256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S50A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS		144	50000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	112	225 °C (437 °F)	17 mm
XC3S250E-5FT256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	657 MHz	30 s	132	225 °C (437 °F)	17 mm
XC6SLX16-3NFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC4020XLA-08BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm		1 ns	784 CLBS, 13000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e1	263 MHz	30 s		250 °C (482 °F)	27 mm
XC2V250-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	750 MHz	30 s	172	260 °C (500 °F)	17 mm
XCV200-6FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm		0.6 ns	1176 CLBS, 236666 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	333 MHz				17 mm
XC7A15-2FTG256C	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)		Bottom	S-PBGA-B256			17 mm	No			1286 MHz		170		17 mm
XA3S500E-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	AEC-Q100	190	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	4.88 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	149	260 °C (500 °F)	17 mm
XC6SLX25-3NFTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC6SLX25-1LFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	500 MHz				17 mm
XC7A100T-L1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XCS40-3BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	5.5 V	784				13000	5		Grid Array			4.5 V	1.27 mm			784 CLBS, 13000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	27 mm	No		e0					27 mm
XC2S150E-7FTG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS		265	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e1	400 MHz	30 s	265	260 °C (500 °F)	17 mm
XCV100-4BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	27 mm
XA3S200-4FT256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm			480 CLBS, 200000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	125 MHz	30 s	173	225 °C (437 °F)	17 mm
XCV100-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		176	108904	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm		0.7 ns	600 CLBS, 108904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	294 MHz	30 s	176	225 °C (437 °F)	17 mm
XC3S1200E-5FTG256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	657 MHz	30 s	150	260 °C (500 °F)	17 mm
XC2V250-6FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS		172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.35 ns	384 CLBS, 250000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	820 MHz	30 s	172	260 °C (500 °F)	17 mm
XCV100E-6FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	357 MHz	30 s	176	260 °C (500 °F)	17 mm
XCV300-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1					27 mm
XC2S200E-6FT256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	5292	Yes			CMOS		182			1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0	357 MHz	30 s	182	240 °C (464 °F)
XC2S150E-7FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V	864	CMOS		263	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	263	240 °C (464 °F)	17 mm
XQV100-4BG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	MIL-PRF-38535	180	108904	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	125 °C (257 °F)	0.8 ns	600 CLBS, 108904 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0		30 s	180	225 °C (437 °F)	27 mm
XC3S5000-4FT256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm			192 CLBS, 50000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm
XA3S1600E-4FTG256I	Xilinx	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS			1600000	1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)	4.88 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s		260 °C (500 °F)	17 mm
XC4013XL-2BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS			10000	3.3		Grid Array			3 V	1.27 mm		1.5 ns	576 CLBS, 10000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e1	179 MHz	30 s		250 °C (482 °F)	27 mm
XC3S50-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm
XC3S250E-4FT256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	17 mm
XA3S200A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	AEC-Q100	195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	160	260 °C (500 °F)	17 mm
XA3S200-4FT256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V	480		AEC-Q100	173	200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		480 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	125 MHz	30 s	173	225 °C (437 °F)	17 mm
XCV100E-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	600 CLBS, 32400 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XCV200E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS		176	63504	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC3S1000L-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS		173	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	173	260 °C (500 °F)	17 mm
XC2S50E-6FTG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		182	23000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 50000	e1	357 MHz	30 s	182	260 °C (500 °F)	17 mm
XC7A200T-2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1286 MHz	30 s	500	260 °C (500 °F)	17 mm
XCV100E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC3S1200E-4FT256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	572 MHz	30 s	150	225 °C (437 °F)	17 mm
XCV50-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS			57906	2.5		Grid Array			2.375 V	1 mm		0.8 ns	384 CLBS, 57906 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XCV300-4BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm		0.6 ns	1536 CLBS, 322970 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0					27 mm
XC4028XL-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 18000-50000	e1	217 MHz	30 s		250 °C (482 °F)	27 mm
XC7A15T-L1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300			250		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC4036XLA-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 65000 gates	e1					27 mm
XCS100E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		202		17 mm
XC7A8-1FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	8000	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
5962-9851301NUA	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B256		2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e0	166 MHz				27 mm
XC7A15-1FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	15360	Yes	1.05 V		CMOS		170		1	1 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B256			17 mm	No			1098 MHz		170		17 mm
XC7A100T-L1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925			300		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC4020XLA-9BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm		1.1 ns	784 CLBS, 13000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	227 MHz				27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.