256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV100E-8FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	416 MHz	30 s	176	260 °C (500 °F)	17 mm
XC2S400E-7FTG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 400000	e1	400 MHz	30 s	410	260 °C (500 °F)	17 mm
XS2S100-5-FG256C	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes			CMOS		196			1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0		30 s	196	225 °C (437 °F)	17 mm
XC7A200T-3FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	500	260 °C (500 °F)	17 mm
XC6SLX25-N3FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		186		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	1879 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz		186		17 mm
XC2VP2-5FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS		140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.36 ns	352 CLBS		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	1050 MHz	30 s	140	260 °C (500 °F)	17 mm
XCV200-6BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		180	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm		0.6 ns	1176 CLBS, 236666 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	333 MHz	30 s	180	225 °C (437 °F)	27 mm
XCV100E-7FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS		176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	600 CLBS, 32400 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XC3S700A-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS		161	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XCS300E-7FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS		329		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns		0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	400 MHz		329		17 mm
XCV300-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.5 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1					17 mm
XC2S150-5FG256Q	Xilinx	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864	CMOS		180	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)		864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	263 MHz	30 s	176	225 °C (437 °F)	17 mm
XC2V80-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	820 MHz	30 s	120	260 °C (500 °F)	17 mm
XCV50-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		180	57906	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	294 MHz	30 s	180	225 °C (437 °F)	27 mm
XA6SLX9-3FTG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	9152	Yes				AEC-Q100	186			1.2,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B256	3			No		e1	62.5 MHz	30 s	186	260 °C (500 °F)
XC3S500E-5FT256CS1	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	10476	Yes			CMOS		190			1.2,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0	657 MHz	30 s	149	225 °C (437 °F)
XA3S400-4FTG256Q	Xilinx	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	125 MHz	30 s	264	260 °C (500 °F)	17 mm
XC4028XLA-8BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm		1 ns	1024 CLBS, 18000 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	263 MHz				27 mm
XC4020XLA-8BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	263 MHz				27 mm
XC4020XL-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 13000-40000	e1	217 MHz	30 s		250 °C (482 °F)	27 mm
XCV200-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176	CMOS		180	236666	2.5	1.2/3.6,2.5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	250 MHz	30 s	180	225 °C (437 °F)	27 mm
XCV300E-7FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XCV100-4FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS			108904	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XCV300-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1 mm		0.5 ns	1536 CLBS, 322970 Gates		Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0					17 mm
XC3S1200E-5FT256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS		190	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	657 MHz	30 s	150	225 °C (437 °F)	17 mm
XC3S250E-5FTG256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	657 MHz	30 s	132	260 °C (500 °F)	17 mm
XC6SLX9-3NFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz				17 mm
XC4036XLA-07BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS			22000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 65000 gates	e0					27 mm
XC3S5000-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm
XC7A200T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	17 mm
XC4020XLA-7BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS			13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	294 MHz				27 mm
XC4028XL-1BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS			18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 28000 Logic gates	e1	200 MHz	30 s		250 °C (482 °F)	27 mm
XCV50E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4013XL-2BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.5 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	179 MHz	30 s	192	225 °C (437 °F)	27 mm
XCS40XL-3BG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784				13000	3.3		Grid Array			3 V	1.27 mm			784 CLBS, 13000 Gates		Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	27 mm	No		e0					27 mm
XC2S300E-6FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS		329	93000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	1536 CLBS, 93000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	329	240 °C (464 °F)	17 mm
XC2VP2-8FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	352	CMOS				1.5		Grid Array			1.425 V	1 mm			352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0		30 s		225 °C (437 °F)	17 mm
XCV150-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS			164674	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XCV200-4FGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS			236666	2.5		Grid Array			2.375 V	1 mm		0.8 ns	1176 CLBS, 236666 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	250 MHz				17 mm
XCV50E-7FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS		176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XCV300-6BGG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm		0.4 ns	1536 CLBS, 322970 Gates		Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1					27 mm
XC7A12T-L1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG		150		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC2V80-5FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS		120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	750 MHz	30 s	120	260 °C (500 °F)	17 mm
XQ4013XL-3BGG256N	Xilinx	FPGA	Military	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS	MIL-PRF-38535		10000	3.3		Grid Array			3 V	1.27 mm	125 °C (257 °F)	1.6 ns	576 CLBS, 10000 Gates	-55 °C (-67 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 10000 to 30000	e1	166 MHz	30 s		250 °C (482 °F)	27 mm
XCV300-6BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS			322970	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0					27 mm
XC2S150E-6FT256Q	Xilinx	FPGA		Ball	256	BGA	Square	Plastic	3888	Yes			CMOS		182			1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0	357 MHz	30 s	178	240 °C (464 °F)
XA6SLX16-2FT256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	14579	Yes			CMOS	AEC-Q100	186			1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B256	3			No		e0	667 MHz	30 s	186	225 °C (437 °F)
XC3S250E-4FTG256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.