256 Field Programmable Gate Arrays (FPGA) 1,886

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10M25DCF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

10M50DFF256I6G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Tin Silver Copper

Bottom

S-PBGA-B256

e1

EP1K10FI256-2F

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

CMOS

136

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

136

220 °C (428 °F)

EP2C5F256C8

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

4608

Yes

1.25 V

288

CMOS

158

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

288 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

402.5 MHz

20 s

150

235 °C (455 °F)

17 mm

EP1K50FI256-1P

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2880

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

10M40DFF256I7G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

40000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

10M25DFF256A7G

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

e1

10M16DFF256C8

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

10M40DAF256I7

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B256

EP2C15AF256I6

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

144

17 mm

EP3C25U256I7

Altera

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

100 °C (212 °F)

24624 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.5 mm

14 mm

No

e0

472.5 MHz

20 s

156

235 °C (455 °F)

14 mm

EP4CE15F17C8LN

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.03 V

963

165

1

1,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

963 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

362 MHz

165

17 mm

10M16DAF256C8

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

10M40DFF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

EP4CE10U14

Altera

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

Yes

1.24 V

47

1.2

Grid Array, Low Profile, Fine Pitch

1.16 V

.8 mm

47 CLBS

Bottom

S-PBGA-B256

1.5 mm

14 mm

14 mm

EP1C6F256C6

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

185

1.5

1.5,1.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1.425 V

1 mm

85 °C (185 °F)

598 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

e0

405 MHz

20 s

185

220 °C (428 °F)

17 mm

10M16DAF256A7

Altera

FPGA

Automotive

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

10M40DFF256C8G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

40000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

EP3C5U256I7

Altera

FPGA

Industrial

Ball

256

LFBGA

Square

Plastic/Epoxy

5136

Yes

1.25 V

5136

CMOS

182

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

100 °C (212 °F)

5136 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.5 mm

14 mm

No

e0

472.5 MHz

20 s

182

235 °C (455 °F)

14 mm

10M16DAF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

EP3C25F256C6

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

24624

Yes

1.25 V

24624

CMOS

156

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

24624 CLBS

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

472.5 MHz

20 s

156

235 °C (455 °F)

17 mm

EP1K100FC256-2F

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4992

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP1K10FI256-1DX

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

CMOS

136

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

136

220 °C (428 °F)

EP3C10F256I6N

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

182

17 mm

5CGXFC3B6F17C6

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

31000

Yes

CMOS

97

1.1,1.2/3.3,2.5 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B256

No

97

EP3C16U256C6N

Altera

FPGA

Other

Ball

256

FBGA

Rectangular

Plastic/Epoxy

15408

Yes

1.25 V

15408

CMOS

168

1.2

Grid Array, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

15408 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B256

3

2.2 mm

14 mm

No

e1

472.5 MHz

30 s

168

260 °C (500 °F)

14 mm

EP3C5F256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

5136

Yes

1.25 V

CMOS

182

1.2

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.55 mm

17 mm

No

e0

182

17 mm

EP1K100FI256-2F

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4992

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP2C15AF256I6N

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

CMOS

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e1

144

17 mm

EP1C12F256C6ES

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

1.575 V

12060

1.5

Grid Array

1.425 V

1 mm

12060 CLBS

Tin Lead

Bottom

S-PBGA-B256

2.2 mm

17 mm

No

e0

405 MHz

17 mm

10M08DFF256I7G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

10M08DCF256C7G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

8000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

EP2C5F256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

4608

Yes

1.25 V

288

CMOS

158

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

288 CLBS

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

402.5 MHz

20 s

150

235 °C (455 °F)

17 mm

EP4CE15F17A7N

Altera

FPGA

Automotive

Ball

256

LBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

963

165

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

125 °C (257 °F)

963 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

472.5 MHz

165

17 mm

5CEFA2F17I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EPF6010AFC256-2

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

3.6 V

880

10000

3.3

Grid Array

3 V

1 mm

85 °C (185 °F)

2 ns

880 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

17 mm

No

e0

153 MHz

220 °C (428 °F)

17 mm

5CEFA2F17C7N

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP1K50FC256-2P

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

2880

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP1K10FC256-1DX

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

CMOS

136

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

136

220 °C (428 °F)

EP4CE10F17C8

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

179

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

179

17 mm

EP2C15AF256I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

144

17 mm

EP1K100FI256-1P

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

4992

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP1K100FC256-1P

Altera

FPGA

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

4992

Yes

CMOS

186

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

186

220 °C (428 °F)

EP3C10U256A7

Altera

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

10320

Yes

1.25 V

10320

CMOS

182

1.2

1.2/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

10320 CLBS

Bottom

S-PBGA-B256

1.5 mm

14 mm

No

182

14 mm

EP1K10FI256-2P

Altera

FPGA

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

576

Yes

CMOS

136

2.5,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

No

e0

136

220 °C (428 °F)

10M04DCF256I6G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Tin Silver Copper

Bottom

S-PBGA-B256

e1

5CEFA4F17C8N

Altera

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

EP3C16U256I6

Altera

FPGA

Ball

256

LFBGA

Square

Plastic/Epoxy

15408

Yes

1.25 V

CMOS

168

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

Tin Lead

Bottom

S-PBGA-B256

1

1.5 mm

14 mm

No

e0

168

14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.