2577 Field Programmable Gate Arrays (FPGA) 38

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	JESD-609 Code	No. of Outputs	Length
XCVU29P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000	676	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU9P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU27P-2FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU13P-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU190-1FLGA2577C	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280	702	0.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	85 °C (185 °F)	134280 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.31 mm	52.5 mm		e1	702	52.5 mm
XCVU29P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU27P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU13P-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000	832	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU190-1HFLGA2577E	Xilinx	FPGA		Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280	702	0.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)	134280 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.31 mm	52.5 mm	Also Operates at 1 V nominal supply		702	52.5 mm
XCVU11P-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			624	52.5 mm
XCVU190-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)	1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.01 mm	52.5 mm		e1	702	52.5 mm
XCVU9P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU11P-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000	624	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			624	52.5 mm
XCVU9P-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.927 V	147780	832	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU29P-1FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU29P-2FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU13P-2FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			832	52.5 mm
XCVU190-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)	1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.01 mm	52.5 mm		e1	702	52.5 mm
XCVU13P-1FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			832	52.5 mm
XCVU190-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800	702	.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)	1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.01 mm	52.5 mm		e1	702	52.5 mm
XCVU27P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000	676	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU29P-1FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU11P-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.24 mm	52.5 mm		e1	624	52.5 mm
XCVU9P-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU13P-1FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			832	52.5 mm
XCVU27P-1FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU13P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU190-H1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	134280	702	0.95	Grid Array	BGA2577,51X51,40	.922 V	1 mm	100 °C (212 °F)	134280 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.31 mm	52.5 mm	Also Operates at 1 V nominal supply		702	52.5 mm
XCVU9P-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.24 mm	52.5 mm		e1	832	52.5 mm
XCVU190-L1FLGA2577I	Xilinx	FPGA		Ball	2577	BGA	Square	Plastic/Epoxy		Yes	.927 V	1800		.9	Grid Array		.873 V	1 mm		1800 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2577	4.01 mm	52.5 mm		e1		52.5 mm
XCVU13P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			832	52.5 mm
XCVU11P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			624	52.5 mm
XCVU11P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			624	52.5 mm
XCVU190-3FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	1.03 V	1800	702	1	Grid Array	BGA2577,51X51,40	.97 V	1 mm	100 °C (212 °F)	1800 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.01 mm	52.5 mm		e1	702	52.5 mm
XCVU27P-1FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	676	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			676	52.5 mm
XCVU13P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577	4.24 mm	52.5 mm			832	52.5 mm
XCVU13P-3FSGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000	832	0.9	Grid Array	BGA2577,51X51,40	.873 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577	4.51 mm	52.5 mm			832	52.5 mm
XCVU13P-2FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2577,51X51,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577	4.24 mm	52.5 mm		e1	832	52.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.