256 Field Programmable Gate Arrays (FPGA) 1,886

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1K10FC256-2DX	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			136	220 °C (428 °F)
10M04DFF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256
EP3C16F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V		CMOS	168	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1			168		17 mm
5CEFA2F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP1K30FC256-3F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes			CMOS	171		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			171	220 °C (428 °F)
5CEBA2F17A7	Altera	FPGA	Automotive	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP2C8F256C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	182	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	516 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	500 MHz	20 s	174	235 °C (455 °F)	17 mm
10M04DAF256A7G	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256						e1
10M04DFF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP1K50FI256-2X	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP1K100FI256-1F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP3C10F256C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	17 mm
EP3C10U256C6	Altera	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.5 mm	14 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	14 mm
10M40DAF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
10M16DCF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256
EP1C12F256C7ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	12060			1.5		Grid Array			1.425 V	1 mm		12060 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	320 MHz				17 mm
EP2C5AF256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.25 V	288			1.2		Grid Array, Low Profile			1.15 V	1 mm		288 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	402.5 MHz				17 mm
10M50DFF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
10M04DFF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256
EP1C12F256I8	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	1206 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	275 MHz		185	220 °C (428 °F)	17 mm
EP3C10F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	10320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz	20 s	182	235 °C (455 °F)	17 mm
5CGXFC3B6F17C8	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	31000	Yes			CMOS	97		1.1,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B256				No					97
EP1C6F256C7ES	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	5980			1.5		Grid Array			1.425 V	1 mm		5980 CLBS		Tin Lead	Bottom	S-PBGA-B256		2.2 mm	17 mm	No		e0	320 MHz				17 mm
5CEFA2F17C7	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP3C25F256I6N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	24624	Yes	1.25 V		CMOS	156	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1			156		17 mm
5CGXFC3B6F17C7N	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	31000	Yes			CMOS	97		1.1,1.2/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B256				No					97
EP3C5U256A7	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V	5136	CMOS	182	1.2	1.2/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm		5136 CLBS			Bottom	S-PBGA-B256		1.5 mm	14 mm	No					182		14 mm
EP1K50FC256-2DX	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP3C10U256A7N	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy	10320	Yes	2.625 V	10320	CMOS	182	2.5	1.2/3.3 V	Grid Array	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	1 mm	125 °C (257 °F)	10320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1		30 s	182	260 °C (500 °F)	17 mm
EP1K10FI256-2X	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			136	220 °C (428 °F)
EP1K50FC256-1F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP2C20F256C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	500 MHz	20 s	136	235 °C (455 °F)	17 mm
EP3C10F256A7	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182	1.2	1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		10320 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm	No					182		17 mm
EP3C10U256I8	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm				Tin Lead	Bottom	S-PBGA-B256	1	1.5 mm	14 mm	No		e0			182		14 mm
5CEFA4F17C6	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
10M50DAF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256
10M25DAF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP2C15AF256C7	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
EP4CE6F17	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array, Low Profile			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
EP1K50FC256-2X	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
10M08DAF256C7	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256
EP1K100FI256-1X	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
EP2C15AF256I8	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
10M04DCF256C7G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1			178
10M50DFF256A7	Altera	FPGA	Automotive	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256
EP2C5F256I6	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	312	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm		312 CLBS		Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			150		17 mm
10M50DAF256I6	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
EP1C6F256I8	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		185	1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	598 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	275 MHz		185	220 °C (428 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.