256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A35T-L1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A15T-L2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC6SLX9-3NFTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC4010XL-2BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS			7000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e1	179 MHz	30 s		250 °C (482 °F)	27 mm
XC4028XLA-09BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS		256	18000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	1024 CLBS, 18000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	27 mm
XC4020XLA-7BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz				27 mm
XC2S600E-7FTGG256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XA3S1200E-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	AEC-Q100	190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)	4.88 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC2V500-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS		172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	768 CLBS, 500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	820 MHz	30 s	172	225 °C (437 °F)	17 mm
XC6SLX16-1LFT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC7A75T-3FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	300	260 °C (500 °F)	17 mm
XC3S250E-4FT256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XCV100-5FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Grid Array			2.375 V	1 mm		0.7 ns	600 CLBS, 108904 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	294 MHz				17 mm
XC2VP4-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6768	Yes	1.575 V	752	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	752 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1200 MHz	30 s	140	260 °C (500 °F)	17 mm
XC4028XLA-9BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	1024 CLBS, 18000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	227 MHz				27 mm
XC2V40-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS		88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	750 MHz	30 s	88	260 °C (500 °F)	17 mm
XCV300-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1					17 mm
XC7A75T-L2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900			300		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XCS100E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns		0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		202		17 mm
XC2S300E-7FTGG256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.89 V	1536				93000	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2 mm	17 mm	No	Maximum usable gates = 300000	e1	400 MHz				17 mm
XC7A25T-3FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC4020XLA-07BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XC7A25T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG		150		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC2S50E-6FTGG256I	Xilinx	FPGA		B	256	FBGA	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Grid Array, Fine Pitch			1.71 V	1 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Maximum usable gates = 150000	e1	357 MHz				17 mm
XA6SLX16-3FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	14579	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XCV150-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1 mm		0.8 ns	864 CLBS, 164674 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XCV300-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0					27 mm
XC2VP4-8FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	752	CMOS				1.5		Grid Array			1.425 V	1 mm			752 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0		30 s		225 °C (437 °F)	17 mm
XC3S1500-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC7A12T-L2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG		150		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XCV300-4BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1					27 mm
XCS40XL-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	205	225 °C (437 °F)	27 mm
XC2V1000-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	820 MHz	30 s	172	260 °C (500 °F)	17 mm
XC4028XLA-8BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm		1 ns	1024 CLBS, 18000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	263 MHz				27 mm
XC7A12T-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XA6SLX25-2FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	24051	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC2V1000-4FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS		172	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC4036XLA-08BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 65000 gates	e0					27 mm
XCV200E-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1176 CLBS, 63504 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XC6SLX16-1LFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	500 MHz				17 mm
XC4020XLA-07BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e0	294 MHz	30 s	224	225 °C (437 °F)	27 mm
XC7A100T-L2FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XCV200E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XC7A15T-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
XC3S200-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	725 MHz	30 s	173	260 °C (500 °F)	17 mm
XC4020XLA-9BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	227 MHz				27 mm
XC2V80-6FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	128 CLBS, 80000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	820 MHz	30 s	120	260 °C (500 °F)	17 mm
XC4020XLA-8BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	263 MHz				27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.