply |
e0 |
402.5 MHz |
136 |
17 mm |
|||||||||
Altera |
FPGA |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
125 °C (257 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Automotive |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
e1 |
||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
FBGA |
Rectangular |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
15408 |
CMOS |
168 |
1.2 |
Grid Array, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
15408 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
2.2 mm |
14 mm |
No |
e1 |
472.5 MHz |
30 s |
168 |
260 °C (500 °F) |
14 mm |
||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.13 V |
1.1 |
Grid Array, Low Profile |
1.07 V |
1 mm |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
17 mm |
|||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
LFBGA |
Square |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
156 |
1.2 |
Grid Array, Low Profile, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
24624 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.5 mm |
14 mm |
No |
e0 |
472.5 MHz |
20 s |
156 |
235 °C (455 °F) |
14 mm |
|||||||||
Altera |
FPGA |
Other |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
165 |
1.2 |
1.2,1.2/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e0 |
472.5 MHz |
165 |
17 mm |
|||||||||||
|
Altera |
FPGA |
Automotive |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
903 |
1.2 |
Grid Array, Low Profile |
1.15 V |
1 mm |
125 °C (257 °F) |
903 CLBS |
-40 °C (-40 °F) |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
No |
e1 |
450 MHz |
40 s |
260 °C (500 °F) |
17 mm |
||||||||||||||
|
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
516 |
1.2 |
Grid Array, Low Profile |
1.15 V |
1 mm |
516 CLBS |
Tin/Silver/Copper |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
e1 |
402.5 MHz |
40 s |
260 °C (500 °F) |
17 mm |
||||||||||||||||||
|
Altera |
FPGA |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
25000 |
Yes |
CMOS |
178 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
No |
e1 |
178 |
|||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
50000 |
Yes |
CMOS |
178 |
1.2 |
1.2 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
No |
e1 |
178 |
||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
Altera |
FPGA |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
24624 |
Yes |
1.25 V |
24624 |
CMOS |
156 |
1.2 |
Grid Array, Low Profile |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
24624 CLBS |
Bottom |
S-PBGA-B256 |
1.55 mm |
17 mm |
No |
156 |
17 mm |
||||||||||||||||||
Altera |
FPGA |
Other |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
Yes |
Grid Array |
85 °C (185 °F) |
0 °C (32 °F) |
Bottom |
S-PBGA-B256 |
|||||||||||||||||||||||||||||||
|
Altera |
FPGA |
Other |
Ball |
256 |
FBGA |
Rectangular |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
10320 |
CMOS |
182 |
1.2 |
Grid Array, Fine Pitch |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 °C (185 °F) |
10320 CLBS |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B256 |
3 |
2.2 mm |
14 mm |
No |
e1 |
472.5 MHz |
30 s |
182 |
260 °C (500 °F) |
14 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.