2892 Field Programmable Gate Arrays (FPGA) 13

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU37P-2FSVH2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	2851800	Yes	.876 V	162960	624	0.85	Grid Array	BGA2892,54X54,40	.825 V	1 mm	100 °C (212 °F)	162960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892	4	4.51 mm	55 mm		e1	30 s	624	240 °C (464 °F)	55 mm
XCVU440-1FLGA2892C	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	85 °C (185 °F)	2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1		1456		55 mm
XCVU440-2FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)	2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1		1456		55 mm
XCVU440-3FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	2880	1456	1	Grid Array	BGA2892,54X54,40	.97 V	1 mm	100 °C (212 °F)	2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1		1456		55 mm
XCVU37P-1FSGH2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy		Yes		162960		.85	Grid Array			1 mm	100 °C (212 °F)	162960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		4.51 mm	55 mm		e1				55 mm
XCVU440-L1FLGA2892I	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy		Yes	.927 V	2880		.9	Grid Array		.873 V	1 mm		2880 CLBS		Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1				55 mm
XCVU440-1FLGA2892I	Xilinx	FPGA	Industrial	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)	2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1		1456		55 mm
XCVU440-L1FLGA2892C	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.92 V	316620	1456	0.9	Grid Array	BGA2892,54X54,40	.88 V	1 mm	85 °C (185 °F)	316620 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2892		4.13 mm	55 mm	Also Operates at 0.95 V nominal supply			1456		55 mm
XCVU440-3FLGA2892C	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	316620	1456	1	Grid Array	BGA2892,54X54,40	.97 V	1 mm	85 °C (185 °F)	316620 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2892		4.13 mm	55 mm				1456		55 mm
XCVU440-1HFLGA2892C	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	316620	1456	0.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	85 °C (185 °F)	316620 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2892		4.13 mm	55 mm	Also Operates at 1 V nominal supply			1456		55 mm
XCVU440-2FLGA2892I	Xilinx	FPGA	Industrial	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880	1456	.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)	2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm		e1		1456		55 mm
XCVU440-1HFLGA2892E	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	316620	1456	0.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	100 °C (212 °F)	316620 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2892		4.13 mm	55 mm	Also Operates at 1 V nominal supply			1456		55 mm
XCVU440-2FLGA2892C	Xilinx	FPGA		Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	316620	1456	0.95	Grid Array	BGA2892,54X54,40	.922 V	1 mm	85 °C (185 °F)	316620 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2892		4.13 mm	55 mm				1456		55 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.